SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

1 . A semiconductor device, comprising:

a semiconductor substrate having a main surface;

a first gate electrode formed over the main surface;

a second gate electrode formed so as to be adjacent to the first gate electrode over the main surface;

an insulating film extending from a region interposed between the second gate electrode and the semiconductor substrate in continuous relation to a region interposed between the first gate electrode and the second gate electrode; and

a pair of a source region and a drain region formed in the main surface such that at least a channel region immediately under the first gate electrode is interposed therebetween,

wherein the first gate electrode is formed of a semiconductor layer containing an impurity of a first conductivity type,

wherein the second gate electrode is formed of a semiconductor layer containing an impurity of a second conductivity type,

wherein each of the source region and the drain region contains an impurity of the first conductivity type, and

wherein the source region includes a first source region, and a second source region having a concentration of the impurity of the first conductivity type higher than that of the first source region.

2 . A semiconductor device according to claim 1 ,

wherein the first conductivity type is an n-type and the second conductivity type is a p-type.

3 . A semiconductor device according to claim 1 ,

wherein the insulating film includes:

a first insulating film including a silicon oxide film;

a second insulating film including a silicon nitride film and covering an upper surface of the first insulating film; and

a third insulating film including a silicon oxide film and covering an upper surface of the second insulating film.

4 . A semiconductor device according to claim 3 ,

wherein the third insulating film contains nitrogen.

5 . A semiconductor device according to claim 1 ,

wherein the drain region includes:

a first drain region; and

a second drain region having a concentration of the impurity of the first conductivity type lower than that of the first drain region.

6 . A semiconductor device according to claim 1 , further comprising:

a source-side sidewall insulating film formed on a side of the second gate electrode where the source region is located so as to be adjacent to the second gate electrode,

wherein the first source region is located immediately under the source-side sidewall insulating film, and

wherein the second source region is located externally of the source-side sidewall insulating film.

7 . A semiconductor device according to claim 5 , further comprising:

a drain-side sidewall insulating film formed on a side of the first gate electrode where the drain region is located so as to be adjacent to the first gate electrode,

wherein the first drain region is located immediately under the drain-side sidewall insulating film, and

wherein the second drain region is located externally of the drain-side sidewall insulating film.

8 . A semiconductor device according to claim 1 ,

wherein the second source region is located externally of the second gate electrode, and

wherein the first source region is located so as to come in contact with a lower surface of the second source region.

9 . A semiconductor device according to claim 5 ,

wherein the second drain region is located externally of the first gate electrode, and

wherein the first drain region is located so as to come in contact with a lower surface of the second drain region.

10 . A method of manufacturing a semiconductor device, comprising the steps of:

providing a semiconductor substrate having a main surface;

forming, over the main surface, a first gate electrode, and a dummy gate electrode adjacent to the first gate electrode;

forming a source region in the main surface using the dummy gate electrode as a mask;

removing the dummy gate electrode;

forming, over the main surface, a second gate electrode adjacent to the first gate electrode after the dummy gate electrode is removed; and

forming, in a state where the second gate electrode is covered, a drain region in a portion of the main surface which is located on a side of the first and second gate electrodes opposite to a side thereof where the source region is located,

wherein, in the step of forming the first gate electrode, an impurity of a first conductivity type is introduced into a semiconductor film intended to serve as the first gate electrode,

wherein, in the step of forming the second gate electrode, an impurity of a second conductivity type is introduced into a semiconductor film intended to serve as the second gate electrode,

wherein, in the steps of forming the source region and the drain region, an impurity of the first conductivity type is implanted into the semiconductor substrate, and

wherein the step of forming the source region includes the steps of:

forming a first source region; and

forming a second source region having a concentration of the impurity of the first conductivity type higher than that of the first source region.

11 . A method of manufacturing a semiconductor device according to claim 10 ,

wherein the first conductivity type is an n-type and the second conductivity type is a p-type.

12 . A method of manufacturing a semiconductor device according to claim 10 , further comprising the step of:

forming an insulating film extending from a region interposed between the second gate electrode and the semiconductor substrate in continuous relation to a region interposed between the first gate electrode and the second gate electrode,

wherein the insulating film includes:

a first insulating film including a silicon oxide film;

a second insulating film including a silicon nitride film and covering an upper surface of the first insulating film; and

a third insulating film including a silicon oxide film and covering an upper surface of the second insulating film.

13 . A method of manufacturing a semiconductor device according to claim 12 ,

wherein the third insulating film contains nitrogen.

14 . A method of manufacturing a semiconductor device according to claim 10 ,

wherein the step of forming the drain region includes the steps of:

forming a first drain region; and

forming a second drain region having a concentration of the impurity of the first conductivity type higher than that of the first drain region.

15 . A method of manufacturing a semiconductor device according to claim 10 , further comprising the step of:

forming a dummy-source-side sidewall insulating film on a side of the dummy gate electrode where the source region is located such that the dummy-source-side sidewall insulating film is adjacent to the dummy gate electrode,

wherein, in the step of forming the first source region, the first source region is formed in the main surface using the dummy gate electrode as a mask, and

wherein, in the step of forming the second source region, the second source region is formed in the main surface using the dummy-source-side sidewall insulating film as a mask.

16 . A method of manufacturing a semiconductor device according to claim 14 , further comprising the step of:

forming a drain-side sidewall insulating film on a side of the first gate electrode where the drain region is located such that the drain-side sidewall insulating film is adjacent to the first gate electrode,

wherein, in the step of forming the first drain region, the first drain region is formed in the main surface using the first gate electrode as a mask, and

wherein, in the step of forming the second drain region, the second drain region is formed in the main surface using the drain-side sidewall insulating film as a mask.

17 . A method of manufacturing a semiconductor device according to claim 14 , further comprising the step of:

forming a drain-side sidewall insulating film on a side of the first gate electrode where the drain region is located such that the drain-side sidewall insulating film is adjacent to the first gate electrode,

wherein, in the step of forming the second drain region, the second drain region is formed in a portion of the main surface which is located externally of the first gate electrode using the drain-side sidewall insulating film as a mask, and

wherein, in the step of forming the first drain region, the first drain region is formed so as to come in contact with a lower surface of the second drain region using the drain-side sidewall insulating film as a mask.

18 . A method of manufacturing a semiconductor device according to claim 10 , further comprising the step of:

forming a dummy-source-side sidewall insulating film on a side of the dummy gate electrode where the source region is located such that the dummy-source-side sidewall insulating film is adjacent to the dummy gate electrode,

wherein, in the step of forming the second source region, the second source region is formed in the main surface using the dummy-source-side sidewall insulating film as a mask,

wherein, in the step of forming the first source region, the first source region is formed so as to come in contact with a lower surface of the second source region using the dummy-source-side sidewall insulating film as a mask,

wherein the step of forming the source region further includes the step of:

forming a third source region other than the first and second source regions, and

wherein, in the step of forming the third source region, the third source region is formed in the main surface using the dummy gate electrode as a mask.