Pressure sensors having low cost, small, universal packaging

1. A pressure sensor package comprising:

a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein:

a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support;

compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support;

connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and

a pressure port disposed in the pressure sensor package and extending through the pressure sensor package from an exterior to the pressure sensing device in an interior.

2. The pressure sensor package of claim 1 wherein the pressure port is disposed in the pressure sensor support.

3. The pressure sensor package of claim 1 wherein the pressure sensor support includes a cavity and the pressure sensor device is disposed in the cavity.

4. The pressure sensor package of claim 1 wherein the compensation support includes a cavity and at least a portion of the compensation circuitry is disposed in the cavity.

5. The pressure sensor package of claim 1 wherein the pressure sensor device comprises a MEMS sensor die.

6. The pressure sensor package of claim 1 wherein the compensation circuitry comprises an ASIC.

7. The pressure sensor package of claim 1 wherein the connectors are pogo pins.

8. The pressure sensor package of claim 1 wherein the connectors are solder pins.

9. The pressure package of claim 1 wherein the connectors are comprised of solder.

10. The pressure package of claim 1 wherein the pressure sensor support is planar.

11. The pressure package of claim 10 wherein the interconnect housing is annular.

12. The pressure package of claim 11 wherein the compensation support is planar.

13. The pressure package of claim 12 wherein the pressure sensor support, the interconnect housing and the compensation support each includes an alignment feature.

14. The pressure package of claim 13 wherein the pressure sensor device comprises a MEMS sensor device.

15. A pressure sensor package comprising:

a planar pressure sensor support with a top surface and a bottom surface and a first plurality of electrical interconnect pads on a periphery of the top surface;

a pressure sensing device coupled to the planar pressure sensor support and electrically connected to the first plurality of electrical interconnect pads;

a planar compensation support with a first top surface and a first bottom surface and a second plurality of electrical interconnect pads on a periphery of the first bottom surface;

compensation electronics disposed on the planar compensation support and in electrical communication with the second plurality of electrical interconnect pads;

an interconnect housing with a second top surface and a second bottom surface and a passage that runs through the interconnect housing from the top surface to the bottom surface and creates a periphery wall around the passage, wherein a plurality of holes extending through the periphery wall from the second top surface to the second bottom surface;

a plurality of electrical conductors disposed in the plurality of holes and extending from the second top surface to the second bottom surface; and

a pressure port extending through the pressure sensor package from an exterior to the pressure sensing device in an interior;

wherein, the first and second plurality of electrical interconnect pads and the plurality of holes are each arranged such that when the interconnect housing is assembled between the top surface of the planar pressure sensor support and the bottom surface of the planar compensation support, the pressure sensing device is placed in electrical communication with the compensation electronics via the plurality of electrical conductors.

16. The pressure sensor package of claim 15 , wherein the pressure port is disposed in the planar pressure sensor support and extends from the top surface to the bottom surface below the pressure sensing device.

17. The pressure sensor package of claim 15 , wherein the compensation circuitry comprises an ASIC.

18. The pressure package of claim 15 , wherein the electrical conductors are comprised of solder.

19. A pressure sensor package comprising:

a universal pressure sensing disc with a top surface and a bottom surface and a first plurality of electrical interconnect pads on a periphery of the top surface;

a pressure sensing device coupled to the universal pressure sensing disc and electrically connected to the plurality of electrical interconnect pads;

a customer specific compensation disc with a first top surface and a first bottom surface and a second plurality of electrical interconnect pads on a periphery of the first bottom surface;

compensation electronics disposed on the customer specific compensation disc and in electrical communication with the second plurality of electrical interconnect pads;

an interconnect housing with a second top surface and a second bottom surface, the interconnect housing coupled between the top surface of the universal pressure sensing disc and the first bottom surface of the customer specific compensation disc, wherein the interconnect housing has a passage that runs through the interconnect housing from the second top surface to the second bottom surface and creates a periphery wall around the passage;

a plurality of electrically conductive paths in the periphery wall of the interconnect housing wherein the electrically conductive paths electrically connect the first and second plurality of electrical interconnect pads; and

a pressure port extending through the pressure sensor package from an exterior to the pressure sensing device in an interior.

20. The pressure sensor package of claim 19 , wherein the pressure port is disposed in the universal pressure sensing disc and extends from the top surface to the bottom surface below the pressure sensing device.