Making multi-layer micro-wire structure
A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
1. A method of making a multi-layer micro-wire structure, comprising:
providing a substrate having a surface;
forming a plurality of micro-channels in the substrate;
locating a first material composition in a first layer only in each micro-channel and not on the substrate surface by coating the first material composition over the substrate surface and micro-channels, removing the first material composition from the substrate surface and not the micro-channels, and curing the first material composition into the first layer;
locating a second material composition different from the first material composition in a second layer different from and in contact with the first layer only in each micro-channel and not on the substrate surface by coating the second material composition over the substrate surface, first layer, and micro-channels, removing the second material composition from the substrate surface and not the micro-channels or first layer, and curing the second material composition into the second layer; and
wherein:
the first layer and the second layer have different structures;
the first material composition in the first layer is electrically conductive and the second material composition in the second layer is electrically conductive; and
the first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
2. The method of claim 1 , further including forming the first or second layer with a variable thickness.
3. The method of claim 1 , further including forming the first layer thicker than the second layer.
4. The method of claim 1 , further including forming the first or second layer so that the first layer is not exclusively over or under the second layer or so that the second layer is not exclusively over or under the first layer.
5. The method of claim 1 , further including forming the first layer so that it overlaps or intermingles with the second layer.
6. The method of claim 1 , further including forming the first and second layers in contact over a substantially flat surface.
7. The method of claim 1 , further including forming the first and second layers in contact over a substantially curved surface.
8. The method of claim 1 , further including forming the first and second layers so that the first and second layers do not fill the micro-channels.
9. The method of claim 1 , further including forming the first and second layers so that the first and second layers fill the micro-channels.
10. The method of claim 1 , further including forming the first and second layers so that the first or second layer extends above the substrate surface.
11. A method of making a multi-layer micro-wire structure, comprising:
providing a substrate having a surface;
forming a plurality of micro-channels in the substrate;
locating a first material composition in a first layer only in each micro-channel and not on the substrate surface by coating the first material composition over the substrate surface and micro-channels, removing the first material composition from the substrate surface and not the micro-channels, and curing the first material composition into the first layer;
locating a second material composition different from the first material composition in a second layer different from and in contact with the first layer only in each micro-channel and not on the substrate surface by coating the second material composition over the substrate surface, first layer, and micro-channels, removing the second material composition from the substrate surface and not the micro-channels or first layer, and curing the second material composition into the second layer; and
wherein:
the first layer and the second layer have different material attributes;
the first material composition in the first layer is electrically conductive and the second material composition in the second layer is electrically conductive; and
the first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
12. The method of claim 11 , further including providing the first material composition with two different materials in a first ratio and the second material composition with the same two materials in a second ratio different from the first ratio.
13. The method of claim 11 , further including providing the first material composition with an electrical conductivity that is different from the electrical conductivity of the second material composition.
14. The method of claim 11 , further including providing the first material composition with an optical property that is different from the optical property of the second material composition.
15. The method of claim 14 , wherein the optical property is light-absorption.