Semiconductor device

1. A semiconductor device comprising:

a first transistor unit,

a second transistor unit, and

a third transistor unit that are arranged in this order in a first direction,

wherein each of the first transistor unit, the second transistor unit, and the third transistor unit has a plurality of transistors whose gate electrodes extend in the first direction, and

wherein the semiconductor device further comprises: first wiring that extends, between the first transistor unit and the second transistor unit, in a second direction intersecting with the first direction, and that is coupled to both source electrodes of the transistors in the first transistor unit and source electrodes of the transistors in the second transistor unit; second wiring that is located on a side of the first transistor unit opposite to a side where the first wiring is located, and that extends in the second direction, and that is coupled to drain electrodes of the transistors in the first transistor unit; third wiring that extends, between the second transistor unit and the third transistor unit, in the second direction, and that is coupled to both drain electrodes of the transistors in the second transistor unit and source electrodes of the transistors in the third transistor unit; and fourth wiring that is located on a side of the third transistor unit opposite to a side where the third wiring is located, and that extends in the second direction, and that is coupled to source electrodes of the transistors in the third transistor unit.

2. The semiconductor device according to claim 1 , comprising:

a first upper layer conductive pattern that is provided in a layer above the first wiring, and that is larger than the first wiring in width, and that extends in the second direction;

a first coupling member that couples the first wiring to the first upper layer conductive pattern;

a second upper layer conductive pattern that is provided in a layer above the second wiring, and that is larger than the second wiring in width, and that extends in the second direction;

a second coupling member that couples the second wiring to the second upper layer conductive pattern;

a third upper layer conductive pattern that is provided in a layer above the third wiring, and that is larger than the third wiring in width, and that extends in the second direction;

a third coupling member that couples the third wiring to the third upper conductor pattern;

a fourth upper layer conductive pattern that is provided in a layer above the fourth wiring, and that is larger than the fourth wiring in width, and that extends in the second direction, and

a fourth coupling member that couples the fourth wiring to the fourth upper layer conductive pattern.

3. The semiconductor device according to claim 2 ,

wherein, when viewed planarly: part of the first upper layer conductive pattern is overlapped with the first transistor unit;

the part of the second upper layer conductive pattern is overlapped with at least one of the first transistor unit and the second transistor unit;

the part of the third upper layer conductive pattern is overlapped with at least one of the second transistor unit and the third transistor unit; and

the part of the fourth upper layer conductive pattern is overlapped with the third transistor unit.

4. The semiconductor device according to claim 3 ,

wherein: the part of the second upper layer conductive pattern is overlapped with the first transistor unit; another part of the second upper layer conductive pattern is overlapped with the second transistor unit;

the part of the third upper layer conductive pattern is overlapped with the second transistor unit; and

another part of the second upper layer conductive pattern is overlapped with the third transistor unit.

5. The semiconductor device according to claim 2 , comprising:

a first bonding member that couples the first upper layer conductive pattern to a first external terminal;

a second bonding member that couples the second upper layer conductive pattern to a second external terminal;

a third bonding member that couples the third upper layer conductive pattern to the second external terminal, and

a fourth bonding member that couples the fourth upper layer conductive pattern to the first external terminal.

6. The semiconductor device according to claim 1 , comprising:

a first upper layer conductive pattern and a second upper layer conductive pattern that are provided in a layer above the first wiring, and that are larger than the first wiring, the second wiring, the third wiring, and the fourth wiring in width, and that extend in the first direction, and that are overlapped, when viewed planarly, with the first transistor unit, the second transistor unit, and the third transistor unit;

a first coupling member that couples the first wiring to the first upper layer conductive pattern;

a second coupling member that couples the second wiring to the second upper layer conductive pattern;

a third coupling member that couples the third wiring to the second upper layer conductive pattern, and

a fourth coupling member that couples the fourth wiring to the first upper layer conductive pattern.

7. The semiconductor device according to claim 1 ,

wherein the transistors are ones for power control.

8. The semiconductor device according to claim 1 ,

wherein the channels of the transistors are formed in a compound semiconductor layer.