Integration of electronic chips onto a photonic chip
View Patent ↗Methods, structures, apparatus, devices, and materials to facilitate the integration of electronic integrated circuits (chips) including drivers, amplifiers, microcontrollers, etc., onto/into photonic integrated circuits (chips) using recessed windows exhibiting controlled depths onto/into the photonic chip. The electronic chips are positioned into the recessed windows and electrical connections between the electronic chips and the photonic chip are achieved by flip-chip techniques with predefined traces at a bottom of the recessed windows or direct wire bonding. Advantageously, this integration may be performed on a wafer level for large-volume productions.
1. A method of integrating an electronic chip onto a photonic chip comprising:
recessing a window into a surface of the photonic chip, said window exhibiting a size and a thickness matching the electronic chip;
positioning the electronic chip into the window such that a top surface of the electronic chip is substantially coplanar with a top surface of the photonic chip; and
electrically connecting and mechanically securing the electronic chip to the photonic chip.
2. The method of claim 1 further comprising forming a metallization layer at a bottom of the window.
3. The method of claim 1 , wherein:
recessing a window into the surface of the photonic chip comprises etching the window into the surface of the photonic chip.
4. The method of claim 3 , wherein electrically connecting the electronic chip to the photonic chip comprises placing a wire bond between the top surface of the electronic chip and the photonic chip.
5. The method of claim 4 , wherein electrically connecting the electronic chip to the photonic chip comprises electrically connecting a bottom surface of the electronic chip opposite the top surface of the electronic chip to an adjacent surface of the window.
6. The method of claim 3 , wherein electrically connecting the electronic chip to the photonic chip comprises electrically connecting a bottom surface of the electronic chip opposite the top surface of the electronic chip to an adjacent surface of the window.
7. The method of claim 3 , wherein positioning the electronic chip into the window comprises positioning an edge of the electronic chip within 200 microns of a facing edge of the photonic chip.
8. The method of claim 3 , wherein positioning the electronic chip into the window comprises positioning the electronic chip into the window when the photonic chip forms part of a photonic wafer.
9. The method of claim 3 , wherein the window is a first window and the electronic chip is a first electronic chip, and wherein the method further comprises etching a second window into the surface of a photonic chip such that the first and second windows are separated by a plateau region of the photonic chip, the method further comprising positioning the second electronic chip into the second window.
10. The method of claim 3 , wherein electrically connecting the electronic chip to the photonic chip comprises electrically grounding a surface of the electronic chip adjacent a bottom surface of the window.
11. The method of claim 3 , further comprising forming a metal layer on a bottom surface of the window, and wherein electrically connecting the electronic chip to the photonic chip comprises electrically connecting the electronic chip to the metal layer.
12. The method of claim 3 , further comprising forming conductive traces on a bottom surface of the window, and wherein electrically connecting the electronic chip to the photonic chip comprises electrically connecting the conductive traces to the electronic chip.
13. The method of claim 3 , further comprising depositing metal over sidewalls of the window.
14. A method of integrating an electronic chip onto a photonic chip comprising the steps of:
fabricating a window into the surface of the photonic chip, said window exhibiting a size and a thickness matching the electronic chip;
forming electrical wire traces at the bottom of the window such that the photonic chip and the electronic chip are electrically connected when the electronic chip is positioned into the window and mechanical contact to the electrical traces is made by such positioning;
positioning the electronic chip into the window such that the top surface of the electronic chip is substantially coplanar with the top surface of the photonic chip; and
electrically connecting and mechanically securing the electronic chip to the photonic chip.
15. The method of claim 14 wherein said electronic chip is positioned upside-down in the window.
16. The method of claim 14 , wherein fabricating the window into the surface of the photonic chip comprises recessing the window into the surface of the photonic chip.