IP Library Granted Patent US 9,384,315
Granted Patent B2
US 9,384,315 · App. 14/325,088 · Granted Jul 5, 2016

Method, system and computer program product for electrical and thermal analysis at a substrate level

Inventors: Mattia Monetti (Malnate, IT); Alberto Balzarotti (Corbetta, IT)
Assignee: STMICROELECTRONICS S.R.L.
G06F17/5072G06F17/5036G06F17/5081G06F17/5068G06F2217/78G06F2217/80
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Quick Facts
Patent No.
US 9,384,315
App. No.
14/325,088
Granted
Jul 5, 2016
Kind
B2
Abstract

A method for the automatic design of an electronic circuit includes operations for evaluation of the thermal effects in the electronic circuit. The method generates a layout of the electronic circuit. Abstract data at the substrate level associated to the layout of the electronic circuit is then generated. A grid of partitioning is generated with respect to a view regarding the aforesaid abstract into meshes and nodes. The grid is applied to the substrate. On the basis of the grid (TG), a list of nodes or netlist representing a thermal network that represents the thermal behavior of the substrate or of its portions or elements is extracted. The netlist is useful in simulation operations, in particular of a SPICE type, for making an evaluation of thermal effects in the electronic circuit.

Claims (90)

1. A non-transitory computer storage medium having stored thereon computer program code that, when executed by a processor, performs the steps of:

generating a layout of an electronic circuit;

generating abstract data at a level of a substrate that are associated to the layout of said electronic circuit;

generating a grid of partitioning, with respect to a view regarding said abstract data, into meshes and nodes and applying it to said substrate; and

extracting, on the basis of said partition grid, a list of nodes or netlist representing a thermal network that represents the thermal behavior of the substrate or of portions or elements of the substrate,

wherein said netlist is configured for use in simulation operations, in particular of a SPICE type, for making an evaluation of said thermal effects in said electronic circuit; and

supplying said netlist to one of an operation of simulation of the thermal behavior and an operation of coupled electro-thermal simulation which simulates simultaneously both the electrical behavior and the thermal behavior of the electronic circuit or of a device thereof, taking into account the interactions with the electronic circuit or with parts thereof.

2. The non-transitory computer storage medium according to claim 1 , wherein the computer program code further performs the steps of:

making an electro-thermal simulation via configuration of said simulation operation for operating with descriptions of models or sub-circuits of said electronic circuit defined as comprising a thermal node,

connecting to said thermal node an equivalent current generator that forces into said thermal node a current equivalent to the power dissipated in said model or sub-circuit, and

associating to a voltage that is set up on said thermal node an increase in temperature of the model or sub-circuit with respect to a global temperature by connecting to said thermal node a thermal network that represents a mutual heating of the electronic circuit and is represented by said netlist calculated to have as sources said model or sub-circuit and another heat source of the electronic circuit.

3. The non-transitory computer storage medium according to claim 2 , wherein the computer program code further performs the step of associating thermal capacities to the nodes which are calculated as a function of a volume of a corresponding element and of respective technological parameters which are associated between the node and a thermal-ground reference node.

4. The non-transitory computer storage medium according to claim 1 , wherein the computer program code further performs the steps of:

discriminating, in said layout, regions on the basis of a dissipation-based criterion;

dividing the electronic circuit according to a plurality of vertical layers;

separating each of said vertical layers into different areas on the basis of given technological parameters that identify said different areas; and

applying said grid to each area of each layer.

5. The non-transitory computer storage medium according to claim 4 , wherein applying said grid comprises applying a Delaunay triangular grid and obtaining from said Delaunay triangular grid corresponding Voronoi points.

6. The non-transitory computer storage medium according to claim 4 , wherein the computer program code further performs the steps of:

for each layer, analyzing grid elements obtained from generating the grid;

calculating thermal parameters to be associated to said grid element as a function of a technology-configuration file regarding the grid element analyzed; and

constructing a representation of the layer as a sparse matrix of said thermal parameters on the basis of said calculated thermal parameters.

7. The non-transitory computer storage medium according to claim 6 , wherein the computer program code further performs the steps of:

inserting sparse matrices of the layer into a general sparse matrix; and

converting said general sparse matrix into a complete netlist.

8. The non-transitory computer storage medium according to claim 6 , wherein the computer program code further performs the steps of:

extracting thermal dependences between two or more heat sources identified in said sparse matrix via the operations of:

reducing each source to a single node;

computing a reduced thermal matrix with the superposition principle separately from each source; and

extracting a corresponding reduced netlist.

9. A non-transitory computer storage medium having stored thereon computer program code that, when executed by a processor, performs the steps of:

generating a layout of an electronic circuit;

generating abstract data at a level of a substrate that are associated to the layout of said electronic circuit;

generating a grid of partitioning, with respect to a view regarding said abstract data, into meshes and nodes and applying it to said substrate; and

extracting, on the basis of said partition grid, a list of nodes or netlist representing a thermal network that represents the thermal behavior of the substrate or of portions or elements of the substrate in terms of both thermal conductances and thermal capacities,

wherein said netlist is configured for use in simulation operations, in particular of a SPICE type, for making an evaluation of said thermal effects in said electronic circuit.

10. The non-transitory computer storage medium according to claim 9 , wherein the computer program code further performs the step of supplying said netlist to one of an operation of simulation of the thermal behavior and an operation of coupled electro-thermal simulation which simulates simultaneously both the electrical behavior and the thermal behavior of the electronic circuit or of a device thereof, taking into account the interactions with the electronic circuit or with parts thereof.

11. The non-transitory computer storage medium according to claim 10 , wherein the computer program code further performs the steps of:

making an electro-thermal simulation via configuration of said simulation operation for operating with descriptions of models or sub-circuits of said electronic circuit defined as comprising a thermal node,

connecting to said thermal node an equivalent current generator that forces into said thermal node a current equivalent to the power dissipated in said model or sub-circuit, and

associating to a voltage that is set up on said thermal node an increase in temperature of the model or sub-circuit with respect to a global temperature by connecting to said thermal node a thermal network that represents a mutual heating of the electronic circuit and is represented by said netlist calculated to have as sources said model or sub-circuit and another heat source of the electronic circuit.

12. The non-transitory computer storage medium according to claim 11 , wherein the computer program code further performs the step of associating thermal capacities to the nodes which are calculated as a function of a volume of a corresponding element and of respective technological parameters which are associated between the node and a thermal-ground reference node.

13. The non-transitory computer storage medium according to claim 9 , wherein the computer program code further performs the steps of:

discriminating, in said layout, regions on the basis of a dissipation-based criterion;

dividing the electronic circuit according to a plurality of vertical layers;

separating each of said layers into different areas on the basis of given technological parameters that identify said different areas; and

applying said grid to each area of each layer.

14. The non-transitory computer storage medium according to claim 13 , wherein applying said grid comprises applying a Delaunay triangular grid and obtaining from said Delaunay triangular grid corresponding Voronoi points.

15. The non-transitory computer storage medium according to claim 13 , wherein the computer program code further performs the steps of:

for each layer, analyzing grid elements obtained from generating the grid;

calculating thermal parameters to be associated to said grid element as a function of a technology-configuration file regarding the grid element analyzed; and

constructing a representation of the layer as a sparse matrix of said thermal parameters on the basis of said thermal parameters.

16. The non-transitory computer storage medium according to claim 15 , wherein the computer program code further performs the steps of:

inserting sparse matrices of the layer into a general sparse matrix; and

converting said general sparse matrix into a complete netlist.

17. The non-transitory computer storage medium according to claim 15 , wherein the computer program code further performs the steps of:

extracting thermal dependences between two or more heat sources identified in said sparse matrix via the operations of:

reducing each source to a single node;

computing a reduced thermal matrix with the superposition principle separately from each source; and

extracting a corresponding reduced netlist.

18. A non-transitory computer storage medium having stored thereon computer program code that, when executed by a processor, performs the steps of:

generating a layout of an electronic circuit;

generating abstract data at a level of a substrate that are associated to the layout of said electronic circuit;

generating a grid of partitioning, with respect to a view regarding said abstract data, into meshes and nodes and applying it to said substrate, said grid including grid elements;

calculating thermal parameters for each grid element;

constructing a sparse matrix of said thermal parameters;

extracting thermal dependences between two or more heat sources identified in said sparse matrix via the operations of:

reducing each source to a single node;

computing, with the superposition principle separately from each heat source, a thermal matrix; and

extracting a corresponding thermal netlist representing a thermal network that represents the thermal behavior of the substrate or of its portions or elements of said substrate,

wherein said thermal netlist is configured for use in simulation operations, in particular of a SPICE type, for making an evaluation of said thermal effects in said electronic circuit.

19. The non-transitory computer storage medium according to claim 18 , wherein the computer program code further performs the steps of supplying said thermal netlist to one of an operation of simulation of the thermal behavior and an operation of coupled electro-thermal simulation which simulates simultaneously both the electrical behavior and the thermal behavior of the electronic circuit or of a device thereof, taking into account the interactions with the electronic circuit or with parts thereof.

20. The non-transitory computer storage medium according to claim 19 , wherein the computer program code further performs the steps of:

making an electro-thermal simulation via configuration of said simulation operation for operating with descriptions of models or sub-circuits of said electronic circuit defined as comprising a thermal node,

connecting to said thermal node an equivalent current generator that forces into said thermal node a current equivalent to the power dissipated in said model or sub-circuit, and

associating to a voltage that is set up on said thermal node an increase in temperature of the model or sub-circuit with respect to a global temperature by connecting to said thermal node a thermal network that represents a mutual heating of the electronic circuit and is represented by said thermal netlist calculated to have as sources said model or sub-circuit and another heat source of the electronic circuit.

21. The non-transitory computer storage medium according to claim 20 , wherein the computer program code further performs the step of associating thermal capacities to the nodes defined by said sparse matrix which are calculated as a function of a volume of a corresponding element and of respective technological parameters which are associated between the node and a thermal-ground reference node.

22. The non-transitory computer storage medium according to claim 18 , wherein the computer program code further performs the steps of:

discriminating, in said layout, regions on the basis of a dissipation-based criterion;

dividing the electronic circuit according to a plurality of vertical layers;

separating in each of said layers different areas on the basis of given technological parameters that identify said different areas; and

applying said grid to each area of each layer.

23. The non-transitory computer storage medium according to claim 22 , wherein applying said grid comprises applying a Delaunay triangular grid and obtaining from said Delaunay triangular grid corresponding Voronoi points.

24. The non-transitory computer storage medium according to claim 22 , wherein the computer program code further performs the steps of:

for each layer, analyzing grid elements obtained from generating the grid;

calculating thermal parameters to be associated to said grid element as a function of a technology-configuration file regarding the grid element analyzed; and

constructing the sparse matrix on the basis of said thermal parameters of the grid elements.

25. The non-transitory computer storage medium according to claim 24 , wherein the computer program code further performs the steps of:

inserting sparse matrices of the layer into a general sparse matrix; and

converting said general sparse matrix into said thermal netlist.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2014
From: MONETTI, MATTIA; BALZAROTTI, ALBERTO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 033254/0284 →
Priority Claims (1)
IT TO2013A0575 · Jul 9, 2013 · national
Continuity (1)
Related Publication 20150020040A1 · Jan 15, 2015