Organic EL device having improved sealing property
View Patent ↗An organic EL device including an organic EL portion, wiring, and an externally-connecting terminal, which are disposed above a substrate having flexibility. The substrate has a first region above which the organic EL portion is disposed, a second region above which the terminal is disposed, and a bend portion between the first and second regions. The bend portion corresponds to a predetermined portion of the organic EL device at which the organic EL device is to be bent. The organic EL portion is covered by an inorganic sealing film, and the inorganic sealing film is covered by a resin sealing film. An end of the inorganic sealing film in a direction of the terminal does not extend over the bend portion towards the terminal, and an end of the resin sealing film in the direction of the terminal extends over the bend portion towards the terminal.
1. An organic EL device comprising:
a substrate having flexibility;
an organic EL portion disposed above a first region of the substrate;
wiring disposed above the substrate and connected to the organic EL portion;
an externally-connecting terminal disposed above a second region of the substrate differing from the first region, the externally-connecting terminal being electrically connected with the organic EL portion via the wiring, at least a portion of the externally-connecting terminal to be connected with an external drive circuit for driving the organic EL device;
an inorganic sealing film mainly containing an inorganic material and covering the organic EL portion; and
a resin sealing film mainly containing a resin material and covering the inorganic sealing film, at least a part of the resin sealing film being in contact with the inorganic sealing film, wherein
the substrate has a bend portion between the first region and the second region, the bend portion corresponding to a predetermined portion of the organic EL device at which the organic EL device is to be bent, and
an end of the inorganic sealing film in a direction of the externally-connecting terminal does not extend over the bend portion towards the externally-connecting terminal, and an end of the resin sealing film in the direction of the externally-connecting terminal extends over the bend portion towards the externally-connecting terminal but does not extend over said portion of the externally-connecting terminal to be connected with an external drive circuit.
2. The organic EL device of claim 1 , wherein
the wiring includes a portion above the bend portion, the portion of the wiring being covered by the resin sealing film.
3. The organic EL device of claim 1 further comprising:
a drive chip for driving the organic EL portion, the drive chip having an input terminal and an output terminal, wherein
the wiring is composed of a first wiring and a second wiring, the first wiring extending from the externally-connecting terminal and connected to the input terminal of the drive chip, the second wiring leading out from the organic EL portion and connected to the output terminal of the drive chip, and
the drive chip is disposed above the substrate away from the bend portion in the direction of the externally-connecting terminal and is covered by the resin sealing film.
4. The organic EL device of claim 1 , wherein
the wiring is composed of a first wiring and a second wiring, the first wiring extending from the externally-connecting terminal, the second wiring leading out from the organic EL portion, and
the externally-connecting terminal is composed of a first layer and a second layer on the first layer, the first layer having the same thickness as each of the first wiring and the second wiring.
5. The organic EL device of claim 1 further comprising:
a peripheral inorganic sealing film mainly containing an inorganic material, the peripheral inorganic sealing film disposed above the substrate away from the bend portion in the direction of the externally-connecting terminal.
6. The organic EL device of claim 1 , wherein
the organic EL portion includes a first organic EL region and a second organic EL region,
the substrate also has a bend portion between the first organic EL region and the second organic EL region, the bend portion between the first organic EL region and the second organic EL region corresponding to another predetermined portion of the organic EL device at which the organic EL device is to be bent, and
the inorganic sealing film is not formed above the bend portion between the first organic EL region and the second organic EL region.
7. The organic EL device of claim 6 , wherein
the resin sealing film is formed above the bend portion between the first organic EL region and the second organic EL region.