IP Library Granted Patent US 9,022,657
Granted Patent B2
US 9,022,657 · App. 14/309,376 · Granted May 5, 2015

Bearing assemblies including a thermally conductive structure, bearing apparatuses, and methods of use

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Quick Facts
Patent No.
US 9,022,657
App. No.
14/309,376
Granted
May 5, 2015
Kind
B2
Abstract

Embodiments of the invention are directed to bearing assemblies configured to effectively provide heat distribution from and/or heat dissipation for bearing element, bearing apparatuses including such bearing assemblies, and methods of operating such bearing assemblies and apparatuses. In an embodiment, a bearing assembly includes a plurality of superhard bearing elements distributed about an axis. Each superhard bearing element of the plurality of superhard bearing elements has a superhard material including a superhard surface. Additionally, a support ring structure that includes a support ring that supports the plurality of superhard bearing elements and a thermally-conductive structure in thermal communication with the superhard table of each of the plurality of superhard bearing elements. The thermally-conductive structure has a higher thermal conductivity than the support ring of the support ring structure.

Claims (27)

1. A method of manufacturing a bearing assembly, comprising:

attaching a plurality of superhard bearing elements to a support ring such that the plurality of superhard bearing elements are distributed about an axis, each of the plurality of superhard bearing elements including a superhard material having a superhard bearing surface; and

at least partially enclosing the support ring with a thermally-conductive structure such that the thermally-conductive structure is in thermal communication with the plurality of superhard bearing elements;

wherein the thermally-conductive structure exhibits a higher thermal conductivity than the support ring.

2. The method of claim 1 wherein the support ring includes a channel, and wherein at least partially enclosing the support ring with a thermally-conductive structure such that the thermally-conductive structure is in thermal communication with the plurality of superhard bearing elements includes disposing a thermally-conductive element in the channel of the support ring.

3. The method of claim 2 , wherein one or more of the plurality of superhard bearing elements include a substrate that includes a post in thermal communication with the thermally-conductive element.

4. The method of claim 3 , wherein the post is in thermal communication with the superhard material of the one or more of the plurality of superhard bearing elements.

5. The method of claim 1 , wherein the support ring includes one or more of alloy steel, carbon steel, stainless steel, or tungsten carbide, and wherein the thermally-conductive structure includes one or more of copper, copper alloys, aluminum, aluminum alloys, brass, bronze, gold, silver, graphite, or diamond.

6. The method of claim 1 , wherein the thermally-conductive structure includes a plurality of thermally-conductive sleeves in contact with each other, and wherein at least partially enclosing the support ring with a thermally-conductive structure such that the thermally-conductive structure is in thermal communication with the plurality of superhard bearing elements includes disposing each of the plurality of thermally-conductive sleeves about a corresponding superhard bearing element of the plurality of superhard bearing elements.

7. The method of claim 1 , wherein the superhard material includes polycrystalline diamond.

8. The method of claim 1 , wherein the superhard bearing surfaces are substantially planar, convex, or concave.

9. The method of claim 1 , wherein attaching a plurality of superhard bearing elements to a support ring such that the plurality of superhard bearing elements are distributed about an axis includes at least one of brazing, press-fitting, or mechanically fastening each of the plurality of superhard bearing elements to the support ring.

10. A method of manufacturing a bearing assembly, comprising:

attaching a plurality of polycrystalline diamond bearing elements to a support ring such that the plurality of polycrystalline diamond bearing elements are distributed about an axis, each of the plurality of polycrystalline diamond elements including a polycrystalline diamond material having a polycrystalline diamond bearing surface; and

securing a thermally-conductive structure to the support ring, wherein at least a portion of the thermally-conductive structure is disposed in at least a portion of the support ring and/or wherein at least a portion of the support ring is enclosed by the thermally conductive structure, such that the thermally-conductive structure is in thermal communication with the plurality of polycrystalline diamond bearing elements;

wherein the thermally-conductive structure exhibits a higher thermal conductivity than the support ring.

11. The method of claim 10 wherein the support ring includes a channel, and wherein securing the thermally-conductive structure to the support ring includes disposing a thermally-conductive element in the channel of the support ring.

12. The method of claim 10 , wherein the support ring includes one or more of alloy steel, carbon steel, stainless steel, or tungsten carbide, and wherein the thermally-conductive structure includes one or more of copper, copper alloys, aluminum, aluminum alloys, brass, bronze, gold, silver, graphite, or diamond.

13. The method of claim 10 , wherein the thermally-conductive structure includes a plurality of thermally-conductive sleeves in contact with each other, and wherein securing the thermally-conductive structure to the support ring includes disposing each of the plurality of thermally-conductive sleeves about a corresponding polycrystalline diamond bearing element of the plurality of polycrystalline diamond bearing elements.

14. The method of claim 10 , wherein the thermally-conductive structure includes a plurality of thermally-conductive sleeves in contact with each other, and wherein securing the thermally-conductive structure to the support ring includes disposing each of the plurality of thermally-conductive sleeves about a corresponding polycrystalline diamond bearing element of the plurality of polycrystalline diamond bearing elements.

15. The method of claim 10 , wherein one or more of the plurality of polycrystalline diamond bearing elements include a substrate that includes a post in thermal communication with the thermally-conductive structure.

16. The method of claim 15 , wherein the post is in thermal communication with the polycrystalline diamond material of the one or more of the plurality of polycrystalline diamond bearing elements.

17. The method of claim 15 , wherein the post includes one or more of copper, aluminum, brass, bronze, gold, silver, graphite, or diamond.

18. A method of manufacturing a bearing assembly, comprising:

mounting a plurality of polycrystalline diamond bearing elements to a support ring such that the plurality of polycrystalline diamond bearing elements are distributed about an axis, each of the plurality of polycrystalline diamond elements including a polycrystalline diamond material having a polycrystalline diamond bearing surface, wherein the support ring includes a channel, wherein the support ring includes steel; and

securing a thermally-conductive structure to the support ring in the channel such that the thermally-conductive structure is in thermal communication with the plurality of polycrystalline diamond bearing elements, the thermally-conductive structure includes copper and exhibits a higher thermal conductivity than the support ring.

19. The method of claim 18 , wherein the polycrystalline diamond bearing surfaces are substantially planar, convex, or concave.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →