IP Library Granted Patent US 9,805,748
Granted Patent B1
US 9,805,748 · App. 14/313,550 · Granted Oct 31, 2017

System and method for providing a protective layer having a graded intermediate layer

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Quick Facts
Patent No.
US 9,805,748
App. No.
14/313,550
Granted
Oct 31, 2017
Kind
B1
Abstract

A method of providing an apparatus with a protective layer by simultaneously depositing carbon and seed material on the apparatus to form an intermediate layer, wherein the carbon and seed material have a percentage composition that varies as a function of the intermediate layer thickness; and then providing a diamond-like carbon (DLC) layer adjacent to the intermediate layer to produce the protective layer.

Claims (24)

1. An apparatus comprising:

a metal substrate;

a diamond-like carbon (DLC) layer above the metal substrate; and

an intermediate layer having a first interface at the metal substrate and a second interface at the DLC layer, wherein the intermediate layer comprises a carbon mixture that includes sp3 carbon bonds and a seed material and wherein the percentage of the sp3 carbon bonds and the percentage of the seed material within the carbon mixture varies with respect to the thickness of the intermediate layer,

wherein the seed material comprises a material selected from the group consisting of Ti, TiN, Si3N4, SiNx, TixSi3N4, and combinations thereof, where x is a non-zero positive integer, and

wherein an atomic percent of the sp3 carbon bonds is greater than an atomic percent of the seed material.

2. The apparatus of claim 1 wherein the thickness of the intermediate layer ranges from about three to about nine angstroms.

3. The apparatus of claim 1 wherein the thickness of the DLC layer and the intermediate layer ranges from about fifteen to about twenty five angstroms.

4. The apparatus of claim 1 wherein the composition of the intermediate layer at the first interface is between 95 atomic percent and 100 atomic percent seed material.

5. The apparatus of claim 1 wherein the composition of the intermediate layer at the second interface is between 95 atomic percent and 100 atomic percent carbon.

6. The apparatus of claim 1 wherein the intermediate layer has a middle portion between the first interface and the second interface, the middle portion having a composition of about 15-40 atomic percent silicon, 10-30 atomic percent nitrogen and 20-70 atomic percent carbon.

7. The apparatus of claim 1 wherein the intermediate layer has a middle portion between the first and the second interface, the middle portion having a composition of about 10-40 atomic percent titanium, 0-40 atomic percent nitrogen and 20-60 atomic percent carbon.

8. The apparatus of claim 1 wherein the apparatus is a magnetic read/write head.

9. The apparatus of claim 1 wherein the apparatus is a tool.

10. The apparatus of claim 1 , wherein the seed material comprises SiN.

11. An apparatus comprising:

a metal substrate;

a diamond-like carbon (DLC) layer above the metal substrate; and

an intermediate layer having a first interface at the metal substrate and a second interface at the DLC layer, wherein the intermediate layer comprises a carbon mixture that includes a seed material and wherein the percentage of carbon and the percentage of the seed material within the carbon mixture varies with respect to the thickness of the intermediate layer,

wherein the seed material comprises a material selected from the group consisting of Ti, TiN, Si3N4, SiNx, TixSi3N4, and combinations thereof, where x is a non-zero positive integer,

wherein the composition of the intermediate layer at the first interface is between 95 atomic percent and 100 atomic percent seed material, and

wherein the composition of the intermediate layer at the second interface is between 95 atomic percent and 100 atomic percent sp3 carbon bonds.

12. The apparatus of claim 11 wherein the apparatus is a magnetic read/write head.

13. The apparatus of claim 11 , wherein the seed material comprises SiN.

Assignments (9)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0845 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL (FREMONT), LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: WESTERN DIGITAL (FREMONT), LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050450/0582 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 045501/0158 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0755 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0675 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038710/0845 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2015
From: GONG, YONGPING; SUSWADI, BUDI; BUNNAK, PHUWANAI; LOO, KAH CHOONG; SIANGCHAEW, KRISDA
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 037050/0521 →