Integrated optical cooling core for optoelectronic interconnect modules
View Patent ↗An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.
1. Apparatus, comprising:
one or more optoelectronic transducers, which are configured to convert between optical signals conveyed over optical fibers and respective electrical signals;
driving circuitry, which is configured to process the electrical signals;
one or more cooling elements, which are configured to remove heat that is produced at least by the driving circuitry; and
a light coupling module, which is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and which additionally serves as a baseplate for first and second different configurations of the cooling elements having different first and second heat removal capabilities.
2. The apparatus according to claim 1 , wherein the light coupling module comprises multiple optical coupling elements, each positioned between an end of an optical fiber and a respective optoelectronic transducer.
3. The apparatus according to claim 2 , wherein the optical coupling elements comprise at least one element type selected from a group of types consisting of a lens and a prism.
4. The apparatus according to claim 2 , wherein the light coupling module, including the optical coupling elements, is formed of a single monolithic substrate material.
5. The apparatus according to claim 2 , wherein the light coupling module is formed of a monolithic substrate material, and wherein the optical coupling elements are inserted into the light coupling module.
6. The apparatus according to claim 1 , wherein the cooling elements comprise a thermoelectric cooler (TEC) that is coupled to one or more of the optoelectronic transducers.
7. The apparatus according to claim 6 , and comprising a thermally-conductive layer connecting the TEC to the one or more of the optoelectronic transducers.
8. The apparatus according to claim 1 , wherein the cooling elements are fitted to the light coupling module during molding of the light coupling module.
9. A method, comprising:
providing one or more optoelectronic transducers, for converting between optical signals conveyed over optical fibers and respective electrical signals, and driving circuitry, for processing the electrical signals;
providing one or more cooling elements, for removing heat that is produced at least by the driving circuitry; and
integrating the optoelectronic transducers and the cooling elements with a light coupling module, such that the light coupling module couples the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for first and second different configurations of the cooling elements having different first and second heat removal capabilities.
10. The method according to claim 9 , wherein the light coupling module comprises multiple optical coupling elements, and wherein integrating the optoelectronic transducers with the light coupling module comprises positioning the optical coupling elements between ends of the optical fibers and the respective optoelectronic transducers.
11. The method according to claim 10 , wherein the optical coupling elements comprise at least one element type selected from a group of types consisting of a lens and a prism.
12. The method according to claim 10 , and comprising forming the light coupling module, including the optical coupling elements, of a single monolithic substrate material.
13. The method according to claim 10 , and comprising forming the light coupling module of a monolithic substrate material, and inserting the optical coupling elements into the light coupling module.
14. The method according to claim 9 , wherein integrating the cooling elements comprises coupling a thermoelectric cooler (TEC) to one or more of the optoelectronic transducers.
15. The method according to claim 14 , wherein coupling the TEC comprises connecting the TEC to the one or more of the optoelectronic transducers with a thermally-conductive layer.
16. The method according to claim 9 , wherein integrating the cooling elements with the light coupling module comprises fitting the cooling elements to the light coupling module during molding of the light coupling module.