IP Library Granted Patent US 9,331,664
Granted Patent B2
US 9,331,664 · App. 14/300,435 · Granted May 3, 2016

Marchand balun and power amplifier using the same

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Quick Facts
Patent No.
US 9,331,664
App. No.
14/300,435
Granted
May 3, 2016
Kind
B2
Abstract

A Marchand balun has a primary transmission line with a width smaller than the two secondary transmission lines. The two secondary transmission lines also have different widths and lengths. This arrangement provides an imbalance between the widths and lengths of the transmission lines. It has been found that this imbalance can enable improved amplitude unbalance and phase unbalance.

Claims (23)

1. A Marchand balun, comprising:

a primary transmission line from a first primary port (Port 1) to an open termination having a length corresponding to half of a wavelength within an intended operating range;

a first secondary transmission line from a first secondary port (Port 2) to ground having a length corresponding to quarter of a wavelength within an intended operating range;

a second secondary transmission line from ground to a second secondary port (Port 3) having a length corresponding to a quarter of a wavelength within an intended operating range, the first and second secondary transmission lines each being electromagnetically coupled with and following the shape of a respective section of the primary transmission line;

wherein the primary transmission line has a width smaller than the second secondary transmission line, and the second secondary transmission line has a width smaller than the first secondary transmission line, and

wherein the first secondary transmission line is longer than the second secondary transmission line.

2. A balun as claimed in claim 1 , wherein the width of the second secondary transmission line is more than twice the width of the primary transmission line.

3. A balun as claimed in claim 1 , wherein the width of the first secondary transmission line is more than three times the width of the primary transmission line.

4. A balun as claimed in claim 1 , wherein the first secondary transmission line comprises a coil shape with a ground connection at the center and the first secondary port at the periphery.

5. A balun as claimed in claim 1 , wherein the second secondary transmission line comprises a coil shape with a ground connection at the center and the second secondary port at the periphery.

6. A balun as claimed in claim 1 , wherein the first secondary transmission line is up to 20% longer than the second secondary transmission line.

7. A balun as claimed in claim 1 , wherein the primary transmission line has a width of 3 μm to 10 μm, the first secondary transmission line has a width of 20 μm to 40 μm and the second secondary transmission line has a width of 10 μm to 20 μm.

8. A balun as claimed in claim 1 , wherein the primary transmission line has a length of 5 mm to 15 mm, and the first and secondary transmission lines have a length of 2.5 mm to 7.5 mm.

9. A balun as claimed in claim 1 , comprising a substrate with resistivity less than 20 mΩ-cm.

10. A power amplifier comprising:

an input balun for converting an RF input into a differential pair of RF signals, wherein the balun is as claimed in claim 1 ; and

an amplifier circuit.

11. An amplifier as claimed in claim 10 , wherein the amplifier circuit comprises a push-pull amplifier stage.

12. An amplifier as claimed in claim 11 , wherein the amplifier circuit comprises two push-pull amplifier stages with a matching network in between.

13. An amplifier as claimed in claim 12 , further comprising

an input matching network between the input balun and the amplifier circuit, and

wherein the input balun, input matching network and amplifier circuit are formed as a monolithic microwave integrated circuit, MMIC, and the power amplifier further comprises an output matching network and an output balun for converting to a single ended output, the output matching network and output balun formed outside the MMIC.

14. An amplifier as claimed in claim 10 , comprising an LDMOS (laterally diffused metal oxide semiconductor) circuit.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
CHANGE OF NAME Recorded Feb 22, 2016
From: SAMBA HOLDCO NETHERLANDS B.V.
To: AMPLEON NETHERLANDS B.V.
Reel/Frame 037876/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2015
From: NXP B.V.
To: SAMBA HOLDCO NETHERLANDS B.V.
Reel/Frame 036630/0574 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2014
From: BOUISSE, GERARD JEAN-LOUIS; BUSGEETH, RAJEEV
To: NXP, B.V.
Reel/Frame 033064/0939 →