Image capturing module for increasing assembly flatness and shortening focusing time and method of assembling the same

1. An image capturing module for increasing assembly flatness and shortening focusing time, comprising:

an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the image sensing chip has a first horizontal top surface on the top side thereof, and the first horizontal top surface is obtained by a horizontal correction system using a laser light source;

a housing frame disposed on the carrier substrate to surround the image sensing chip;

an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly disposed inside the lens holder and above the image sensing chip, the lens holder includes a surrounding movable member movably disposed therein, the movable lens assembly is fixed inside the surrounding movable member through at least two separate bonding glue, and the movable lens assembly is movably disposed inside the lens holder through the surrounding movable member; and

a reflecting material temporarily placed on the top side of the movable lens assembly, wherein the reflecting material has a second horizontal top surface on the top side thereof, and the second horizontal top surface is obtained by the horizontal correction system using the laser light source;

wherein the first horizontal top surface of the image sensing chip and the second horizontal top surface of the reflecting material are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip;

wherein the distance from the laser light source to the first horizontal top surface of the image sensing chip is defined as a first vertical distance, the distance from the laser light source to the second horizontal top surface of the reflecting material is defined as a second vertical distance, and a predetermined fixed focusing distance from the second horizontal top surface of the reflecting material to the first horizontal top surface of the image sensing chip is obtained by subtracting the second vertical distance from the first vertical distance, for shortening the focusing time of the movable lens assembly relative to the image sensing chip.

2. The image capturing module of claim 1 , wherein the movable lens assembly has a first plane on the top side thereof, the reflecting material has a second plane on the bottom side thereof and corresponding to the first plane, and the second plane is horizontal to the second horizontal top surface, wherein the reflecting material is movably disposed on the first plane of the movable lens assembly, and the reflecting material is one of a total-reflective substance and a semi-reflective substance.

3. The image capturing module of claim 2 , wherein the reflecting material has a first predetermined thickness, the movable lens assembly has a second predetermined thickness, the distance from the first plane of the movable lens assembly to the first horizontal top surface of the image sensing chip is defined as a third vertical distance, the distance from the bottom side of the movable lens assembly to the first horizontal top surface of the image sensing chip is defined as a fourth vertical distance, and both the third vertical distance and the first predetermined distance or all of the fourth vertical distance, the first predetermined distance and the second predetermined distance add up to around the predetermined fixed focusing distance.

4. The image capturing module of claim 1 , wherein the laser light source is disposed on a predetermined position above the image sensing chip to generate a first laser light beam that is directly projected onto the first horizontal top surface of the image sensing chip, and the first laser light beam generated by the laser light source is reflected by the first horizontal top surface of the image sensing chip to form a first reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

5. The image capturing module of claim 1 , wherein the laser light source is disposed on a predetermined position above the reflecting material to generate a second laser light beam that is directly projected onto the second horizontal top surface of the reflecting material, and the second laser light beam generated by the laser light source is reflected by the second horizontal top surface of the reflecting material to form a second reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

6. An image capturing module for increasing assembly flatness and shortening focusing time, comprising:

an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the image sensing chip has a first horizontal top surface on the top side thereof, wherein the first horizontal top surface is obtained by a horizontal corrections system using a laser light source;

a housing frame disposed on the carrier substrate to surround the image sensing chip;

an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the image sensing chip, and the movable lens assembly has a first plane on the top side thereof; and

a reflecting material movably and temporarily placed on the first plane of the movable lens assembly, wherein the reflecting material has a second horizontal top surface on the top side thereof, the reflecting material has a second plane on the bottom side thereof and corresponding to the first plane, and the second plane is horizontal to the second horizontal top surface;

wherein the first horizontal top surface of the image sensing chip and the second horizontal top surface of the reflecting material are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip;

wherein the distance from the laser light source to the first horizontal top surface of the image sensing chip is defined as a first vertical distance, the distance from the laser light source to the second horizontal top surface of the reflecting material is defined as a second vertical distance, and a predetermined fixed focusing distance from the second horizontal top surface of the reflecting material to the first horizontal top surface of the image sensing chip is obtained by subtracting the second vertical distance from the first vertical distance, for shortening the focusing time of the movable lens assembly relative to the image sensing chip.

7. The image capturing module of claim 6 , wherein the reflecting material has a first predetermined thickness, the movable lens assembly has a second predetermined thickness, the distance from the first plane of the movable lens assembly to the first horizontal top surface of the image sensing chip is defined as a third vertical distance, the distance from the bottom side of the movable lens assembly to the first horizontal top surface of the image sensing chip is defined as a fourth vertical distance, and both the third vertical distance and the first predetermined distance or all of the fourth vertical distance, the first predetermined distance and the second predetermined distance add up to around the predetermined fixed focusing distance.

8. A method of assembling an image capturing module for increasing assembly flatness and shortening focusing time, comprising:

providing an image sensing unit and a housing frame, wherein the image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, and the housing frame is disposed on the carrier substrate to surround the image sensing chip;

obtaining a first horizontal top surface on the top side of the image sensing chip by a horizontal correction system using a laser light source, wherein the distance from the laser light source to the first horizontal top surface of the image sensing chip is defined as a first vertical distance;

providing an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly disposed inside the lens holder and above the image sensing chip, and the lens holder includes a surrounding movable member movably disposed therein;

temporarily placing a reflecting material on the top side of the movable lens assembly;

obtaining a second horizontal top surface on the top side of the reflecting material by the horizontal correction system using the laser light source, wherein the distance from the laser light source to the second horizontal top surface of the reflecting material is defined as a second vertical distance, and the first horizontal top surface of the image sensing chip and the second horizontal top surface of the reflecting material are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip;

adjusting the focal length of the movable lens assembly relative to the first horizontal top surface of the image sensing chip, so as to move the reflecting material upwardly and downwardly until the distance from the laser light source to the second horizontal top surface of the reflecting material is substantially equal to a preset value that is defined as the second vertical distance, wherein a predetermined fixed focusing distance from the second horizontal top surface of the reflecting material to the first horizontal top surface of the image sensing chip is obtained by subtracting the second vertical distance from the first vertical distance, for shortening the focusing time of the movable lens assembly relative to the image sensing chip;

fixing the movable lens assembly inside the surrounding movable member through at least two separate bonding glue, wherein the movable lens assembly is movably disposed inside the lens holder through the surrounding movable member; and

removing the reflecting material from the top side of the movable lens assembly.

9. The method of claim 8 , wherein the laser light source is disposed on a predetermined position above the image sensing chip to generate a first laser light beam that is directly projected onto the first horizontal top surface of the image sensing chip, and the first laser light beam generated by the laser light source is reflected by the first horizontal top surface of the image sensing chip to form a first reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.

10. The method of claim 8 , wherein the laser light source is disposed on a predetermined position above the reflecting material to generate a second laser light beam that is directly projected onto the second horizontal top surface of the reflecting material, and the second laser light beam generated by the laser light source is reflected by the second horizontal top surface of the reflecting material to form a second reflecting light beam that is directly projected onto the predetermined position or very close to the predetermined position.