System for cooling an electronic image assembly with manifolds and ambient gas
View Patent ↗A method for cooling an electronic image assembly using ambient gas. Exemplary embodiments of the method include the steps of circulating a closed loop of circulating gas around the electronic image assembly, directing a flow of ambient air through a first manifold, allowing the flow of ambient air to cross the flow of circulating gas without allowing the two to mix, directing the flow of ambient air behind the electronic image assembly and directing the flow of ambient air through a second manifold. The circulating gas may be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing. A heat exchanger may be included with some embodiments of the method.
1. A method for cooling an electronic image assembly comprising the steps of:
circulating a closed loop of circulating gas around the electronic image assembly;
directing a flow of ambient air through a first manifold;
allowing the flow of ambient air to cross the flow of circulating gas without allowing the two to mix;
directing the flow of ambient air behind the electronic image assembly; and
directing the flow of ambient air through a second manifold.
2. The method of claim 1 wherein:
the circulating gas travels in front of the electronic image assembly and behind the electronic image assembly.
3. The method of claim 1 wherein:
the step of allowing the flow of ambient air to cross the flow of circulating gas is performed by a pass through plate.
4. The method of claim 1 wherein:
the manifolds travel lengthwise down vertical sides of the electronic image assembly.
5. The method of claim 1 wherein:
the step of directing the flow of ambient air behind the electronic image assembly is performed by a plurality of channels which are placed behind the electronic image assembly, where the channels are in gaseous communication with the first and second manifolds.
6. The method of claim 1 further comprising the steps of:
forcing the circulating gas through a first set of pathways in a heat exchanger, and
forcing the ambient air through a second set of pathways in said heat exchanger.
7. The method of claim 6 wherein:
the step of forcing the circulating gas through the heat exchanger is performed by a circulating fan, and
the step of forcing the ambient air through the heat exchanger is performed by an ambient air fan.
8. The method of claim 1 wherein:
the closed loop of circulating gas travels in front of the electronic image assembly, between a transparent front plate and a front surface of the electronic image assembly.
9. The method of claim 5 wherein:
the channels are placed in conductive thermal communication with the electronic image assembly.
10. A method for cooling an electronic image assembly having a pair of opposing edges and contained within a housing, the method comprising the steps of:
positioning a circulating fan within the housing to cause a closed loop of circulating gas to flow around the electronic image assembly;
placing a first manifold along one of the opposing edges of the electronic image assembly;
placing a second manifold along the opposite edge of the electronic image assembly as the first manifold;
placing a plurality of channels behind the electronic image assembly, where each channel is in gaseous communication with the first and second manifolds; and
positioning an ambient air fan within the housing to cause a flow of ambient air through the first manifold, channels, and second manifold without allowing the ambient air to mix with the circulating gas.
11. The method of claim 10 wherein:
the circulating gas travels in front of the electronic image assembly and behind the electronic image assembly.
12. The method of claim 10 further comprising the steps of:
positioning a first pass through plate adjacent to the first manifold; and
positioning a second pass through plate adjacent to the second manifold.
13. The method of claim 12 wherein:
the first and second pass through plates accept both ambient air as well as circulating gas but do not permit the two to mix.
14. The method of claim 10 further comprising the steps of:
forcing the circulating gas through a first set of pathways in a heat exchanger, and
forcing the ambient air through a second set of pathways in said heat exchanger.
15. The method of claim 10 wherein:
the closed loop of circulating gas travels in front of the electronic image assembly, between a transparent front plate and a front surface of the electronic image assembly.
16. The method of claim 10 wherein:
the channels are placed in conductive thermal communication with the electronic image assembly.
17. A method for cooling an electronic image assembly contained within a housing which encloses a first and second manifold along opposing edges of the housing, the method comprising the steps of:
placing a first pass through plate adjacent to the first manifold;
placing a second pass through plate adjacent to the second manifold;
circulating a closed loop of circulating gas around the electronic image assembly and through the first and second pass through plates; and
directing a flow of ambient air through the first manifold, through the first pass through plate, behind the electronic image assembly, through the second pass through plate, and through the second manifold.
18. The method of claim 17 further comprising the steps of:
forcing the circulating gas through a first set of pathways in a heat exchanger, and
forcing the ambient air through a second set of pathways in said heat exchanger.
19. The method of claim 17 wherein:
the closed loop of circulating gas travels in front of the electronic image assembly, between a transparent front plate and a front surface of the electronic image assembly.
20. The method of claim 17 further comprising the steps of:
further directing the ambient air through a plurality of channels which are placed in conductive thermal communication with the electronic image assembly.