IP Library Granted Patent US 9,285,108
Granted Patent B2
US 9,285,108 · App. 14/326,053 · Granted Mar 15, 2016

Expanded heat sink for electronic displays

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Quick Facts
Patent No.
US 9,285,108
App. No.
14/326,053
Granted
Mar 15, 2016
Kind
B2
Abstract

A system for cooling various components of an electronic display. One or more heat-generating components are preferably placed in thermal communication with a plate and ribs. One or more fans are placed to draw cooling air along the ribs to remove the heat removed from the component. Some embodiments may place the electronic image assembly in thermal communication with the ribs to remove heat from the electronic image assembly. Exemplary embodiments have power modules and the electronic image assembly in thermal communication with the ribs. Conductive thermal communication is established between the ribs and the components in the exemplary embodiments.

Claims (49)

1. A system for cooling components in an electronic display having a direct LED backlight comprising:

a plate having a front and rear side and spaced apart from a rear surface of the LED backlight to define a channel where the plate is substantially parallel to the LED backlight;

an electronic component attached the rear side of the plate; and

a plurality of ribs placed between the rear surface of the LED backlight and the front side of the plate.

2. The cooling system of claim 1 further comprising:

a fan positioned to draw cooling air along the ribs.

3. The cooling system of claim 1 further comprising:

an isolated chamber which contains the ribs.

4. The cooling system of claim 2 wherein:

the ribs are elongate metallic members having lengths parallel to the path of the cooling air.

5. The cooling system of claim 1 wherein:

the plate provides a gaseous and contaminate barrier between the ribs and the component.

6. The cooling system of claim 1 wherein:

the ribs are positioned to absorb heat from the plate.

7. The cooling system of claim 1 wherein:

the ribs have a hollow rectangular cross-section.

8. The cooling system of claim 1 wherein:

the ribs have an I-beam cross-section.

9. The cooling system of claim 1 wherein:

the ribs have a honeycomb cross-section.

10. The cooling system of claim 2 further comprising:

an additional component attached to the plate.

11. The cooling system of claim 1 wherein:

The component is in conductive thermal communication with the plate.

12. The cooling system of claim 1 wherein:

the plate and ribs are metallic.

13. The cooling system of claim 1 wherein:

the component is a power module.

14. The cooling system of claim 1 further comprising:

an additional plate in thermal communication with the ribs.

15. A system for cooling components in an electronic display having a direct LED backlight comprising:

a plurality of ribs in conductive thermal communication with a rear surface of the LED backlight;

a plate attached to the ribs;

an electronic component separate from the LED backlight attached to the plate and in conductive thermal communication with the ribs; and

a fan positioned to draw cooling air along the ribs.

16. The cooling system of claim 15 wherein:

the rear surface of the LED backlight is a metal core printed circuit board.

17. The cooling system of claim 15 wherein:

the ribs are metallic.

18. The cooling system of claim 15 wherein:

the ribs and plate are in conductive thermal communication with each other.

19. A system for cooling components in an electronic display having a direct LED backlight comprising:

a plurality of ribs in conductive thermal communication with a rear surface of the LED backlight;

a plate attached to and in conductive thermal communication with the ribs;

an electronic component separate from the LED backlight attached to the plate and in conductive thermal communication with the ribs; and

a fan positioned to draw cooling air along the ribs,

wherein the plate prevents cooling air from contacting the electronic component.

20. The cooling system of claim 19 wherein:

the plate and ribs are metallic.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Aug 24, 2018
From: FIFTH THIRD BANK
To: MANUFACTURING RESOURCES INTERNATIONAL, INC
Reel/Frame 046924/0379 →
RELEASE OF SECURITY INTEREST Recorded Jun 15, 2018
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: MANUFACTURING RESOURCES INTERNATIONAL, INC
Reel/Frame 047227/0329 →
SECURITY INTEREST Recorded Jul 9, 2015
From: MANUFACTURING RESOURCES INTERNATIONAL, INC.
To: FIFTH THIRD BANK
Reel/Frame 036088/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2015
From: DUNN, WILLIAM; BEDELL, WARE; HUBBARD, TIM
To: MANUFACTURING RESOURCES INTERNATIONAL, INC.
Reel/Frame 035979/0288 →
SECURITY INTEREST Recorded Dec 4, 2014
From: MANUFACTURING RESOURCES INTERNATIONAL, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 034375/0074 →