Micro inductive sensor
View Patent ↗An inductive sensor includes a sensor package and a coupler package. The sensor package includes a signal processor, an integrated capacitor, a ferrite layer, a transmitter coil, a two part receiving coil, and a plurality of discrete components. The coupler package includes an integrated capacitor, a ferrite layer, and a coupler coil. The transmitter coil in the sensor package is energized by an external power source which in turn energizes the coupler coil in the coupler package. The sensor then measures the rotational position of the coupler package relative to the sensor package by detecting and measuring, with the two part receiving coil, the signal returned by the coupler coil. The signal processor calculates the position of the coupler package relative to the sensor package by comparing the coupling factors between the coupler package and the sensor package.
1. An inductive sensor assembly comprising:
a signal processor;
a sensor package having a top side of the sensor package facing a coupler package and a bottom side of the sensor package opposite the top side;
a ferrite layer disposed between the top side and the bottom side of the sensor package, the ferrite layer having a top surface and an opposite bottom surface, the signal processor is disposed to the bottom surface of the ferrite layer;
a transmitter coil and a two part receiving coil, the transmitting coil having an inner diameter, the two part receiving coil having a first receiving coil and a second receiving coil, the signal processor is disposed within the inner diameter of the transmitting coil; and
the coupler package having a coupler coil, the coupler coil having a plurality of windings;
wherein the first receiving coil has a plurality of first receiving loops wound in a first direction and the second receiving coil has a plurality of second receiving loops wound in a second direction opposite the first direction;
the plurality of first receiving loops are arranged about a central axis of the transmitter coil, each of the plurality of receiving loops having a diameter less than the inner diameter of the transmitting coil.
2. The inductive sensor assembly of claim 1 , further comprising: an integrated capacitor disposed on the bottom surface of the ferrite layer of the sensor package.
3. The inductive sensor assembly of claim 1 , wherein the transmitter coil is generally circular with a plurality of transmitter windings and the two part receiving coil is concentric within an inner diameter of the transmitter coil about a central axis of the transmitter coil on a top side of the sensor package facing the coupler package.
4. The inductive sensor assembly of claim 1 , wherein the two part receiving coil has an equal number of first receiving loops and second receiving loops.
5. The inductive sensor assembly of claim 1 , wherein the first receiving loops are spaced about a transmitter coil axis by 360/N degrees and N is an integer value.
6. The inductive sensor assembly of claim 5 , wherein the second receiving loops are angularly offset from an adjacent first receiving loop about the transmitter coil axis by 180/N degrees, the second receiving loops spaced about the transmitter coil axis by 360/N degrees.
7. The inductive sensor assembly of claim 6 , wherein each first receiving loop is angularly adjacent to two second receiving loops and each second receiving loop is angularly adjacent to two first receiving loops.
8. The inductive sensor assembly of claim 1 , further comprising:
a bottom side of the coupler package facing the sensor package;
a top side of the coupler package opposite the bottom side; and
a ferrite layer having a top surface and a bottom surface and disposed between the top side and the bottom side of the coupler package.
9. The inductive sensor assembly of claim 8 , further comprising:
an integrated capacitor disposed on the top surface of the ferrite layer of the coupler package.
10. The inductive sensor assembly of claim 1 , wherein the coupler coil is generally elliptical, the coupler coil is aligned about a central axis of the transmitter coil on a bottom side of the coupler package facing the sensor package, and the coupler coil overlies at least a portion of both the first receiving loops and the second receiving loops.
11. The inductive sensor assembly of claim 1 , wherein the transmitter coil and two part receiving coil are on a top side of a first printed circuit board and a first ferrite disc is on a bottom side of the first printed circuit board, the coupler coil is on a bottom side of a second printed circuit board and a second ferrite disc is on a top side of the second printed circuit board, and the top side of the first printed circuit board faces the bottom side of the second circuit board.
12. An inductive sensor assembly comprising:
a signal processor;
a sensor package having a top side of the sensor package facing a coupler package and a bottom side of the sensor package opposite the top side, the sensor package having a transmitter coil having an inner diameter, and
a two part receiving coil on a top side of the sensor package and a first ferrite disc on an opposite bottom side of the sensor package, the first ferrite disc having a top surface and an opposite bottom surface, the signal processor is disposed within the inner diameter of the transmitting coil and on the bottom surface of the first ferrite disc; and
the coupler package having a coupler coil on a bottom side of the coupler package, the coupler coil having a plurality of windings, the bottom side of the coupler package facing the top side of the sensor package;
wherein a first receiving coil of the two part receiving coil has a plurality of first receiving loops wound in a first direction and a second receiving coil of the two part receiving coil has a plurality of second receiving loops wound in a second direction opposite the first direction;
the plurality of first receiving loops are arranged about a central axis of the transmitter coil, each of the plurality of receiving loops having a diameter less than the inner diameter of the transmitting coil.
13. The inductive sensor assembly of claim 12 , wherein the transmitter coil and two part receiving coil are on a top side of a first printed circuit board and the first ferrite disc is on a bottom side of the first printed circuit board,
the coupler coil is on a bottom side of a second printed circuit board and the second ferrite disc is on a top side of the second printed circuit board, and
the top side of the first printed circuit board faces the bottom side of the second circuit board.
14. The inductive sensor assembly of claim 12 , further comprising:
a first integrated capacitor disposed on the bottom surface of the first ferrite disc of the sensor package;
a second ferrite disc on a top side of the coupler package; and
a second integrated capacitor disposed on a top side of the second ferrite disc of the coupler package.
15. The inductive sensor assembly of claim 12 , wherein the transmitter coil is generally circular with a plurality of transmitter windings and the two part receiving coil is concentric within an inner diameter of the transmitter coil about a central axis of the transmitter coil on the top side of the sensor package.
16. The inductive sensor assembly of claim 12 , wherein the two part receiving coil has an equal number of first receiving loops and second receiving loops.
17. The inductive sensor assembly of claim 12 , wherein the first receiving loops are spaced about a transmitter coil axis by 360/N degrees and N is an integer value.
18. The inductive sensor assembly of claim 17 , wherein the second receiving loops are angularly offset from an adjacent first receiving loop about the transmitter coil axis by 180/N degrees, the second receiving loops spaced about the transmitter coil axis by 360/N degrees.
19. The inductive sensor assembly of claim 18 , wherein each first receiving loop is angularly adjacent to two second receiving loops and each second receiving loop is angularly adjacent to two first receiving loops.