Wiring substrate and manufacturing method thereof

1. A wiring substrate comprising:

a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components;

a window section formed in the substrate;

and a connection terminal extended from and protruding within an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate, the inside surface portion being perpendicular to the front and rear surface of the substrate, a portion of the connection terminal protruding within the inside surface portion being completely surrounded by the substrate,

wherein the window section has a predetermined height in the direction perpendicular to the surface of the substrate,

wherein the portion of the connection terminal protrudes from the window section at a position which is substantially at a center of the predetermined height,

wherein the window section is a continuous opening, throughout the substrate, from the front surface to the rear surface, and

wherein the window section is formed entirely within the substrate such that all sides of the window section are surrounded by a portion of the substrate extending from the front surface to the rear surface at the predetermined height.

2. The wiring substrate according to claim 1 , wherein the substrate includes a metal core substrate in which insulation layers are formed on the front and rear of a metal core which is the high thermal conductive layer.

3. The wiring substrate according to claim 1 , wherein a bending portion of the connection terminal is a curved section which bends in an arc shape when seen from a side surface thereof.

4. The wiring substrate according to claim 1 , wherein a plurality of the connection terminals are installed in the inside surface portion of the window section in a longitudinal direction, and at least two connection terminals of the plurality of the connection terminals are electrically connected with each other inside the substrate.

5. The wiring substrate according to claim 1 , wherein the high thermal conductive layer and the connection terminal are formed in the same layer.

6. The wiring substrate according to claim 1 , wherein the connection terminal is connected to another wiring substrate which is installed in parallel at an interval with respect to the substrate.