IP Library Granted Patent US 9,879,889
Granted Patent B2
US 9,879,889 · App. 14/338,597 · Granted Jan 30, 2018

Refrigerator appliances with movable individually temperature control bins

Inventor: Keith Wesley Wait (Louisville, KY)
Assignee: Haier US Appliance Solutions, Inc.
F25B21/04F25D25/025F25B2321/021F25D2700/121
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Quick Facts
Patent No.
US 9,879,889
App. No.
14/338,597
Granted
Jan 30, 2018
Kind
B2
Abstract

Refrigerator appliance with movable individually temperature controlled bins are provided. One example refrigerator appliance includes one or more transmitter coils and one or more bins. Each of the one or more bins includes a temperature sensor positioned to read a temperature in a bin storage volume. Each of the one or more bins includes a receiver coil. The receiver coil receives power from one of the one or more transmitter coils through inductive power transfer. Each of the one or more bins includes a thermoelectric heat pump. The thermoelectric heat pump receives power from the receiver coil. The operation of the thermoelectric heat pump is controlled based on the temperature in the bin storage volume read by the temperature sensor, such that the temperature in the bin storage volume is maintained at a setpoint temperature associated with such bin.

Claims (21)

1. A bin for use in a refrigerator appliance, the bin comprising:

a bin body, wherein the bin body defines a bin storage volume;

an adjustable resistance device, wherein the adjustable resistance device provides a first resistance that is adjustable to adjust a setpoint temperature associated with the bin;

a thermistor positioned within the bin storage volume, wherein the thermistor provides a second resistance indicative of a temperature in the bin storage volume;

a receiver coil, wherein the receiver coil is configured to receive power through inductive power transfer from a transmitter coil included in the refrigerator appliance; and

a thermoelectric heat pump, wherein the thermoelectric heat pump receives power from the receiver coil;

a heat pump control circuit configured to control operation of the thermoelectric heat pump in either a heating mode or a cooling mode based, at least in part, on the first resistance and the second resistance, the heat pump comprising:

a voltage divider circuit configured to divide an input voltage to provide a first, second, and third voltage that respectively correspond to a maximum temperature, the setpoint temperature, and a minimum temperature; and

a comparison circuit configured to compare a fourth voltage across the thermistor to each of the first, second, and third voltages to provide an output indicative of whether the thermoelectric heat pump should be operated in the heating mode, the cooling mode, or neither the heating mode nor the cooling mode, the comparison circuit comprising:

a first operational amplifier that compares the fourth voltage to the first voltage;

a second operational amplifier that compares the fourth voltage to the second voltage;

a third operational amplifier that compares the fourth voltage to the third voltage;

a fourth operational amplifier that compares the fourth voltage to the second voltage;

a first flip-flop that respectively receives signals output by the first and second operational amplifiers, wherein a high signal from the first flip-flop indicates that the thermoelectric heat pump should be operated in the cooling mode; and

a second flip-flop that respectively receives signals output by the third and fourth operational amplifiers, wherein a high signal from the second flip-flop indicates that the thermoelectric heat pump should be operated in the heating mode.

2. The bin of claim 1 , wherein the heat pump control circuit further comprises:

an H-bridge driver circuit, wherein the H-bridge driver circuit drives the thermoelectric heat pump in the heating mode, the cooling mode, or neither the heating mode nor the cooling mode based on the output of the comparison circuit.

3. The bin of claim 1 , further comprising a control device that allows a user to adjust the first resistance provided by the adjustable resistance device and thereby adjust the setpoint temperature associated with the bin, wherein the control device is located on an exterior surface of the bin body.

4. The bin of claim 1 , wherein:

the bin body comprises a plurality of panels that define the bin storage volume; and

the thermoelectric heat pump is included in one of the plurality of panels.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2016
From: GENERAL ELECTRIC COMPANY
To: HAIER US APPLIANCE SOLUTIONS, INC.
Reel/Frame 038952/0313 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2014
From: WAIT, KEITH WESLEY
To: GENERAL ELECTRIC COMPANY
Reel/Frame 033372/0784 →
Continuity (1)
Related Publication 20160025388A1 · Jan 28, 2016