BOARD, MOUNTING STRUCTURE OF SURFACE MOUNTING COMPONENT, AND ELECTRONIC DEVICE
A mounting structure of a surface mounting component is configured by connecting the surface mounting component to a board at the vicinity of an end portion by soldering. A concave portion is formed between joint portions for the soldering in a range in which the surface mounting component of the board is mounted.
1 . A mounting structure for a surface mounting component, the mounting structure comprising:
a substrate;
a first copper foil layer portion and a second copper foil layer portion disposed on and in direct contact with the substrate, the first copper foil layer portion and the second copper foil layer portions defining a gap therebetween on the substrate, the gap having a first edge at the first copper foil layer portion and a second edge at the second copper foil layer portion;
a first contact pad disposed over the first copper foil layer portion and a second contact pad disposed over the second copper foil layer portion, the first contact pad set back from the first edge by a setback region, the second contact pad set back from the second edge by a second setback region; and
a first resist portion disposed on and in direct contact with the substrate within the first setback region, and a second resist portion disposed on and in direct contact with the substrate within the second setback region,
wherein the gap defines a concave portion of the mounting structure,
and wherein the first contact pad and the second contact pad are receptive to mounting of the surface mounting component for electrical connection of the surface mounting component to the mounting structure.
2 . The mounting structure of claim 1 , wherein the mounting structure has a first state in which the mounting structure is not flexed and in which the gap has a default height defined between a bottom surface of the surface mounting component and a top surface of the substrate such that the gap remains open.
3 . The mounting structure of claim 2 , wherein the mounting structure has a second state in which the mounting structure is partially flexed and in which a height of the gap decreases to a non-zero height less than the default height but such that the gap remains open, the concave portion of the gap preventing the electrical connection of the surface mounting component from being broken as a result of partial flexure of the mounting structure.
4 . The mounting structure of claim 3 , wherein the mounting structure has a third state in which the mounting structure is maximally flexed and in which the of the gap decreases to a zero height such that the bottom surface of the surface mounting component makes contact with the top surface of the substrate, the concave portion of the gap preventing the electrical connection of the surface mounting component from being broken as a result of maximal flexure of the mounting structure.
5 . A board for an electronic device, the board comprising:
a mounting structure for a surface mounting component, the mounting structure comprising:
a substrate;
a first copper foil layer portion and a second copper foil layer portion disposed on and in direct contact with the substrate, the first copper foil layer portion and the second copper foil layer portions defining a gap therebetween on the substrate, the gap having a first edge at the first copper foil layer portion and a second edge at the second copper foil layer portion;
a first contact pad disposed over the first copper foil layer portion and a second contact pad disposed over the second copper foil layer portion, the first contact pad set back from the first edge by a setback region, the second contact pad set back from the second edge by a second setback region; and
a first resist portion disposed on and in direct contact with the substrate within the first setback region, and a second resist portion disposed on and in direct contact with the substrate within the second setback region,
wherein the gap defines a concave portion of the mounting structure,
and wherein the first contact pad and the second contact pad are receptive to mounting of the surface mounting component for electrical connection of the surface mounting component to the mounting structure.
6 . The board of claim 5 , wherein the mounting structure has a first state in which the mounting structure is not flexed and in which the gap has a default height defined between a bottom surface of the surface mounting component and a top surface of the substrate such that the gap remains open.
7 . The board of claim 6 , wherein the mounting structure has a second state in which the mounting structure is partially flexed and in which a height of the gap decreases to a nonzero height less than the default height but such that the gap remains open, the concave portion of the gap preventing the electrical connection of the surface mounting component from being broken as a result of partial flexure of the mounting structure.
8 . The board of claim 7 , wherein the mounting structure has a third state in which the mounting structure is maximally flexed and in which the of the gap decreases to a zero height such that the bottom surface of the surface mounting component makes contact with the top surface of the substrate, the concave portion of the gap preventing the electrical connection of the surface mounting component from being broken as a result of maximal flexure of the mounting structure.
9 . An electronic device comprising:
a logic board having a mounting structure for a surface mounting component: the mounting structure comprising:
a substrate;
a first copper foil layer portion and a second copper foil layer portion disposed on and in direct contact with the substrate, the first copper foil layer portion and the second copper foil layer portions defining a gap therebetween on the substrate, the gap having a first edge at the first copper foil layer portion and a second edge at the second copper foil layer portion;
a first contact pad disposed over the first copper foil layer portion and a second contact pad disposed over the second copper foil layer portion, the first contact pad set back from the first edge by a setback region, the second contact pad set back from the second edge by a second setback region; and
a first resist portion disposed on and in direct contact with the substrate within the first setback region, and a second resist portion disposed on and in direct contact with the substrate within the second setback region,
wherein the gap defines a concave portion of the mounting structure,
and wherein the first contact pad and the second contact pad are receptive to mounting of the surface mounting component for electrical connection of the surface mounting component to the mounting structure.
10 . The board of claim 9 , wherein the mounting structure has a first state in which the mounting structure is not flexed and in which the gap has a default height defined between a bottom surface of the surface mounting component and a top surface of the substrate such that the gap remains open.
11 . The board of claim 10 , wherein the mounting structure has a second state in which the mounting structure is partially flexed and in which a height of the gap decreases to a non-zero height less than the default height but such that the gap remains open, the concave portion of the gap preventing the electrical connection of the surface mounting component from being broken as a result of partial flexure of the mounting structure.
12 . The board of claim 11 , wherein the mounting structure has a third state in which the mounting structure is maximally flexed and in which the of the gap decreases to a zero height such that the bottom surface of the surface mounting component makes contact with the top surface of the substrate, the concave portion of the gap preventing the electrical connection of the surface mounting component from being broken as a result of maximal flexure of the mounting structure.