SOLVENT RECOVERY
This invention relates to compositions for, and methods of, delivering treatment compounds to lignocellulosic substrates, wherein the solvent is recovered using RF energy.
1 - 20 . (canceled)
21 . An organic substrate treatment composition including:
at least one organic substrate treatment compound;
an organic substrate treatment solvent having a low dielectric loss; and
a dielectric loss enhancing additive.
22 . The organic substrate treatment composition of claim 21 wherein the organic substrate treatment solvent having a low dielectric loss is a Stoddard solvent.
23 . The organic substrate treatment composition of claim 21 wherein the organic substrate treatment solvent having a tow dielectric loss is a chlorinated hydrocarbon solvent.
24 . The organic substrate treatment composition of claim 21 wherein the organic substrate treatment solvent having a low dielectric loss is a low molecular weight aliphatic hydrocarbon solvent.
25 . The organic substrate treatment composition of claim 21 wherein the organic substrate treatment solvent having a low dielectric loss is a combination of two or more selected from the group consisting of Stoddard solvent, chlorinated hydrocarbon solvent and low molecular weight aliphatic hydrocarbon solvent.
26 . The organic substrate treatment composition of claim 21 wherein the organic substrate is lignocellulosic.
27 . The organic substrate treatment composition of claim 26 wherein the lignocellulosic substrate is lumber.
28 . The organic substrate treatment composition of claim 21 wherein the loss tangent of the dielectric loss enhancing additive is greater than 0.1 when exposed to RF energy using a frequency of 2.45 GHz.
29 . The organic substrate treatment composition of claim 21 wherein the loss tangent of the organic substrate treatment solvent having a low dielectric loss is less than 0.05 when exposed to RF energy using a frequency of 2.45 GHz.
30 . The organic substrate treatment composition of claim 21 wherein the dielectric constant of the dielectric loss enhancing additive is 0.5 or more greater than the dielectric constant of the organic substrate treatment solvent having a low dielectric loss.
31 - 38 . (canceled)
39 . The organic substrate treatment composition of claim 21 wherein the dielectric loss enhancing additive is in the form of a single homogeneous phase.
40 . (canceled)
41 . The organic substrate treatment composition of claim 21 wherein the dielectric loss enhancing additive includes a second heterogeneous phase.
42 - 45 . (canceled)
46 . The organic substrate treatment composition of claim 21 wherein the dielectric loss enhancing additive has at least one heterogeneous phase and the dielectric loss enhancing additive includes surfactants and/or dispersants.
47 - 55 . (canceled)
56 . The organic substrate treatment composition of claim 21 wherein the organic substrate treatment solvent having a low dielectric loss is in the form of a single homogenous phase.
57 - 58 . (canceled)
59 . The organic substrate treatment composition of claim 21 wherein the organic substrate treatment solvent having a low dielectric loss includes a second heterogeneous phase.
60 . The organic substrate treatment composition of claim 59 wherein the organic substrate treatment solvent having a low dielectric loss includes a second heterogeneous phase and the substrate treatment compound or compounds can exist in either or both phases.
61 . The organic substrate treatment composition of claim 60 wherein the organic substrate treatment solvent having a low dielectric loss includes a second heterogeneous phase and the organic substrate treatment compound(s) exist as a solution.
62 . The organic substrate treatment composition of claim 60 wherein the organic substrate treatment solvent having a low dielectric loss includes a second heterogeneous phase and the organic substrate treatment compound(s) exist as an emulsion.
63 . The organic substrate treatment composition of claim 60 wherein the organic substrate treatment solvent having a low dielectric loss includes a second heterogeneous phase and the organic substrate treatment compound(s) exist as a dispersion of sub-micron particles or sub-micron encapsulated particles.
64 . The organic substrate treatment composition of claim 21 wherein the substrate is substantially dry lumber that is at or below fibre saturation.
65 - 93 . (canceled)