Semiconductor device
Provided is a semiconductor device including a transistor having excellent electrical characteristics (e.g., on-state current, field-effect mobility, or frequency characteristics) or a semiconductor device including a transistor with high reliability. In the channel width direction of a channel-etched transistor in which an oxide semiconductor film is between first and second gate electrodes, the first and second gate electrodes are connected to each other through an opening portion in first and second gate insulating films. In addition, the first and second gate electrodes surround the oxide semiconductor film in a cross-section in the channel width direction, with the first gate insulating film provided between the first gate electrode and the oxide semiconductor film and the second gate insulating film provided between the second gate electrode and the oxide semiconductor film. Furthermore, the channel length of the transistor is 0.5 μm or longer and 6.5 μm or shorter.
1. A semiconductor device comprising:
a first gate electrode;
a first gate insulating film over the first gate electrode;
an oxide semiconductor film over the first gate insulating film;
a second gate insulating film over the oxide semiconductor film;
a second gate electrode over the second gate insulating film; and
a source electrode and a drain electrode electrically connected to the oxide semiconductor film,
wherein a first opening portion is provided in the first gate insulating film and the second gate insulating film,
wherein a second opening portion is provided in the first gate insulating film and the second gate insulating film,
wherein the oxide semiconductor film is positioned between the first opening portion and the second opening portion, and
wherein the first gate electrode and the second gate electrode are electrically connected to each other through the first opening portion and the second opening portion.
2. The semiconductor device according to claim 1 ,
wherein the source electrode and the drain electrode are over the oxide semiconductor film, and
wherein the second gate insulating film is over the source electrode and the drain electrode.
3. The semiconductor device according to claim 2 , wherein the second gate insulating film is in contact with the oxide semiconductor film.
4. The semiconductor device according to claim 1 , wherein a whole of the oxide semiconductor film overlaps the first gate electrode.
5. The semiconductor device according to claim 1 ,
wherein the first gate insulating film comprises a first oxide insulating film and a first nitride insulating film,
wherein the second gate insulating film comprises a second oxide insulating film and a second nitride insulating film, and
wherein the first nitride insulating film is in contact with the second nitride insulating film.
6. The semiconductor device according to claim 1 ,
wherein the oxide semiconductor film comprises a crystal region, and
wherein a c-axis of a crystal in the crystal region is aligned in a direction parallel to a normal vector of a top surface of the oxide semiconductor film.
7. The semiconductor device according to claim 1 , wherein the second gate electrode has a light-transmitting property.
8. The semiconductor device according to claim 1 ,
wherein the oxide semiconductor film comprises a channel region, and
wherein a channel length of the channel region is greater than or equal to 0.5 μm and less than or equal to 6.5 μm.