IP Library Granted Patent US 9,468,997
Granted Patent B2
US 9,468,997 · App. 14/324,596 · Granted Oct 18, 2016

Apparatus and method for conductive cooling of an information handling system

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Quick Facts
Patent No.
US 9,468,997
App. No.
14/324,596
Granted
Oct 18, 2016
Kind
B2
Abstract

An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs.

Claims (30)

1. An apparatus for cooling an information handling system, the apparatus comprising:

a panel having a first surface and a second surface;

a vent area formed in the panel, the vent area including a perimeter, an interior section and a plurality of ribs that extend across the interior section, the vent area further including a plurality of openings defined by lateral spacing between the ribs, the openings extending through the panel from the first to the second surface, the openings configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings;

a conductive heat sink layer physically attached to the first surface of the panel, the conductive heat sink layer covering a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the rib; and

a mounting layer disposed between the panel and the conductive heat sink layer, wherein the mounting layer comprises a support sheet disposed between a first adhesive layer and a second adhesive layer to securely attach the conductive heat sink layer to the vent area of the panel.

2. The apparatus of claim 1 , wherein the conductive heat sink layer is formed from a mixture of graphene and graphite.

3. The apparatus of claim 2 , wherein the mixture comprises 30 to 80 weight percent graphene and a remaining weight percent of graphite.

4. An information handling system having at least one component to be cooled, the information handling system comprising:

a panel for the information handling system, the panel having a first surface and a second surface;

a vent area formed in the panel, the vent area including a perimeter, an interior section and a plurality of ribs that extend across the interior section, the vent area further including a plurality of openings defined by lateral spacing between the ribs, the openings extending through the panel from the first to the second surface, the openings configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings;

a conductive heat sink layer physically attached to the first surface of the panel, the conductive heat sink layer covering a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs; and

a mounting layer disposed between the panel and the conductive heat sink layer, wherein the mounting layer comprises a support sheet disposed between a first adhesive layer and a second adhesive layer to securely attach the conductive heat sink layer to the vent area of the panel.

5. The information handling system of claim 4 , wherein the conductive heat sink layer is formed from a mixture of graphene and graphite.

6. The information handling system of claim 5 , wherein the mixture comprises 30 to 80 weight percent graphene and a remaining weight percent of graphite.

7. A method of cooling an information handling system, the method comprising:

providing a panel for the information handling system, the panel having a first surface and a second surface;

forming a vent area in the panel, the vent area including a perimeter, an interior section and a plurality of ribs that extend across the interior section, the vent area further including a plurality of openings defined by lateral spacing between the ribs, the openings extending through the panel from the first to the second surface, the openings configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings;

attaching a conductive heat sink layer to the first surface of the panel, the conductive heat sink layer covering a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs; and

attaching a mounting layer disposed between the panel and the conductive heat sink, wherein the mounting layer comprises a support sheet disposed between a first adhesive layer and a second adhesive layer to securely attach the conductive heat sink layer to the vent area of the panel.

8. The method of claim 7 , wherein the conductive heat sink layer is formed from a mixture of graphene and graphite.

9. The method of claim 8 , wherein the mixture comprises 30 to 80 weight percent graphene and a remaining weight percent of graphite.

10. The method of claim 7 , further comprising: cutting the mounting layer and the conductive heat sink layer to a pre-determined shape; laminating the mounting layer to the conductive heat sink layer; attaching the mounting layer and the conductive heat sink layer to the panel over the vent area; and forming the openings in the mounting layer and the conductive heat sink layer.

11. The method of claim 10 , further comprising:

placing the panel, the mounting layer and the conductive heat sink layer in an oven; and

heating the panel, the mounting layer and the conductive heat sink layer in the oven such that the heat conductive sheet, the mounting sheet and the panel bond.

12. The method of claim 10 , wherein the openings are formed by heat stamping.

13. The method of claim 10 , wherein the openings are formed by thermoforming.

14. The method of claim 7 , further comprising:

spraying a heat conductive composition over the vent area such that the heat conductive composition covers the vent area and the ribs; and

curing the first heat conductive composition wherein, the cured heat conductive composition forms the conductive heat sink layer.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF REEL 033625 FRAME 0748 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.; SECUREWORKS, INC.
Reel/Frame 040027/0050 →
RELEASE OF REEL 033625 FRAME 0688 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.; SECUREWORKS, INC.
Reel/Frame 040027/0757 →
RELEASE OF REEL 033625 FRAME 0711 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; COMPELLENT TECHNOLOGIES, INC.; SECUREWORKS, INC.
Reel/Frame 040016/0903 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded Aug 27, 2014
From: COMPELLENT TECHNOLOGIES, INC.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; SECUREWORKS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033625/0748 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Aug 27, 2014
From: COMPELLENT TECHNOLOGIES, INC.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; SECUREWORKS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 033625/0688 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Aug 27, 2014
From: COMPELLENT TECHNOLOGIES, INC.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; SECUREWORKS, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 033625/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2014
From: NORTH, TRAVIS C.; HSIEH, DUEN HSING; SHELNUTT, AUSTIN MICHAEL; AURONGZEB, DEEDER M.
To: DELL PRODUCTS, L.P.
Reel/Frame 033252/0360 →