IP Library Granted Patent US 9,496,383
Granted Patent B2
US 9,496,383 · App. 14/307,889 · Granted Nov 15, 2016

Semiconductor device and method of forming the same

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Quick Facts
Patent No.
US 9,496,383
App. No.
14/307,889
Granted
Nov 15, 2016
Kind
B2
Abstract

A semiconductor device may include, but is not limited to, a semiconductor substrate having a first gate groove; a first fin structure underneath the first gate groove; a first diffusion region in the semiconductor substrate, the first diffusion region covering an upper portion of a first side of the first gate groove; and a second diffusion region in the semiconductor substrate. The second diffusion region covers a second side of the first gate groove. The second diffusion region has a bottom which is deeper than a top of the first fin structure.

Claims (17)

1. A semiconductor device comprising:

a semiconductor substrate having a first gate groove;

a first fin structure underneath a top of the first gate groove;

a second gate groove in the semiconductor substrate running generally parallel to said first gate groove;

a second fin structure underneath a top of the second gate groove;

a first gate insulating film that covers the first gate groove and a surface of the first fin structure;

a second gate insulating film that covers the second gate groove and a surface of the second fin structure;

a first gate electrode on the first gate insulating film in a lower portion of the first gate groove, the first gate electrode extending over the first fin structure;

a second gate electrode on the second gate insulating film in a lower portion of the second gate groove, the second gate electrode extending over the second fin structure;

a first diffusion region in the semiconductor substrate, the first diffusion region covering an upper portion of a first side of the first gate groove;

a second diffusion region in the semiconductor substrate, the second diffusion region covering a second side of the first gate groove, the second diffusion region also covering a second side of the second gate groove;

a third diffusion region in the semiconductor substrate covering an upper portion of a first side of the second gate groove,

wherein a bottom of the second diffusion region is shallower than a bottom of the first fin structure, and

wherein the bottom of the second diffusion region is deeper than a top of the first fin structure.

2. The semiconductor device according to claim 1 , wherein the first gate groove has a bottom that has a depth from a surface of the semiconductor substrate in the range from 150 nm to 200 nm, and the first fin structure has a height in the range from 10 nm to 40 nm.

3. The semiconductor device according to claim 1 , further comprising a plurality of first isolation regions in the semiconductor device, the plurality of first isolation regions defining active regions, the plurality of first isolation regions extending in a first direction,

wherein the first and second gate grooves extend in a second direction and across the active regions and the plurality of first isolation regions.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046863/0001 →
CHANGE OF NAME Recorded Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2014
From: OYU, KIYONORI; TANIGUCHI, KOJI; HAMADA, KOJI; TAKETANI, HIROAKI
To: ELPIDA MEMORY INC.
Reel/Frame 033129/0164 →