ELECTROPHORETIC APPARATUS, MANUFACTURING METHOD OF ELECTROPHORETIC APPARATUS, AND ELECTRONIC APPARATUS

1 . An electrophoretic apparatus comprising:

a first substrate;

a second substrate that is disposed to face the first substrate;

an electrophoretic layer that is disposed between the first substrate and the second substrate, and has a dispersion medium in which electrophoretic particles are dispersed;

a partition wall that is disposed to separate the electrophoretic layer into a plurality of cells;

a seal material that bonds the first substrate and the second substrate, and is disposed so as to surround the electrophoretic layer; and

a sealing film that is disposed at least between the partition wall and the second substrate, and has a low adhesive force,

wherein a top section of the partition wall is disposed in the sealing film.

2 . The electrophoretic apparatus according to claim 1 ,

wherein the sealing film does not include an adhesive material.

3 . The electrophoretic apparatus according to claim 1 ,

wherein a size of one side of a display region of the electrophoretic layer is 55 mm or less.

4 . The electrophoretic apparatus according to claim 3 ,

wherein a dummy pixel region that does not contribute to display is provided around the display region, and

wherein an end section of the sealing film overlaps with the dummy pixel region in a plan view.

5 . The electrophoretic apparatus according to claim 1 ,

wherein the sealing film includes a first sealing film that is disposed between the partition wall and the second substrate, and a second sealing film that is disposed between the first sealing film and the partition wall, and

wherein a portion of a contact surface between the first sealing film and the second sealing film, which overlaps with the partition wall in a plan view is positioned nearer to the side of the second substrate in a cross-sectional view, than a portion which does not overlap with the partition wall in a plan view.

6 . The electrophoretic apparatus according to claim 5 ,

wherein an elastic modulus of the first sealing film is 5 MPa or more and 40 MPa or less, and

wherein an elastic modulus of the second sealing film is 50 MPa or more and 600 MPa or less.

7 . The electrophoretic apparatus according to claim 5 ,

wherein a film thickness of the first sealing film is 2.5 μm or more and 7.5 μm or less, and

wherein a film thickness of the second sealing film is 0.05 μm or more and 0.5 μm or less.

8 . The electrophoretic apparatus according to claim 5 ,

wherein an amount of an additive to be added to the first sealing film is 5 wt % or more and 50 wt % or less in a solid content of the first sealing film.

9 . The electrophoretic apparatus according to claim 5 ,

wherein a volume resistivity of the first sealing film is 1×10 7 Ω·cm or more and 5×10   Ω·cm or less, and

wherein a volume resistivity of the second sealing film is 1×10 7 Ω·cm or more and 2×10 11 Ω·cm or less.

10 . A manufacturing method of an electrophoretic apparatus, comprising:

forming a partition wall on a first substrate to separate a dispersion medium including electrophoretic particles into a plurality of cells;

applying a seal material around a display region of the first substrate;

forming a sealing film having a low adhesive force on a second substrate that is disposed to face the first substrate;

supplying the dispersion medium in the display region of the first substrate; and

bonding the first substrate and the second substrate through the seal material and causing a top section of the partition wall to be indented into the sealing film.

11 . The manufacturing method of an electrophoretic apparatus according to claim 10 ,

wherein the sealing film is formed of a material that does not include an adhesive material.

12 . The manufacturing method of an electrophoretic apparatus according to claim 10 ,

wherein the bonding of the first substrate and the second substrate is performed under a pressure lower than atmospheric pressure while heating the sealing film.

13 . The manufacturing method of an electrophoretic apparatus according to claim 10 ,

wherein the forming of the sealing film includes

forming a first sealing film on the second substrate that is disposed to face the first substrate, and

forming a second sealing film so as to cover the first sealing film, and

wherein in causing the top section of the partition wall to be indented into the sealing film, the top section of the partition wall is indented into the first sealing film and the second sealing film.

14 . The manufacturing method of an electrophoretic apparatus according to claim 13 ,

wherein in the second sealing film, a film thickness is thin and film hardness is hard as compared to those in the first sealing film.

15 . The manufacturing method of an electrophoretic apparatus according to claim 13 ,

wherein an elastic modulus of the first sealing film is 5 MPa or more and 40 MPa or less, and

wherein an elastic modulus of the second sealing film is 50 MPa or more and 600 MPa or less.

16 . The manufacturing method of an electrophoretic apparatus according to claim 13 ,

wherein a film thickness of the first sealing film is 2.5 μm or more and 7.5 μm or less, and

wherein a film thickness of the second sealing film is 0.05 μm or more and 0.5 μm or less.

17 . The manufacturing method of an electrophoretic apparatus according to claim 13 ,

wherein an additive lowering the elastic modulus is added to a material of the second sealing film.

18 . The manufacturing method of an electrophoretic apparatus according to claim 13 ,

wherein an amount of additive to be added to the first sealing film is 5 wt % or more and 50 wt % or less in a solid content of the first sealing film.

19 . The manufacturing method of an electrophoretic apparatus according to claim 13 ,

wherein a volume resistivity of the first sealing film is 1×10 7 Ω·cm or more and 5×10 10 Ω·cm or less, and

wherein a volume resistivity of the second sealing film is 1×10 7 Ω·cm or more and 2×10 11 Ω·cm or less.

20 . An electronic apparatus comprising the electrophoretic apparatus according to claim 1 .