IP Library Granted Patent US 9,498,142
Granted Patent B2
US 9,498,142 · App. 14/323,163 · Granted Nov 22, 2016

Multi-layered structure and method

Inventors: Jami A. Hafiz (Cedar Park, TX); Stefan Schibli (Frankfurt am Main, DE); Jens Troetzschel (Ronneburg-Neuwiedermus, DE)
Assignee: Heraeus Deutschland GmbH & Co. KG
A61B5/04A61B5/6846A61B5/6851A61N1/05B21F19/00H01B1/127H01B1/128H01B3/307H01B7/048A61B2562/125A61M2025/09108C08G2261/1424C08G2261/3223C08G2261/51C08G2261/65C08G2261/70C08G2261/79C08G2261/90H01L51/0037
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Quick Facts
Patent No.
US 9,498,142
App. No.
14/323,163
Granted
Nov 22, 2016
Kind
B2
Abstract

One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.

Claims (23)

1. A method for producing a layered structure comprising:

providing a substrate having a thickness and comprising a material that is biocompatible;

forming a first layer onto at least part of the substrate, the first layer being a first biocompatible polymer;

forming a second layer onto at least part of the first layer, the second layer being a second biocompatible polymer;

wherein the substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive; and

characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one tenth of the thickness of the substrate and such that each are configured for implantation within the human body.

2. The method according to claim 1 , wherein at least one of the first and second layers comprises an electrically conductive PEDOT material.

3. The method according to claim 1 characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one fiftieth of the thickness of the substrate.

4. The method according to claim 1 , wherein forming of at least one of the first and second layers comprises masking ends of the layer to define contact areas that are configured for attaching an electrically conducting contact.

5. The method according to claim 1 , wherein forming of at least one of the first and second layers comprises using a conductive PEDOT polymer followed by using a chemical etch to change at least portions of the layer from conductive to insulative.

6. The method according to claim 1 , further comprising forming a third layer over the second layer, the third layer comprising an insulative photoresist material.

7. A method for producing a layered cylindrical structure comprising:

providing a substrate having a diameter and comprising a material that is biocompatible;

forming a first layer onto at least part of the substrate, the first layer being a first biocompatible polymer;

forming a second layer onto at least part of the first layer, the second layer being a second biocompatible polymer, such that both the first and second layers are configured for implantation within the human body;

wherein the substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive; and

characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers has a thickness that is no more than one tenth of the diameter of the substrate such that overall dimensions of the layered structure are substantially determined by the diameter of the substrate.

8. The method of claim 7 , wherein providing the substrate comprises providing one of a wire and a needle.

9. The method according to claim 7 , wherein at least one of the first and second layers comprises an electrically conductive PEDOT material.

10. The method according to claim 7 characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one fiftieth of the thickness of the substrate.

11. The method according to claim 7 , wherein forming of at least one of the first and second layers comprises masking ends of the layer to define contact areas that are configured for attaching an electrically conducting contact.

12. The method according to claim 7 , wherein forming of at least one of the first and second layers comprises using a conductive PEDOT polymer followed by using a chemical etch to change at least portions of the layer from conductive to insulative.

13. The method according to claim 7 , further comprising forming a third layer over the second layer, the third layer comprising an insulative photoresist material.

Assignments (2)
CHANGE OF NAME Recorded Nov 6, 2015
From: HERAEUS PRECIOUS METALS GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 037056/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2015
From: HAFIZ, JAMI A.; SCHIBLI, STEFAN; TROETZSCHEL, JENS
To: HERAEUS PRECIOUS METALS GMBH & CO. KG
Reel/Frame 035012/0970 →
Continuity (1)
Related Publication 20160005509A1 · Jan 7, 2016