Substrate having thin film and method of thin film formation

1. A method of thin film formation, the method comprising:

preparing a substrate;

forming a thin film above the substrate; and

crystallizing the thin film by irradiating the thin film with a light beam,

wherein the crystallizing includes steps of:

(a) crystallizing the thin film in a first region into a first crystalline thin film by irradiating the first region while scanning a first light beam relative to the substrate, the first region including at least one of (i) edge portions of the substrate and (ii) a region through which a cutting line passes when the substrate is cut, the first light beam satisfying a first condition; and

(b) subsequently crystallizing the thin film in a second region into a second crystalline thin film by irradiating at least the second region while scanning a second light beam relative to the substrate, the second region being different from the first region, the second light beam satisfying a second condition different from the first condition, and

the thin film has a higher absorption ratio of the second light beam than an absorption ratio of the second light beam of the first crystalline thin film.

2. The method according to claim 1 ,

wherein in step (b), the first region is also irradiated with the second light beam.

3. The method according to claim 2 ,

wherein in step (b), the first region and the second region are consecutively irradiated with the second light beam.

4. The method according to claim 1 ,

wherein crystal grains in the first crystalline thin film have an average grain size smaller than an average grain size of crystal grains in the second crystalline thin film.

5. The method according to claim 1 ,

wherein crystal grains in the first crystalline thin film have an average grain size of from 10 nm to 40 nm, and

crystal grains in the second crystalline thin film have an average grain size of from 50 nm to 1 μm.

6. The method according to claim 1 , further comprising

after steps (a) and (b), cutting the substrate in a way that the cutting line is in the first region.

7. The method according to claim 1 ,

wherein the substrate prepared in the preparing has one of a microcrack, a chipping, and a notch in a region to be covered with the first region.

8. The method according to claim 1 ,

wherein the edge portions in which the first crystalline thin film is formed comprise only a part of the edge portions that intersects a relative scan direction of the second light beam.

9. The method according to claim 1 ,

wherein the method is included in a method of forming a thin-film transistor on the substrate, and

the second crystalline thin film includes a channel region of the thin-film transistor.

10. The method according to claim 1 ,

wherein the light beam is a continuous-wave laser beam.

11. The method according to claim 10 ,

wherein the laser beam has a wavelength of from 400 nm to 900 nm.

12. The method according to claim 11 ,

wherein the laser beam has a wavelength of 532 nm.

13. The method according to claim 1 ,

wherein the thin film comprises a silicon-containing material.