Method of manufacturing a component
A method of manufacturing a component using electron beam melting includes providing a powder layer; selectively melting at least a part of the powder layer so as to generate a solid layer of the component using a first electron beam; identifying any defects in the solid layer by scanning the solid layer using a second electron beam; and then repeating these steps at least once so as to build up a shape corresponding to the component. The second electron beam has a lower power than the first electron beam. The method may also include steps of removing any identified defects in the solid layer by using the first electron beam to re-melt at least a part of the solid layer, and adjusting one or more parameters of the selective melting step so as to avoid future recurring defects based on stored data relating to the scanned solid layer.
1. A method of manufacturing a component using electron beam melting comprising:
providing a powder layer;
selectively melting at least a part of the powder layer so as to generate a solid layer of the component using a first electron beam;
identifying any defects in the solid layer by scanning the solid layer using a second electron beam;
removing any identified defects in the solid layer by using the first electron beam to re-melt at least a part of the solid layer; and then
repeating the steps of providing the powder layer, selectively melting at least a part of the powder layer, identifying any defects in the solid layer, and removing any identified defects at least once so as to build up a shape corresponding to the component, wherein
the power of the second electron beam is lower than the power of the first electron beam.
2. A method of manufacturing a component using electron beam melting according to claim 1 , wherein the powder layer is a metal powder layer and the solid layer is a solid metallic layer.
3. A method of manufacturing a component according to claim 1 , wherein the step of identifying defects in the solid layer comprises detecting back scattered electrons generated by the interaction of the second electron beam with the solid layer.
4. A method according to claim 1 , further comprising repeating the step of identifying any defects in the solid layer by re-scanning at least a part of the solid layer using the second electron beam to confirm that the identified defects have been removed.
5. A method of manufacturing a component according to claim 1 , further comprising storing data relating to the layer scanned by the second electron beam.
6. A method of manufacturing a component according to claim 5 , further comprising:
using the stored data to determine whether any defects have been identified at the same position in two or more different solid layers, such defects being recurring defects; and
if any such recurring defects have been identified, adjusting one or more parameters of the selective melting step so as to avoid future recurring defects at that position.
7. A method of manufacturing a component according to claim 1 , further comprising generating an image showing any identified defects in the solid layer.
8. A method of manufacturing a component according to claim 1 , wherein the intensity of the second electron beam is lower than the intensity of the first electron beam.
9. A component manufactured using a method comprising the steps of claim 1 .
10. An additive layer manufacturing machine for manufacturing a component, comprising:
a base plate on which the component is manufactured;
a powder delivery device configured to deliver successive layers of powder onto the baseplate;
an electron beam source configured to generate a first electron beam to selectively melt at least a part of the powder layer so as to produce a solid layer, and to re-melt at least a part of the solid layer to remove any identified defects in the solid layer;
the same or a different electron beam source configured to generate a second electron beam that scans the solid layer; and
a backscatter detector configured to receive backscattered electrons from the surface of the solid layer resulting from the scan by the second electron beam;
a processor configured to identify any defects in the solid layer, and to control the additive layer manufacturing machine to repeat powder layer delivery, selective melting, and identification and removal of defects at least once so as to build up a shape corresponding to the component, wherein:
the second electron beam has a lower power than the first electron beam.
11. An additive layer manufacturing machine according to claim 10 , wherein the electron beam source configured to generate the first electron beam is the same as the electron beam source configured to generate the second electron beam.
12. An additive layer manufacturing machine according to claim 10 , wherein the electron beam source configured to generate the first electron beam is different than the electron beam source configured to generate the second electron beam.
13. An additive layer manufacturing machine according to claim 10 , wherein the intensity of the second electron beam is lower than the intensity of the first electron beam.
14. A component manufactured using the apparatus of claim 10 .
15. A method of manufacturing a component using electron beam melting comprising:
providing a powder layer;
selectively melting at least a part of the powder layer so as to generate a solid layer of the component using a first electron beam;
identifying any defects in the solid layer by scanning the solid layer using a second electron beam;
storing data relating to the solid layer scanned by the second electron beam;
repeating the steps of providing the powder layer, selectively melting at least a part of the powder layer, identifying any defects in the solid layer, and storing the data relating to the scanned solid layer at least once so as to build up a shape corresponding to the component;
using the stored data to determine whether any defects have been identified at the same position in two or more different solid layers, such defects being recurring defects; and
if any such recurring defects have been identified, adjusting one or more parameters of the selective melting step so as to avoid future recurring defects at that position, wherein
the power of the second electron beam is lower than the power of the first electron beam.
16. A method of manufacturing a component using electron beam melting according to claim 15 , wherein the powder layer is a metal powder layer and the solid layer is a solid metallic layer.
17. A method of manufacturing a component according to claim 15 , wherein:
if a defect is identified in the solid layer, the method further comprises making a decision about whether or not to remove any identified defects in the solid layer before providing the next powder layer; and
the decision is based on one or more predetermined criteria.
18. A method of manufacturing a component according to claim 17 , wherein the decision is based at least in part on at least one of the size of the defect, the shape of the defect and the position of the defect.
19. A method of manufacturing a component according to claim 17 , wherein the decision is taken by a machine.
20. A method of manufacturing a component according to claim 17 , wherein the decision is taken by an operator of the machine.