Methods of manufacturing lighting assembly with thermal overmolding
View Patent ↗One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A method of manufacturing a lighting assembly, the method comprising:
attaching one or more light emitting diodes (LEDs) to a printed circuit board, the attached LEDs being connectable with a power source via circuitry of the printed circuit board; and
insert molding an overmolding material over at least portions of the printed circuit board proximate to the LEDs, the overmolding material having a melting temperature greater than about 100 ° C. and having a thermal conductivity greater than or about 1 W/m·K.
2. The method as set forth in claim 1 , wherein the insert molding comprises:
disposing the printed circuit board with the attached LEDs in a mold;
injecting the overmolding material in melted form into the mold, the melted overmolding material solidifying in the mold to define overmolding secured to at least portions of the printed circuit board proximate to the LEDs; and
after the solidifying, removing from the printed circuit board with the secured thermoplastic overmolding from the mold.
3. The method as set forth in claim 2 , wherein the mold includes isolation regions that receive the LEDs when the printed circuit board with the attached LEDs is disposed in the mold, the isolation regions preventing at least light output apertures of the LEDs from being covered by the overmolding material during the injecting of the overmolding material.
4. The method as set forth in claim 1 , wherein the overmolding material has a thermal conductivity greater than or about 10 W/m·K.
5. The method as set forth in claim 1 , wherein the attaching comprises:
attaching one or more LEDs to a printed circuit board that does not include a metal core.
6. The method as set forth in claim 1 , wherein the attaching comprises:
attaching one or more LEDs to a printed circuit board that includes a metal core.
7. The method as set forth in claim 1 , wherein the insert molding comprises:
insert molding the overmolding material over portions of the printed circuit board proximate to the LEDs without covering the light-emitting apertures of the one or more LEDs with the overmolding material.
8. The method as set forth in claim 7 , wherein the light output apertures of the LEDs include lenses of the LEDs.
9. The method as set forth in claim 7 , wherein the light output apertures of the LEDs include a light transmissive cover disposed over each LED.
10. The method as set forth in claim 1 , wherein the insert molding comprises:
insert molding the overmolding material over both principal sides of the printed circuit board.
11. The method as set forth in claim 10 , wherein the attaching and insert molding are repeated a plurality of times to produce a plurality of light assemblies each comprising one or more LEDs attached to a printed circuit board with a free standing high thermal conductivity material overmolding covering both principal sides of the printed circuit board, the method further comprising:
prior to the insert molding, electrically and mechanically connecting the printed circuit boards of the light assemblies to a flexible electrical cable including a plurality of flexible conductors and insulation surrounding the flexible conductors.
12. The method as set forth in claim 1 , wherein the attaching and insert molding produces the light assembly comprising the one or more LEDs attached to the printed circuit board with a free standing high thermal conductivity material overmolding covering both principal sides of the printed circuit board.
13. The method of claim 1 wherein said overmolding material includes a backside region having an exterior surface at least substantially coplanar with said printed circuit board and configured for mounting to a thermally conductive housing surface.
14. A method comprising:
attaching one or more light emitting diodes (LEDs) to a printed circuit board, the attached LEDs being connectable with a power source via circuitry of the printed circuit board;
disposing the printed circuit board with the attached LEDs in a mold;
injecting overmolding material in melted form into the mold, the melted overmolding material solidifying in the mold to define an overmolding secured to at least portions of the printed circuit board proximate to the LEDs; and
after the solidifying, removing a light assembly from the mold, the light assembly comprising the one or more LEDs attached to the printed circuit board with the overmolding secured to at least portions of the printed circuit board proximate to the LEDs, the overmolding being free standing and having a melting temperature greater than about 100 ° C. and a thermal conductivity greater than or about 1 W/m·K.
15. The method of claim 14 , wherein the attaching, disposing, injecting, and removing are repeated a plurality of times to form a plurality of said light assemblies, and the method further comprises:
prior to the disposing, injecting, and removing, electrically and mechanically connecting the printed circuit boards to a flexible electrical cable including a plurality of flexible conductors and insulation surrounding the flexible conductors.
16. The method of claim 14 wherein said overmolding material includes a backside region having an exterior surface at least substantially coplanar with said printed circuit board and configured for mounting to a thermally conductive housing surface.