Ink composition, method of metalizing surface and article obtainable

1. An article, comprising:

an ink layer including an ink composition applied on a surface of the article, and

a metal layer plated on the ink layer,

wherein the ink composition comprises a metal compound and an ink vehicle,

wherein the metal compound includes at least one selected from a group consisting of a compound of formula I and a compound of formula II,

TiO 2-σ   (I),

M 1 M 2 p O q   (II),

wherein 0.05≦σ<1.8,

M 1 includes at least one element selected from a group consisting of groups 2, 9-12 of the periodic table according to IUPAC nomenclature,

M 2 includes at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table according to IUPAC nomenclature, and

0<p≦2, and

0<q<4.

2. The article according to claim 1 , wherein based on 100 weight parts of the metal compound, the content of the ink vehicle is about 1 to 30 weight parts.

3. The article according to claim 1 , wherein the metal compound has an average particle size of 1 nm to 1 micron.

4. The article according to claim 1 , wherein based on the total volume of the compound of formula I, about 50 to 100 volume % of the compound of formula I has a particle size of about 1 to 50 nm.

5. The article according to claim 1 , further comprising a solvent, wherein based on 100 weight parts of the metal compound, the content of the solvent is about 20 to 200 weight parts.

6. The article according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 11 of the periodic table according to IUPAC nomenclature, M 2 comprises M 21 and M 22 ,

wherein

M 21 includes one element selected from a group consisting of group 8 of the periodic table according to IUPAC nomenclature,

M 22 includes at least one element selected from a group consisting of groups 13 and 7 of the periodic table according to IUPAC nomenclature, and

a molar ratio between M 21 and M 22 is about 1:0.1-10.

7. The article according to claim 6 , wherein M 22 comprises M 221 and M 222 ,

wherein

M 221 includes one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature,

M 222 includes one element selected from a group consisting of group 7 of the periodic table according to IUPAC nomenclature, and

a molar ratio between M 221 and M 222 is about 1:0.1-10.

8. The article according to claim 6 , wherein M 1 is Cu, M 21 is Fe, and M 22 is at least one selected from Mn and Al.

9. The article according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 2 of the periodic table according to IUPAC nomenclature,

M 2 includes one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature.

10. The article according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 10 of the periodic table according to IUPAC nomenclature,

M 2 includes one element selected from a group consisting of group 6 of the periodic table according to IUPAC nomenclature.

11. The article according to claim 10 , wherein M 1 is Ni, M 2 is Mo.

12. The article according to claim 1 , wherein M 1 includes one element selected from a group consisting of group 11 of the periodic table according to IUPAC nomenclature,

M 2 includes at least one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature, or M 2 comprises at least one element selected from a group consisting of group 13 of the periodic table according to IUPAC nomenclature and at least one element selected from a group consisting of groups 8 and 10 of the periodic table according to IUPAC nomenclature.

13. The article according to claim 12 , wherein M 2 comprises M 23 and M 24 ,

M 23 includes one element selected from a group consisting of groups 8, 10 and 13 of the periodic table according to IUPAC nomenclature,

M 24 is B,

M 23 and M 24 are different, and a molar ratio of M 23 and M 24 is about 1:0.1-10.

14. The article according to claim 13 , wherein M 1 is Cu, and

M 23 is Ga, or M 23 comprises Ga and at least one selected from Fe and Ni.

15. The article according to claim 1 , wherein M 1 includes at least one selected from a group consisting of Mg, Ca, Sr, Ba, Co, Ni, Cu, Zn, and

M 2 includes at least one selected from a group consisting of Sc, Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Ru, B, Al, Ga, In.

16. The article according to claim 1 , wherein the metal compound includes at least one selected from the group consisting of a compound of formula III, CuFe 0.5 Mn 0.5 O 2.5 , CuFe 0.5 Al 0.5 O 2.5 , CuFe 0.5 Al 0.25 Mn 0.5 O 2.5 , a compound of formula IV, a compound of formula V, CuFe 0.5 B 0.5 O 2.5 , CuNi 0.5 B 0.5 O 2.5 , CuGa 0.5 B 0.5 O 2.5 , CuB 0.7 O 2 , and a compound of formula VI,

CuFeO 4-δ   (III),

MgGa 2 O 4-λ   (IV),

NiMoO 4-μ   (V),

Ca α Cu 1-α TiO 3-β   (VI),

wherein 0<δ≦3, 0<λ≦3, 0<μ≦3, 0≦α<1 and β is about 0-2.

17. An ink composition, comprising a metal compound and an ink vehicle,

wherein the metal compound includes at least one selected from a group consisting of a compound of formula I and a compound of formula II,

TiO 2-σ   (I),

M 1 M 2 p O q   (II),

wherein 0.05≦σ<1.8,

0<p≦2, and

0<q<4, and

wherein M 1 includes one element selected from a group consisting of group 11 of the periodic table according to IUPAC nomenclature,

M 2 includes one element selected from a group consisting of group 8 of the periodic table according to IUPAC nomenclature.

18. The composition according to claim 17 , wherein M 1 is Cu and M 2 is Fe.

19. An article obtained by a method of metalizing a surface of an insulation substrate, the method comprising the steps of:

applying an ink composition onto a surface to be metalized of the insulation substrate to obtain an insulation substrate with an ink layer; and

plating at least one metal layer onto the insulation substrate with the ink layer,

wherein the ink composition comprises a metal compound and an ink vehicle,

wherein the metal compound includes at least one selected from a group consisting of a compound of formula I and a compound of formula II,

TiO 2-σ   (I),

M 1 M 2 p O q   (II),

wherein 0.05≦σ<1.8,

M 1 includes at least one element selected from a group consisting of groups 2, 9-12 of the periodic table according to IUPAC nomenclature,

M 2 includes at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table according to IUPAC nomenclature, and

0<p≦2, and

0<q<4.