Encapsulants for photovoltaic modules
View Patent ↗A photovoltaic (PV) Module can include a substantially transparent cover, first encapsulant, a solar cell and a second encapsulant. The second encapsulant can be configured to allow thermal communication between the solar cell and a heat sink. Various configurations and methods of making the same are presented.
1. A method for manufacturing a photovoltaic (PV) module, the method comprising:
forming a plurality of encapsulant regions on a substantially transparent cover;
spreading the plurality of encapsulant regions on the substantially transparent cover;
placing a first solar cell on the plurality of encapsulant regions;
placing another encapsulant over the first solar cell;
bonding the plurality of encapsulant regions and the another encapsulant to the first solar cell;
forming a backsheet on the another encapsulant;
forming a thermal interface material (TIM) on the backsheet;
forming a heat sink on the TIM; and
forming fins on the heat sink.
2. The method of claim 1 , wherein spreading the plurality of encapsulant regions comprises:
placing an edge of an applicator over the substantially transparent cover; and
applying the applicator on the plurality of encapsulant regions.
3. The method of claim 2 , wherein placing the edge of the applicator includes placing the edge of the applicator 0.1-2.0 mm away from the substantially transparent cover.
4. The method of claim 2 , further comprising:
placing an edge of an applicator a distance away from the substantially transparent cover; and
applying the applicator to the plurality of encapsulant regions, wherein placing an edge of an applicator a distance away from the substantially transparent cover substantially uniformly forms the plurality encapsulant regions with a thickness in a range of 50-500 microns.
5. The method of claim 2 , wherein applying the applicator substantially uniformly spreads the plurality of encapsulant regions.
6. The method of claim 2 , wherein applying an applicator comprises applying a blade, a glass blade, a squeegee or a rubber squeegee on the plurality of encapsulant regions.
7. The method of claim 1 , wherein forming a plurality of encapsulant regions comprises forming a plurality of silicon lines.
8. The method of claim 1 , wherein forming the plurality of silicon lines comprises regularly spacing the plurality of encapsulant regions approximately 1-25 cm apart.
9. The method of claim 1 , wherein bonding the plurality of encapsulant regions and the another encapsulant comprises curing the plurality of encapsulant regions and the another encapsulant.
10. The method of claim 1 , wherein bonding the plurality of encapsulant regions and the another encapsulant comprises cross-linking the plurality of encapsulant regions and the another encapsulant.
11. A method for manufacturing a photovoltaic (PV) module, the method comprising:
forming a liquid encapsulant in a first direction on a substantially transparent cover;
applying an applicator in a second direction to the liquid encapsulant, wherein the second direction is different than the first direction;
placing a first solar cell on the liquid encapsulant;
forming another encapsulant over the first solar cell;
bonding the liquid encapsulant and the another encapsulant to the first solar cell;
forming a backsheet on the another encapsulant;
forming a thermal interface material (TIM) on the backsheet;
forming a heat sink on the TIM; and
forming fins on the heat sink.
12. The method of claim 11 , applying the applicator includes applying an edge of the applicator approximately 0.1-2.0 mm away from the substantially transparent cover.
13. The method of claim 11 , wherein applying the applicator in a second direction substantially uniformly spreads the liquid encapsulant over the substantially transparent cover.
14. The method of claim 11 , wherein applying the applicator comprises applying a blade, a glass blade, a squeegee or a rubber squeegee on the plurality of encapsulant regions.
15. The method of claim 11 , wherein forming the liquid encapsulant comprises forming a plurality of silicon lines.
16. A method for manufacturing a photovoltaic (PV) module, the method comprising:
forming a plurality of encapsulant regions on a cover;
spreading the plurality of encapsulant regions on the cover;
placing a first solar cell on the plurality of encapsulant regions;
placing another encapsulant over the first solar cell;
bonding the plurality of encapsulant regions and the another encapsulant to the first solar cell;
forming a backsheet on the another encapsulant;
forming a thermal interface material (TIM) on the backsheet;
forming a heat sink on the TIM; and
forming fins on the heat sink.
17. The method of claim 16 , wherein spreading the plurality of encapsulant regions comprises:
placing an edge of an applicator over the cover; and
applying the applicator on the plurality of encapsulant regions.
18. The method of claim 17 , wherein placing the edge of the applicator includes placing the edge of the applicator 0.1-2.0 mm away from the cover.
19. The method of claim 17 , further comprising:
placing an edge of an applicator a distance away from the cover; and
applying the applicator to the plurality of encapsulant regions, wherein placing an edge of an applicator a distance away from the cover substantially uniformly forms the plurality encapsulant regions with a thickness in a range of 50-500 microns.
20. The method of claim 17 , wherein applying the applicator substantially uniformly spreads the plurality of encapsulant regions.