Device components with surface-embedded additives and related manufacturing methods
Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
1. A device with surface-embedded metallic nanowires, comprising:
a first layer;
a second layer; and
an interlayer disposed between the first layer and the second layer, wherein the interlayer includes:
a polymeric film; and
metallic nanowires at least partially embedded into the polymeric film and localized within an embedding region of the polymeric film, wherein a thickness of the embedding region is less than an overall thickness of the polymeric film, and a remainder of the polymeric film is devoid of any metallic nanowire.
2. The device of claim 1 , wherein the thickness of the embedding region is no greater than 50% of the overall thickness of the polymeric film.
3. The device of claim 1 , wherein the thickness of the embedding region is no greater than 30% of the overall thickness of the polymeric film.
4. The device of claim 1 , wherein the metallic nanowires include silver nanowires.
5. The device of claim 1 , wherein at least one of the metallic nanowires partially extends out from a surface of the polymeric film.
6. The device of claim 1 , wherein at least one of the metallic nanowires is fully embedded below a surface of the polymeric film.
7. The device of claim 1 , wherein the metallic nanowires are patterned to form an array of interconnects.
8. The device of claim 7 , further comprising a metallization that is electrically connected to at least one of the interconnects.
9. The device of claim 1 , wherein a loading of the metallic nanowires in the polymeric film is above an electrical percolation threshold.
10. The device of claim 1 , wherein the interlayer has a sheet resistance that is no greater than 200 Ω/sq.
11. The device of claim 1 , wherein the interlayer has a sheet resistance that is no greater than 100 Ω/sq.
12. The device of claim 1 , wherein the interlayer has a light transmittance that is at least 85%.
13. The device of claim 1 , wherein the interlayer has a light transmittance that is at least 90%.
14. The device of claim 1 , wherein the device is a touch module, and the interlayer is a transparent conducting electrode.
15. The device of claim 1 , further comprising a display device, and the first layer, the interlayer, and the second layer are coupled to the display device.
16. The device of claim 15 , wherein the display device is selected from a flat panel display, a liquid crystal display, a plasma display, an organic light-emitting diode display, a quantum dot display, and a flexible display.
17. The device of claim 1 , wherein the interlayer and the metallic nanowires correspond to a first interlayer and first metallic nanowires, respectively, and further comprising:
a second interlayer disposed between the first interlayer and the second layer, wherein the second interlayer includes:
a host material; and
second metallic nanowires at least partially embedded into the host material.
18. The device of claim 1 , wherein the metallic nanowires are at least partially embedded into the polymeric film in a grid pattern.
19. The device of claim 1 , wherein the polymeric film is a film of a thermoplastic polymer.
20. The device of claim 1 , wherein the polymeric film is a film of a polymer selected from a polycarbonate and an acrylic polymer.
21. A device with surface-embedded metallic nanowires, comprising:
a first layer;
a display device;
a second layer disposed between the first layer and the display device; and
metallic nanowires at least partially embedded into the second layer.
22. The device of claim 21 , wherein the metallic nanowires are localized within an embedding region of the second layer, such that a remainder of the second layer is devoid of any metallic nanowire.
23. The device of claim 22 , wherein a thickness of the embedding region is less than an overall thickness of the second layer.
24. The device of claim 22 , wherein a thickness of the embedding region is no greater than 50% of an overall thickness of the second layer.
25. The device of claim 21 , wherein the metallic nanowires include silver nanowires having an average diameter in the range of 1 nm to 100 nm and an average length in the range of 500 nm to 50 μm.
26. The device of claim 21 , wherein at least one of the metallic nanowires extends out from the second layer to an extent from 1 nm to 50 nm.
27. The device of claim 21 , wherein the metallic nanowires are at least partially embedded into the second layer in a pattern to form an array of interconnects.
28. The device of claim 21 , wherein the first layer is a cover lens.
29. The device of claim 21 , wherein the second layer is a polymeric film.
30. The device of claim 21 , wherein the display device is selected from a flat panel display, a liquid crystal display, a plasma display, an organic light-emitting diode display, a quantum dot display, and a flexible display.