Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board
View Patent ↗It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board ( 150, 250 ). The described method comprises (a) identifying first subareas ( 256, 258 ) of the printed circuit board ( 150, 250 ), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board ( 150, 250 ), (b) identifying second subareas ( 252, 254 ) of the printed circuit board ( 150, 250 ), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board ( 150, 250 ), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board ( 150, 250 ) at least at the second subareas ( 252, 254 ) of the printed circuit board ( 150, 250 ), (d) measuring the amount of solder paste which has been transferred to the second subareas ( 252, 254 ), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board ( 150, 250 ) in response to the measured amount of solder paste which has been transferred to the second subareas ( 252, 254 ). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.
1. A method for changing parameters for controlling a transfer of solder paste onto a printed circuit board, the method comprising
identifying first subareas of the printed circuit board, which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board,
identifying second subareas of the printed circuit board, which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board, wherein the first repeatability is smaller than the second repeatability,
wherein the steps of identifying the first and second subareas of the printed circuit board are based on (i) printed circuit board design data of the printed circuit board and based on (ii) stencil design data of a stencil being used for transferring the solder paste onto the printed circuit board by means of a solder paste printing procedure;
wherein the identified first subareas are assigned to surface areas of the stencil in which the apertures in the stencil have a comparatively small area ratio and the identified second subareas are assigned to surface areas of the stencil in which the apertures have a comparatively large area ratio, wherein the area ratio for an aperture of the stencil is defined by the ratio between
(a) a spatial overlap area between the opening of the aperture and a corresponding pad on a printed circuit board to which the aperture is assigned and onto which the solder paste is supposed to be transferred and
(b) the area of the sidewall of the aperture;
transferring solder paste onto the printed circuit board at least at the second subareas of the printed circuit board,
measuring the amount of solder paste which has been transferred to the second subareas, and
changing the parameters for controlling a transfer of solder paste onto the printed circuit board in response to the measured amount of solder paste which has been transferred to the second subareas and not to the first subareas.
2. The method as set forth in claim 1 , further comprising measuring at least one further characteristic quantity of the solder paste which has been transferred to the second subareas, wherein the further characteristic quantity is indicative for a volume, a height, a planarity, an area, a position, or a rotational orientation of the solder paste on the printed circuit board, which solder paste has been transferred to the second subareas, wherein changing the parameters for controlling a transfer of solder paste onto the printed circuit board is further based on the measured at least one further characteristic quantity.
3. The method as set forth in claim 1 , further comprising distinguishing different classes of second subareas wherein each class is assigned to a certain range of area ratios, wherein changing the parameters for controlling a transfer of solder paste onto the printed circuit board is carried out individually for each class of second subareas.
4. The method as set forth in claim 1 , further comprising transferring solder paste onto the printed circuit board at the first subareas of the printed circuit board.
5. The method as set forth in claim 4 , further comprising measuring the amount of solder paste which has been transferred to the first subareas.
6. The method as set forth in claim 1 , wherein the transfer of solder paste to the second subareas and/or to the first subareas is carried out by means of a solder paste printing machine.
7. The method as set forth in claim 1 , wherein measuring the amount of solder paste which has been transferred to the second subareas and/or to the first subareas of the printed circuit board is carried out by means of a solder paste inspecting machine.