Lightweight server chassis configured for modular insertion of customer selectable components for downstream assembly of information handling system at customer locations
View Patent ↗An information handling system (IHS) includes a lightweight server chassis having a surface that includes a plurality of slots formed within the chassis surface. Each slot is sized to receive a specific compute component of a plurality of different compute components that collectively provide a fully functional IHS. In one embodiment, at least one slot that is formed within the chassis surface is sized to receive a respective one of the more than one type of compute component of a plurality of different compute components. Thereby, an original equipment manufacturer (OEM) can flexibly ship at least portions of the IHS to an end user destination for possible downstream reconfiguration and assembly.
1. A lightweight server (LWS) chassis comprising:
a base panel molded from a pliable, lightweight material and having a chassis surface that includes molded receptacles that define engageable surfaces of a plurality of slots formed within the chassis surface, each slot configured and sized to support modular insertion of an end user selectable compute component from among a plurality of different end user selectable compute components that are insertable into respective slots of the LWS chassis, the LWS chassis manufactured and shipped separately from the end user selectable compute components, including processing components, to enable downstream provisioning and assembly of a fully functional information handling system (IHS) at an end user location using the separately shipped LWS chassis and one or more of the end user selectable compute components;
a casing having a removable portion which, when removed after shipping of the LWS chassis, enables exterior access to the chassis surface and to one or more modular, functional compute components placed on the chassis surface prior to shipping and enables access to insert one or more end user selectable compute components after shipping, wherein the base panel can be slideably inserted into an open end of the casing when the casing has been assembled; and
at least one impact absorbent material pad attached to an interior surface of the casing, the impact absorbent material pad serving as void fill to firmly hold in place the modular, functional compute components during shipping;
wherein the molded receptacles of the LWS chassis are sized to selectively receive more than one type of compute component, providing configurability at a customer location, after the LWS chassis is shipped, wherein the LWS chassis is configured to enable an end user to insert the end user selected compute components and complete interconnections at the customer location in order to configure the functional IHS that meets end user requirements.
2. The LWS chassis of claim 1 , wherein the pliable, lightweight material comprises biodegradable material.
3. The LWS chassis of claim 1 , further comprising rack engagement features for the LWS chassis to be mounted within a rack at an end user location following shipping of the LWS chassis.
4. The LWS chassis of claim 1 , wherein each slot comprises a molded receptacle to engageably receive a selected specific compute component, wherein the compute components are themselves configured to fit within one or more of the slots in the surface of the LWS chassis, wherein the fully functional IHS is provided when the end user selectable compute components are (i) inserted into the LWS chassis in their respective slots after the LWS chassis is shipped to the end user, (ii) communicatively interconnected in the LWS chassis via required communication and power cabling, and (iii) provided with required power to operate.
5. The LWS chassis of claim 1 , further comprising a chassis cover that is shipped along with or separately from the base panel of the LWS chassis and fits on top of the base panel to enclose the compute components.
6. The LWS chassis of claim 5 , wherein:
the base panel comprises lateral sides;
the chassis cover comprises lateral flanged edges to contact a top surface of the lateral sides; and
the LWS chassis comprises respective male and female contacting features to align and engage the chassis cover to the base panel.
7. The LWS chassis of claim 5 , wherein the base panel and the chassis cover opposingly contact an inserted modular, functional compute component to retain the inserted modular, functional compute component in a corresponding slot and prevent dislodging of the compute component if the LWS chassis is impacted.
8. The LWS chassis of claim 5 , wherein the chassis cover comprises at least one air flow baffle for directing air flow past a selected compute component within the chassis.
9. The LWS chassis of claim 1 , further comprising a lightweight, impact absorbent material.
10. The LWS chassis of claim 1 , wherein the LWS chassis provides structural rigidity to maintain shape during shipping and during functional use after shipping and assembly.
11. The LWS of claim 1 , further comprising material incorporated into the LWS chassis that can withstand static weight loads, expected moisture exposure, expected temperature range exposure, expected vibration, and impact loads.
12. The LWS chassis of claim 1 , wherein the plurality of slots are sized to selectively receive more than one type of user selectable compute component, thereby providing configurability at the customer location at which the IHS is assembled.
13. The LWS chassis of claim 1 , wherein the pliable material comprises at least one of a thermoplastic or an epoxy resin.
14. The LWS chassis of claim 1 , wherein, at least one of a textile fabric or a biodegradable matrix is embedded into the pliable material to create a biodegradable material.
15. The LWS chassis of claim 1 , wherein the pliable material is a cellulose-based product that is molded and cured into a structurally rigid shape.
16. The LWS chassis of claim 1 , wherein the casing comprises removable portions defined by one or more perforated segments that can be removed to leave apertures that enable exterior access to components inside of the casing.
17. The LWS chassis of claim 1 , further comprising:
shielding material for shielding a user from electromagnetic interference (EMI) generated by the modular, functional compute components and for shielding the modular functional computer components from electrostatic damage; and
a coating comprising a flame retardant and a heat resistant material, wherein the LWS chassis is selectively coated with a material that is flame retardant and heat resistant to mitigate hazards from compute components that can reach high temperatures.
18. An information handling system (IHS) comprising:
a lightweight server (LWS) chassis having a chassis surface that includes a plurality of slots formed within the chassis surface, each slot configured and sized to support modular insertion of a compute component from among a plurality of different compute components that are insertable into respective slots of the LWS chassis for downstream provisioning and assembly of a fully functional IHS using the LWS chassis and end user selectable compute components;
a casing having a removable portion which, when removed after shipping of the LWS chassis, enables exterior access to the chassis surface and to one or more modular, functional compute components placed on the chassis surface prior to shipping and enables access to insert one or more end user selectable compute components after shipping, wherein a base panel of the LWS chassis can be slideably inserted into an open end of the casing when the casing has been assembled;
at least one impact absorbent material pad attached to an interior surface of the casing, the impact absorbent material pad serving as void fill to firmly hold in place the modular, functional compute components during shipping;
at least two compute components inserted into respective slots of the LWS chassis; and
one or more connecting cabling interconnecting the at least two compute components.
19. The IHS of claim 18 , wherein:
the LWS chassis is molded from a pliable material; and
each slot comprises a molded receptacle to engageably receive a selected functional compute component.
20. The IHS of claim 18 , further comprising a rack, wherein the LWS chassis comprises rack engagement features for the LWS chassis to be mounted within the rack.
21. The IHS of claim 18 , wherein:
the LWS chassis comprises a chassis cover that fits on top of the base panel to enclose the compute components; and
the LWS chassis comprises biodegradable material and shielding material for shielding a user from electromagnetic interference (EMI) generated by the modular, functional compute components and shielding the modular functional computer components from electrostatic damage.
22. The IHS of claim 18 , wherein:
the base panel has lateral sides;
the LWS chassis comprises a chassis cover lateral flanged edges and that fits on top of the base panel along a top surface of the lateral sides to enclose the compute components;
the LWS chassis comprises respective male and female contacting features to align and engage the chassis cover to the base panel;
the base panel and the chassis cover opposingly contact an inserted modular, functional compute component to retain the inserted modular, functional compute component in a corresponding slot and prevent dislodging of the compute component if the LWS chassis is impacted;
the chassis cover comprises at least one air flow baffle for directing air flow past a selected functional compute component within the LWS chassis; and
the LWS chassis comprises a lightweight, impact absorbent material.
23. A method of provisioning a lightweight server (LWS) chassis for modular insertion of compute components for downstream assembly of an information handling system (IHS), the method comprising:
forming a LWS chassis having a base panel and a chassis surface that includes a plurality of slots formed within the chassis surface and each sized for modular insertion of a customer selectable specific compute component of a plurality of different compute components for downstream assembly of a fully functional IHS; and
providing a casing having a removable portion which, when removed after shipping of the LWS chassis, enables exterior access to the chassis surface and to one or more modular, functional compute components placed on the chassis surface prior to shipping and enables access to insert one or more customer selectable compute components after shipping, wherein the base panel of the LWS chassis can be slideably inserted into an open end of the casing when the casing has been assembled, the casing having at least one impact absorbent material pad attached to an interior surface of the casing, the impact absorbent material pad serving as void fill to firmly hold in place the modular, functional compute components during shipping.
24. The method of claim 23 , further comprising:
interconnecting compute components in the LWS chassis via one or more connecting cables; and
applying power to a power component within the LWS chassis to enable the compute components to collectively function as the fully functional IHS.
25. The method of claim 23 , wherein forming the LWS chassis further comprises molding the LWS chassis and the plurality of slots from a pliable, biodegradable material.
26. The method of claim 23 , wherein forming the LWS chassis further comprises providing rack engagement features for the LWS chassis to be mounted within a rack.
27. The method of claim 23 , wherein forming the LWS chassis further comprises:
molding the base panel in which the compute components are inserted;
configuring a chassis cover that fits on top of the base panel to enclose the compute components; and
contouring an inner surface of the chassis cover to form at least one air flow baffle for directing air flow past a selected functional compute component within the LWS chassis.
28. The method of claim 27 , wherein forming the LWS chassis comprises incorporating shielding material for shielding a user from electromagnetic interference (EMI) generated by the modular, functional compute components and for shielding the modular functional computer components from electrostatic damage.
29. The method of claim 27 , further comprising molding at least the base panel using a lightweight, impact absorbent material and configuring the chassis cover to provide opposing contact for an inserted modular, functional compute component by the base panel and the chassis cover to prevent dislodging of the inserted modular, functional compute component in the corresponding slot if the LWS chassis is impacted.