Land grid array interconnect formed with discrete pads

1. A land grid array, comprising: a grid array of metal pads plated directly onto a printed circuit board having a plurality of conductive vias, wherein the plated metal pads cover the conductive vias; and a discrete metal pad soldered to each of the plated metal pads in the grid array with a layer of solder between the plated metal pads and each discrete metal pads and each discrete metal pad, wherein each discrete metal pad is positioned directly over one of the plated metal pads, wherein each discrete metal pad is positioned directly over one of the plated metal pads, wherein each discrete metal pad has an exposed contact surface after soldering, and wherein a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

2. The land grid array of claim 1 , wherein the discrete metal pads have a base metal core plated with one or more metals.

3. The land grid array of claim 1 , further comprising:

a via in a plurality of the plated metal pads, wherein the discrete metal pads cover the via.

4. The land grid array of claim 1 , wherein the exposed contact surface of the discrete metal pads is plated with gold for contact with a surface mounted component.

5. The land grid array of claim 1 , wherein the discrete pads have a copper core plated with another metal, and wherein the thickness of the copper core varies among the individual discrete pads.

6. The land grid array of claim 5 , wherein the copper core is plated on all sides with nickel.

7. The land grid array of claim 5 , wherein the discrete pads have a tin plated surface that is soldered to the plated copper pad.