Method for etching high-K dielectric using pulsed bias power
A method of patterning a gate stack on a substrate is described. The method includes preparing a gate stack on a substrate, wherein the gate stack includes a high-k layer and a gate layer formed on the high-k layer. The method further includes transferring a pattern formed in the gate layer to the high-k layer using a pulsed bias plasma etching process, and selecting a process condition for the pulsed bias plasma etching process to achieve a silicon recess formed in the substrate having a depth less than 2 nanometer (nm).
1. A method of pattern etching a high-k layer on a substrate, comprising:
disposing a substrate in a plasma processing system; and
transferring a pattern to said high-k layer on said substrate using a pulsed bias plasma etching process, said pulsed bias plasma etching process comprising:
introducing a process gas composition to said plasma processing system, said process composition including a halogen-containing etching compound and a polymerizing passivation compound,
igniting plasma using a surface wave plasma source,
electrically biasing a substrate holder that supports said substrate with radio frequency (RF) power, and
pulsing said RF power for said electrical biasing.
2. The method of claim 1 , further comprising:
selecting a process condition for said pulsed bias plasma etching and controlling a profile of said pattern transferred to said high-k layer, said process condition including setting a pulse amplitude, a pulse frequency, a pulse duty cycle, or a pulse waveform, or any combination thereof.
3. The method of claim 1 , wherein said pulsing of RF power for the electrical biasing comprises pulsing the RF power between an off-state and an on-state.
4. The method of claim 1 , wherein said halogen-containing etching compound comprises a halide or a halomethane.
5. The method of claim 1 , wherein said halogen-containing etching compound comprises Cl 2 , Br 2 , or F 2 , or any combination of two or more thereof.
6. The method of claim 1 , wherein said polymerizing passivation compound includes at least one of C 2 H 4 , CH 4 , C 2 H 2 , C 2 H 6 , C 3 H 4 , C 3 H 6 , C 3 H 8 , C 4 H 6 , C 4 H 8 , C 4 H 10 , C 5 H 8 , C 5 H 10 , C 6 H 6 , C 6 H 10 , and C 6 H 12 .
7. The method of claim 1 , wherein said process composition comprises a noble gas.
8. The method of claim 1 , wherein said halogen-containing etching compound and said polymerizing passivation compound of said process composition are each continuously and concurrently flowed into said plasma processing system during said pulsing.
9. The method of claim 8 , wherein said pulsing said RF power for said electrical biasing further comprises:
pulsing said RF power at a first RF power level for a first time duration;
pulsing said RF power at a second RF power level for a second time duration, wherein said second RF power level is less than said first RF power level, and said second time duration follows said first time duration; and
terminating said pulsing said RF power for a third time duration, said third time duration following said second time duration.
10. The method of claim 1 , wherein said polymerizing passivation compound is pulsed into said plasma processing system during said pulsing said RF power while said halogen-containing etching compound is continuously flowed.
11. The method of claim 10 , wherein said pulsed flow of said polymerizing passivation compound is out-of-phase with said pulsing said RF power.
12. The method of claim 10 , further comprising:
adjusting at least one property of said pulsing said RF power, said at least one property including a pulse phase difference between said pulsing of said RF power and said pulsing said polymerizing passivation compound.
13. The method of claim 10 , wherein said pulsed flow of said polymerizing passivation compound is in-phase with said pulsing said RF power.
14. The method of claim 1 , wherein said pulsing said RF power for said electrical biasing further comprises:
pulsing said RF power at a first RF power level for a first time duration; and
pulsing said RF power at a second RF power level for a second time duration, wherein said second RF power level is less than said first RF power level, and said second time duration follows said first time duration.
15. The method of claim 14 , wherein said pulsing said RF power for said electrical biasing further comprises:
pulsing said RF power at a third RF power level for a third time duration, wherein said third RF power level is less than said second RF power level, and said third time duration follows said second time duration.
16. The method of claim 14 , wherein said pulsing said RF power for said electrical biasing further comprises:
decreasing a RF power level for said pulsing said RF power.
17. The method of claim 1 , wherein said surface wave plasma source comprises a slot antenna.
18. The method of claim 1 , wherein said surface wave plasma source comprises a radial line slotted antenna.
19. The method of claim 18 , wherein said radial line slotted antenna comprises couples microwave power from a microwave generator to said plasma.
20. A method of pattern etching a high-k layer on a substrate, comprising:
disposing a substrate in a plasma processing system; and
transferring a pattern to said high-k layer on said substrate using a pulsed bias plasma etching process, said pulsed bias plasma etching process comprising:
introducing a process gas composition to said plasma processing system, said process composition including a halogen-containing etching compound and a hydrocarbon passivation compound selected from the group consisting of C 2 H 4 , CH 4 , C 2 H 2 , C 2 H 6 , C 3 H 4 , C 3 H 6 , C 3 H 8 , C 4 H 6 , C 4 H 8 , C 4 H 10 , C 5 H 8 , C 5 H 10 , C 6 H 6 , C 6 H 10 , and C 6 H 12 ,
igniting plasma using a surface wave plasma source,
electrically biasing a substrate holder that supports said substrate with radio frequency (RF) power, and
pulsing said RF power for said electrical biasing, wherein said hydrocarbon passivation compound is pulsed into said plasma processing system during said pulsing said RF power while said halogen-containing etching compound is continuously flowed, and decreasing a RF power level for said pulsing said RF power during said electrically biasing before said pattern is transferred fully through said high-k layer.