Adhesive/sealing material for an electrowetting device
Subject matter disclosed herein relates to improving a contact diameter of an adhesive/sealing material on surfaces of substrates by altering rheological properties of the adhesive/sealing material. An electrowetting display device comprises a first substrate and a second substrate, a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid. An adhesive/sealing material comprising UV curable epoxy glue is in contact with the second fluid and couples the second substrate to the first substrate. The adhesive/sealing material further comprises silica particles in a range of 1-6% mass fraction of silica that alter rheological properties of the UV curable epoxy glue.
1. An electrowetting display device comprising:
a first substrate;
a hydrophobic surface on the first substrate;
an electrowetting oil on the hydrophobic surface and a fluid that includes an electrolyte on the electrowetting oil;
an electrode under the hydrophobic surface;
a thin film transistor coupled to the electrode and a voltage source;
a second substrate; and
an ultraviolet (UV) curable epoxy glue in contact with the fluid and configured to couple the second substrate to the first substrate, wherein the UV curable epoxy glue comprises silica particles in a range of 1-6% mass fraction of silica, wherein the silica particles introduce a yield stress into the UV curable epoxy glue such that the UV curable epoxy glue minimally deforms when in contact with the second fluid.
2. The electrowetting device of claim 1 , wherein the silica particles are hydrophobic silica particles.
3. The electrowetting device of claim 1 , wherein the silica particles are hydrophilic silica particles.
4. The electrowetting device of claim 1 , wherein the silica particles have a size in a range of 7-40 nanometers.
5. An electrowetting display device comprising:
a first substrate and a second substrate;
a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid; and
an adhesive/sealing material in contact with the first substrate and the second fluid, wherein the adhesive/sealing material couples the second substrate to the first substrate, and wherein the adhesive/sealing material comprises particles that alter rheological properties of the adhesive/sealing material, the particles comprising at least one of (i) silica particles in a range of 1-6% mass fraction silica, (ii) clay particles in a range of 1-6% mass fraction of clay particles or (iii) ceramic particles in a range of 1-6% mass fraction of ceramic particles.
6. The electrowetting device of claim 5 , wherein the adhesive/sealing material includes hydrophobic silica particles.
7. The electrowetting device of claim 5 , wherein the adhesive/sealing material includes hydrophilic silica particles.
8. The electrowetting device of claim 5 , wherein the adhesive/sealing material includes silica particles having a size in a range of 7-40 nanometers.
9. The electrowetting device of claim 5 , wherein the adhesive/sealing material includes one or more of (i) clay particles having a size in a range of 7-40 nanometers or (ii) ceramic particles having a size in a range of 7-40 nanometers.