Ceramic encapsulation of an implantable device
An implantable device is provided. The implantable device may include a flexible carrier configured for implantation in a subject, at least one pair of modulation electrodes associated with the carrier, an antenna configured to receive an electrical signal disposed on the flexible carrier, a circuit electrically coupling the antenna to the at least one pair of modulation electrodes; and a ceramic housing. At least one of the antenna and the circuit may be located within the ceramic housing.
1. An implantable device, comprising:
a flexible carrier configured for implantation in a subject;
at least one pair of modulation electrodes associated with the carrier;
an antenna configured to receive an electrical signal disposed on the flexible carrier;
a circuit electrically coupling the antenna to the at least one pair of modulation electrodes; and
a rigid housing having an upper portion and a lower portion,
wherein
one or more of the upper portion or the lower portion is constructed of ceramic, and
at least one of the antenna and the circuit are located within the rigid housing.
2. The implantable device of claim 1 , further comprising a silicone layer encapsulating the rigid housing.
3. The implantable device of claim 2 , further comprising a parylene layer disposed between the silicone layer and the rigid housing.
4. The implantable device of claim 1 , wherein the rigid housing includes a plurality of conductive feedthroughs, the feedthroughs providing electrical coupling between the circuit and the modulation electrodes.
5. The implantable device of claim 1 , wherein one or more of the upper portion or lower portion of the rigid housing is constructed of glass or titanium.
6. The implantable device of claim 1 , wherein the upper portion is constructed of titanium or ceramic, and the bottom portion is constructed of ceramic.
7. The implantable device of claim 1 , wherein the upper portion and the lower portion of the rigid housing are configured as a clamshell.