Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.
1. A device to align and hold a plurality of singulated semiconductor components with a clamping carrier in the form of a plate, the clamping carrier comprising:
a plurality of receiving pockets arranged side-by-side, into which the semiconductor components are insertable;
stop elements for accurate positioning of the semiconductor components within the receiving pockets; and
spring elements for pressing the semiconductor components against the stop elements by means of spring force,
wherein the spring elements are part of a spring plate,
wherein the spring plate comprises:
a plurality of recesses arranged side-by-side and providing the corresponding plurality of receiving pockets for the semiconductor components, wherein the spring elements are formed monolithically from the spring plate in one piece, and
wherein the clamping carrier further comprises a multi-layer plate composite that comprises the spring plate, a base plate, or a cover plate both adjacent to the spring plate, wherein the spring plate extends at least over a major part of the base plate or the cover plate, and wherein the spring plate, the base plate or the cover plate are fastened to each other, and
wherein the spring plate consists of a flat plate.
2. The device according to claim 1 , wherein the spring elements consist of spring tongues that are arranged and can be moved in a plane of the spring plate, or parallel to the plane.
3. The device according to claim 1 , wherein the base plate is a flat plate that forms a bottom of the receiving pockets.
4. A device according to claim 1 , wherein the base plate has, arranged in the region of the receiving pockets, recesses for the introduction of the semiconductor components, wherein these recesses and the recesses of the spring plate overlay each other.
5. The device according to claim 1 , wherein the stop elements for accurate positioning of the semiconductor components are arranged on the cover plate or spring plate.
6. The device according to claim 1 , wherein the cover plate consists of a plane plate extending over at least the major part of the spring plate, and has recesses that are arranged above the recesses of the spring plate.
7. The device according to claim 1 , wherein the clamping carrier is designed for the accommodation of semiconductor components having pins, wherein the base plate has pin support elements, which extend through the recesses of the spring plate so as to form a support for the pins.
8. The device according to claim 1 , wherein the stop elements and the spring elements are part of a spring plate section.
9. The device according to claim 1 , wherein the multi-layer plate composite comprises individual plates.
10. The device according to claim 1 , wherein each of the plurality of recesses is formed by all layers of the multi-layer plate composite.
11. A device to align and hold a plurality of singulated semiconductor components with a clamping carrier in the form of a plate, the clamping carrier comprising:
a plurality of receiving pockets arranged side-by-side, into which the semiconductor components are insertable;
stop elements for accurate positioning of the semiconductor components within the receiving pockets; and
spring elements for pressing the semiconductor components against the stop elements by means of spring force,
wherein the spring elements are part of a spring plate,
wherein the spring plate comprises:
a plurality of recesses arranged side-by-side and providing the corresponding plurality of receiving pockets for the semiconductor components, wherein the spring elements are formed from the spring plate in one piece,
wherein the clamping carrier further comprises a multi-layer plate composite that comprises the spring plate and a base plate, or a cover plate, or both adjacent to the spring plate, wherein the spring plate extends at least over a major part of the base plate or the cover plate,
wherein the stop elements and the spring elements are part of a spring plate section, and
wherein the spring plate section is separated from a spring plate body.
12. The device according to claim 11 , wherein the spring plate section is connected to the spring plate body by means of suspension springs.
13. The device according to claim 12 , wherein two suspension springs are provided which are arranged in diagonally opposed corner regions of each spring plate section.
14. The device according to claim 11 , wherein each spring plate section comprises centering elements.