Semiconductor integrated circuit device
Provided is a semiconductor integrated circuit device having pixel regions in a photodiode array region and having, in each of the pixel regions, a waveguide holding hole having a substantially perpendicular sidewall above the photodiode and embedded with a silicon oxide-based sidewall insulating film reaching the bottom surface of the hole and two or more silicon nitride-based insulating films having a higher refractive index on the inner side of the hole. This structure makes it possible to prevent deterioration of pixel characteristics of an imaging device, such as CMOS sensor, which is rapidly decreasing in size.
1. A semiconductor integrated circuit device comprising:
(a) a semiconductor substrate having a first main surface;
(b) a photodiode array region provided on the side of the first main surface of the semiconductor substrate;
(c) a number of pixel regions provided in matrix form in the photodiode array region;
(d) an interlayer insulating film provided over the first main surface of the semiconductor substrate including the photodiode array region; and
(e) a multilayer wiring provided in the interlayer insulating film,
wherein each of the pixel regions comprises:
(c1) a photodiode provided in a surface region of the first main surface of the semiconductor substrate;
(c2) a waveguide holding hole provided in the interlayer insulating film above the photodiode and having a substantially perpendicular sidewall;
(c3) a silicon oxide-based sidewall insulating film covering the side surface of the waveguide holding hole and reaching the bottom surface thereof;
(c4) a first silicon nitride-based insulating film covering the surface of the silicon oxide-based sidewall insulating film and the bottom surface of the waveguide holding hole;
(c5) a second silicon nitride-based insulating film covering, in the waveguide holding hole, the surface of the first silicon nitride-based insulating film and having a refractive index higher than that of the first silicon nitride-based insulating film; and
(c6) a third silicon nitride-based insulating film provided over the second silicon nitride-based insulating film so as to be embedded in the waveguide holding hole and having a refractive index higher than that of the second silicon nitride-based insulating film.
2. The semiconductor integrated circuit device according to claim 1 ,
wherein the photodiode array region configures a CMOS image sensor.
3. The semiconductor integrated circuit device according to claim 2 ,
wherein a width of an upper portion of the first silicon nitride-based insulating film is smaller than a width of a lower portion thereof.
4. The semiconductor integrated circuit device according to claim 3 ,
wherein a width of an upper portion of the second silicon nitride-based insulating film is smaller than a width of a lower portion thereof.
5. The semiconductor integrated circuit device according to claim 4 ,
wherein the interlayer insulating film and the semiconductor substrate have therebetween an anti-reflective film.
6. The semiconductor integrated circuit device according to claim 5 ,
wherein the waveguide holding hole reaches the anti-reflective film.
7. The semiconductor integrated circuit device according to claim 4 ,
wherein the waveguide holding hole reaches the first main surface of the semiconductor substrate.
8. A semiconductor integrated circuit device comprising:
(a) a semiconductor substrate having a first main surface;
(b) a photodiode array region provided on the side of the first main surface of the semiconductor substrate;
(c) a number of pixel regions provided in matrix form in the photodiode array region;
(d) an interlayer insulating film provided over the first main surface of the semiconductor substrate including the photodiode array region; and
(e) a multilayer wiring provided in the interlayer insulating film,
wherein each of the pixel regions comprises:
(c1) a photodiode provided in a surface region of the first main surface of the semiconductor substrate;
(c2) a waveguide holding hole provided in the interlayer insulating film above the photodiode;
(c3) a first silicon nitride-based sidewall insulating film covering the side surface of the waveguide holding hole and reaching the bottom surface thereof;
(c4) a second silicon nitride-based sidewall insulating film covering the surface of the first silicon nitride-based sidewall insulating film, reaching the bottom surface of the waveguide holding hole, and having a refractive index higher than that of the first silicon nitride-based sidewall insulating film; and
(c5) a third silicon nitride-based insulating film provided over the second silicon nitride-based sidewall insulating film so as to be embedded in the waveguide holding hole and having a refractive index higher than that of the second silicon nitride-based sidewall insulating film.
9. The semiconductor integrated circuit device according to claim 8 ,
wherein the photodiode array region configures a CMOS image sensor.
10. The semiconductor integrated circuit device according to claim 8 ,
wherein the waveguide holding hole is tapered toward the side of the semiconductor substrate.
11. The semiconductor integrated circuit device according to claim 8 ,
wherein the waveguide holding hole has a substantially perpendicular sidewall, and
wherein each of the pixel regions further comprises:
(c6) a silicon oxide-based sidewall insulating film covering the side surface of the waveguide holding hole and reaching the bottom surface thereof.
12. The semiconductor integrated circuit device according to claim 9 ,
wherein the interlayer insulating film and the semiconductor substrate have therebetween an anti-reflective film.
13. The semiconductor integrated circuit device according to claim 12 ,
wherein the waveguide holding hole reaches the anti-reflective film.
14. The semiconductor integrated circuit device according to claim 10 ,
wherein the waveguide holding hole reaches the first main surface of the semiconductor substrate.
15. A semiconductor integrated circuit device comprising:
(a) a semiconductor substrate having a first main surface;
(b) a photodiode array region provided on the side of the first main surface of the semiconductor substrate;
(c) a number of pixel regions provided in matrix form in the photodiode array region;
(d) an interlayer insulating film provided over the first main surface of the semiconductor substrate including the photodiode array region; and
(e) a multilayer wiring provided in the interlayer insulating film. In the semiconductor integrated circuit device,
wherein each of the pixel regions comprises:
(c1) a photodiode provided in a surface region of the first main surface of the semiconductor substrate;
(c2) a waveguide holding hole provided in the interlayer insulating film above the photodiode and tapered toward the side of the semiconductor substrate;
(c3) a first silicon nitride-based insulating film covering the side surface and bottom surface of the waveguide holding hole;
(c4) a second silicon nitride-based insulating film covering, in the waveguide holding hole, the surface of the first silicon nitride-based insulating film and having a refractive index higher than that of the first silicon nitride-based insulating film; and
(c5) a third silicon nitride-based insulating film provided over the second silicon nitride-based insulating film so as to be embedded in the waveguide holding hole and having a refractive index higher than that of the second silicon nitride-based insulating film,
wherein a width of an upper portion of the first silicon nitride-based insulating film is smaller than a width of a lower portion thereof and a width of an upper portion of the second silicon nitride-based insulating film is smaller than a width of a lower portion thereof.
16. The semiconductor integrated circuit device according to claim 15 ,
wherein the photodiode array region configures a CMOS image sensor.
17. The semiconductor integrated circuit device according to claim 16 ,
wherein the interlayer insulating film and the semiconductor substrate have therebetween an anti-reflective film.
18. The semiconductor integrated circuit device according to claim 17 , wherein the waveguide holding hole reaches the anti-reflective film.
19. The semiconductor integrated circuit device according to claim 16 ,
wherein the waveguide holding hole reaches the first main surface of the semiconductor substrate.