Method and apparatus for fabricating phosphor-coated LED dies

1. A method, comprising:

providing a substrate having a layer disposed thereon;

attaching a plurality of light-emitting devices to the layer;

applying a gel over the substrate, the gel covering the plurality of light-emitting devices;

shaping the gel into a plurality of lenses, wherein the lenses each cover a respective one of the light-emitting devices, wherein the lenses each include a first sub-layer and a second sub-layer, and wherein the first and second sub-layers have different characteristics;

separating the light-emitting devices from one another; and

removing the substrate and the layer.

2. The method of claim 1 , wherein the providing of the layer comprises placing a tape on the substrate.

3. The method of claim 1 , wherein the providing of the layer includes forming a photoresist material on the substrate.

4. The method of claim 1 , wherein the providing of the layer comprises forming an adhesive layer on the substrate.

5. The method of claim 1 , further comprising, before the attaching of the plurality of light-emitting devices, coating a phosphor layer on the light-emitting devices.

6. The method of claim 1 , further comprising: bonding the separated light-emitting devices to a printed circuit board.

7. The method of claim 1 , wherein:

the first sub-layer contains phosphor particles; and

the second sub-layer contains diffuser particles.

8. The method of claim 1 , wherein:

the first sub-layer contains first phosphor particles;

the second sub-layer contains second phosphor particles; and

the first and second phosphor particles are different color phosphor particles.

9. The method of claim 1 , wherein the separating of the light-emitting devices is performed before the removing of the substrate.

10. The method of claim 1 , wherein the separating of the light-emitting devices is performed after the removing of the substrate.

11. A method, comprising:

forming a layer on a substrate, the layer being an adhesive layer, or a photoresist layer, or a tape;

attaching a plurality of light-emitting diodes (LEDs) to the substrate through the layer, the LEDs each being coated with a phosphor film;

applying a gel over the substrate, the gel covering the plurality of LEDs;

molding the gel into a plurality of lenses, wherein the lenses each house a respective one of the LEDs therein, and wherein the lenses each have a non-flat upper surface;

singulating the plurality of LEDs; and

removing the substrate and the layer.

12. The method of claim 11 , further comprising: bonding the singulated LEDs to a printed circuit board.

13. The method of claim 11 , wherein the applying of the gel and the molding of the gel are performed such that:

the lenses each includes a first sub-layer and a second sub-layer; and

the first and second sub-layers have different material compositions.

14. The method of claim 13 , wherein:

the first sub-layer contains phosphor particles but not diffuser particles; and

the second sub-layer contains diffuser particles but not phosphor particles.

15. The method of claim 13 , wherein:

the first sub-layer contains first phosphor particles;

the second sub-layer contains second phosphor particles; and

the first and second phosphor particles are different color phosphor particles.

16. The method of claim 11 , wherein the singulating of the LEDs is performed before the removing of the substrate.

17. A method, comprising:

providing a substrate with a tape disposed thereon, wherein the tape contains an adhesive material;

attaching a plurality of phosphor-coated light-emitting diode (LED) dies to the tape;

applying a gel over the substrate, the gel covering the plurality of LED dies;

molding the gel into a plurality of lenses, wherein the lenses each house a respective one of the LED dies underneath, and wherein the lenses each have a non-flat upper surface;

singulating the plurality of LED dies;

removing the tape and the substrate; and

bonding the singulated LED dies to a printed circuit board.

18. The method of claim 17 , wherein the applying of the gel and the molding of the gel are performed such that:

the lenses each includes a first sub-layer and a second sub-layer;

the first sub-layer contains phosphor particles but not diffuser particles; and

the second sub-layer contains diffuser particles but not phosphor particles.

19. The method of claim 17 , wherein the applying of the gel and the molding of the gel are performed such that:

the lenses each includes a first sub-layer and a second sub-layer;

the first sub-layer contains yellow phosphor particles; and

the second sub-layer contains red phosphor particles.

20. The method of claim 17 , wherein the adhesive material contains photoresist.