Method of fabricating substrate for organic light-emitting device
View Patent ↗A substrate for an organic light-emitting device which can improve the light extraction efficiency of an organic light-emitting device while realizing an intended level of transmittance, a method of fabricating the same, and an organic light-emitting device having the same. Light emitted from the OLED is emitted outward through the substrate. The substrate includes a substrate body and a number of crystallized particles disposed inside the substrate body, the number of crystallized particles forming a pattern inside the substrate body.
1. A method of fabricating an organic light-emitting device, comprising:
preparing a photosensitive glass substrate;
disposing a photomask having a light-transmitting pattern over the photosensitive glass substrate;
exposing the photosensitive glass substrate to radiation through the photomask;
heat-treating the photosensitive glass substrate that has been exposed to the radiation, forming a number of crystallized particles in a pattern inside the photosensitive glass substrate; and
disposing the photosensitive glass substrate such that light emitted from an organic light emitting diode is emitted outward through the photosensitive glass substrate.
2. The method according to claim 1 , wherein the photosensitive glass substrate is made of lithium silicate-based glass to which a photosensitive metal is added.
3. The method according to claim 2 , wherein the photosensitive metal comprises at least one of CeO 2 , Al 2 O 3 , Ag and Sb.
4. The method according to claim 1 , wherein an exposure area exposed to the radiation ranges from 50 to 90% of the substrate body.
5. The method according to claim 1 , wherein a particle size of the number of crystallized particles ranges from 10 to 100 nm.
6. The method according to claim 1 , wherein a refractive index of the substrate is 1.65 or greater.
7. The method according to claim 1 , wherein a visible transmittance of the substrate is 50% or higher.
8. The method according to claim 1 , wherein a surface roughness (R RMS ) of the substrate is 1 μm or less.