IP Library Granted Patent US 9,470,370
Granted Patent B2
US 9,470,370 · App. 14/302,937 · Granted Oct 18, 2016

Light emitting module and light emitting device having the same

Inventor: Jun Seok Park (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
F21K9/10F21V23/002F21V23/06H01L33/62F21V19/001F21Y2101/02F21Y2103/003F21Y2105/001H01L25/0753H01L2224/48091H01L2224/48247
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Quick Facts
Patent No.
US 9,470,370
App. No.
14/302,937
Granted
Oct 18, 2016
Kind
B2
Abstract

Disclosed are a light emitting module and a light emitting device. The disclosed light emitting module includes a plurality of light emitting devices and a wire connecting the light emitting devices with each other and having at least a first end portion coupled with each light emitting device. The wire has a length longer than a distance between the light emitting devices, and is located higher than bottom surfaces of the light emitting devices. Each light emitting device includes a body including an insulating material, a first lead frame making contact with the body and having a first coupling part, a second lead frame making contact with the body and having a second coupling part, and a light emitting chip on at least one of the first and second lead frames. The first and second coupling parts are located higher than the bottom surfaces of the light emitting devices, and the wire is coupled with the first and second coupling parts of the light emitting devices.

Claims (44)

1. A light emitting module comprising:

a plurality of light emitting devices; and

a wire connecting the light emitting devices with each other and having at least a first end portion coupled with each light emitting device,

wherein the wire has a length longer than a distance between the light emitting devices, and is located higher than bottom surfaces of the light emitting devices,

wherein each of the plurality of light emitting devices comprises: a body including an insulating material; a first lead frame making contact with the body and having a first coupling part; a second lead frame making contact with the body and having a second coupling part; and a light emitting chip on at least one of the first and second lead frames,

the first and second coupling parts are located higher than the bottom surfaces of the light emitting devices, and

the wire is coupled with one of the first and second coupling parts of the light emitting devices.

2. The light emitting module of claim 1 , wherein the first and second coupling parts are exposed to a lateral side of the body.

3. The light emitting module of claim 1 , wherein each of the first and second coupling parts includes a first insertion hole, into which the first end portion of the wire is inserted, and a first contact part making contact with the first end portion of the wire.

4. The light emitting module of claim 3 , wherein the first contact part comprises a plurality of parts around the first insertion hole, and the first end portion of the wire is disposed between the plurality of parts.

5. The light emitting module of claim 4 , wherein the first and second lead frames are spaced apart from the bottom surfaces of the light emitting device.

6. The light emitting module of claim 1 , wherein the first and second coupling parts are exposed to mutually different regions of the body.

7. The light emitting module of claim 6 , wherein the wire is located higher than a bottom surface of the light emitting chip.

8. The light emitting module of claim 1 , wherein each light emitting device comprises: a cavity to open an upper portion of the body; and a molding member in the cavity, and

wherein the light emitting chip and portions of the first and second lead frames are disposed in the cavity.

9. A light emitting module comprising:

a plurality of light emitting devices;

a wire connecting the light emitting devices with each other and having at least a first end portion coupled with each light emitting device; and

an insulating sheet disposed under the light emitting devices,

wherein the wire has a length longer than a distance between the light emitting devices, and is located higher than bottom surfaces of the light emitting devices,

wherein each of the plurality of light emitting device comprises: a body including an insulating material; a first lead frame making contact with the body and having a first coupling part; a second lead frame making contact with the body and having a second coupling part; and a light emitting chip disposed on at least one of the first and second lead frames,

the first and second coupling parts are located higher than the bottom surfaces of the light emitting devices, and

the wire is coupled with one of the first and second coupling parts of the light emitting devices.

10. The light emitting module of claim 9 , wherein the first and second coupling parts are exposed to first and second lateral sides disposed in opposition to each other among lateral sides of the body.

11. The light emitting module of claim 9 , wherein each of the first and second coupling parts comprises a first insertion hole, into which the first end portion of the wire is inserted, and a first contact part making contact with the first end portion of the wire.

12. The light emitting module of claim 9 , wherein the first contact part comprises a plurality of parts around the first insertion hole, and an end portion of the wire is disposed between the parts.

13. The light emitting module of claim 9 , wherein the first end portion of the wire comprises a locking groove making contact with the first contact part, and

wherein the locking groove is located at an inner region position than a lateral side of the body.

14. The light emitting module of claim 1 , wherein the wire includes a flexible material between the plurality of light emitting devices.

15. The light emitting module of claim 1 , wherein the wire has circular side sectional surface.

16. The light emitting module of claim 1 , wherein the wire has a second end portion opposite to the first end portion,

wherein the plurality of light emitting device includes a first and second light emitting devices connected to the wire, and

wherein portion of the wire is coupled to the first coupling part of the first lead frame of the first light emitting device and the second end portion of the wire is coupled to the second coupling part of the second lead frame of the second light emitting device.

17. The light emitting module of claim 16 , wherein the first coupling part has the same structures as the second coupling part.

18. The light emitting module of claim 1 , further comprising an insulating sheet disposed under the plurality of light emitting devices and the wire,

wherein the bodies of the plurality of light emitting devices are attached to the insulating sheet.

19. The light emitting module of claim 9 , wherein the wire includes a flexible material between the plurality of light emitting devices,

wherein the wire has a second end portion opposite to the first end portion,

wherein the plurality of light emitting device includes a first and second light emitting devices connected to the wire, and

wherein the first end portion of the wire is coupled to the first coupling part of the first lead frame of the first light emitting device and the second end portion of the wire is coupled to the second coupling part of the second lead frame of the second light emitting device.

20. The light emitting module of claim 18 , wherein each light emitting device comprises:

a cavity to open an upper portion of the body; and

a molding member in the cavity, and wherein the light emitting chip and portions of the first and second lead frames are disposed in the cavity, and

wherein the first and second end portions of the wire are located at a lower position of a top surface of the each of the plurality of light emitting devices.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2014
From: PARK, JUN SEOK
To: LG INNOTEK CO., LTD.
Reel/Frame 033103/0603 →
Priority Claims (1)
KR 10-2013-0067825 · Jun 13, 2013 · national
Continuity (1)
Related Publication 20140369044A1 · Dec 18, 2014