MICROLITHOGRAPHY PROJECTION OBJECTIVE

1 - 53 . (canceled)

54 . A microlithography projection objective for imaging into an image plane a pattern arranged in an object plane, comprising:

a plurality of optical components that respectively have at least one optically active surface,

wherein:

a first optical component of the plurality of optical components has a first optically operative surface that, during the operation of the projection objective, has a first surface region not used by an imaging beam path for imaging the pattern into the image plane;

the first optically operative surface is assigned a first shield that masks out the first surface region, not used by the imaging beam path, of the first optically operative surface in order to suppress false light; and

the first shield is a shielding coating on the first surface region not used by the imaging beam path.

55 . The projection objective of claim 54 , wherein the first shield is reflective for a wavelength of the light used for imaging.

56 . The projection objective of claim 54 , wherein the first shield is absorbing for a wavelength of the light used for imaging, or the first shield is provided with an absorbing coating.

57 . The projection objective of claim 56 , wherein the absorbance of the first shield is at least approximately 95%.

58 . The projection objective of claim 56 , wherein the first shield has photocatalytic properties.

59 . The projection objective of claim 54 , wherein the first optically operative surface that is assigned the at least one first shield is a near-field surface.

60 . The projection objective of claim 54 , wherein the first shield is arranged between the object plane and the first optical component of the projection objective, and/or the first shield is arranged between the last optical component of the projection objective and the image plane.

61 . The projection objective of claim 54 , wherein the first optical component is a mirror.

62 . The projection objective of claim 54 , wherein the first optical component is a lens.

63 . The projection objective of claim 54 , wherein the plurality of optical components comprises a second optical component that has second optically operative surface that, during operation of the projection objective, has a second surface region not used by the imaging beam path for imaging the pattern into the image plane, and the second optically operative surface is assigned a second shield that masks out the second surface region, not used by the imaging beam path, of the second optically operative surface.

64 . The projection objective of claim 54 , wherein the plurality of optical components comprises at least two mirrors.

65 . The projection objective of claim 64 , wherein the plurality of optical components comprises at least four mirrors.

66 . The projection objective of claim 54 , wherein the projection objective is an immersion projection objective.

67 . The projection objective of claim 54 , further comprising at least a further shield configured to shield over-aperture light from the object plane.

68 . The projection objective of claim 55 , wherein the first shield is absorbing for a wavelength of the light used for imaging, or the first shield is provided with an absorbing coating.

69 . The projection objective of claim 57 , wherein the first shield has photocatalytic properties.

70 . The projection objective of claim 55 , wherein the first optically operative surface that is assigned the at least one first shield is a near-field surface.

71 . The projection objective of claim 55 , wherein the first shield is arranged between the object plane and the first optical component of the projection objective, and/or the first shield is between the last optical component of the projection objective and the image plane.

72 . The projection objective of claim 55 , wherein the first optical component is a mirror.

73 . A microlithography projection exposure machine, comprising a projection objective as claimed in claim 54 .