In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.
1. A floor panel comprising:
a substrate;
a top layer provided on the substrate;
wherein the substrate is a synthetic material board;
wherein the top layer includes a back layer, a motif and a transparent wear layer; and
wherein the back layer has a higher density than the transparent wear layer; and
a backing layer provided on a lower side of the floor panel, the backing layer having a lower density than the back layer.
2. The floor panel of claim 1 , wherein the back layer has a thickness amounting to at least 45 percent of the overall thickness of the top layer.
3. The floor panel of claim 1 , wherein the back layer is a vinyl containing layer.
4. The floor panel of claim 1 , wherein the back layer includes filler materials.
5. The floor panel of claim 1 , wherein the motif is applied to a synthetic material film situated between the back layer and the transparent wear layer.
6. The floor panel of claim 1 , wherein the motif consists of a printed pattern on the basis of UV-based or solvent based inks.
7. The floor panel of claim 1 , wherein the substrate has an average density of more than 300 kilograms per cubic meter.
8. The floor panel of claim 1 , wherein the transparent wear layer has a thickness corresponding to at least 25 percent of the overall thickness of the top layer.
9. The floor panel of claim 1 , wherein the top layer further includes a surface layer on the basis of a UV hardened substance.
10. The floor panel of claim 1 , wherein the floor panel is of rectangular shape defined by pairs of opposite edges;
wherein at least at one pair of opposite edges the substrate includes profiles formed in the synthetic material board; and
wherein the profiles include mechanical coupling means for enabling at least one of
a vertical locking between floor panels at the respective edges, the vertical locking being active perpendicular to the plane of coupled panels, and
a horizontal locking between floor panels at the respective edges, the horizontal locking being active in the plane of coupled panels and perpendicular to the respective edges.
11. The floor panel of claim 10 , wherein the mechanical coupling means includes locking parts resulting in the horizontal locking; and
wherein two pairs of horizontally active locking surfaces are formed between the respective edges; one pair of the horizontally active locking surfaces being formed from the material of the substrate and extending at an angle between 30 and 90 degrees with the surface of the floor panels; a second pair of the horizontally active locking surfaces being formed exclusively from the material of the top layer and extending substantially vertical.
12. The floor panel of claim 10 , wherein the mechanical coupling means includes locking parts resulting in the vertical locking; and
wherein two pairs of vertically active locking surfaces are formed between the respective edges; both pairs of vertically active locking surfaces being formed exclusively from the material of the substrate.
13. The floor panel of claim 1 , wherein the synthetic material board comprises wood fiber as a filler material.
14. The floor panel of claim 1 , wherein the synthetic material board comprises closed-cell foam.
15. The floor panel of claim 1 , wherein the synthetic material board is an extruded board comprising synthetic material and wood fiber.
16. The floor panel of claim 1 , wherein the substrate has an average density of more than 500 kilograms per cubic meter.
17. The floor panel of claim 1 , wherein the synthetic material board is water resistant.
18. The floor panel of claim 1 , wherein the floor panel is rigid and cannot be wound up.