Printed circuit board made through sintering copper nano-particles
A printed circuit board is formed from a plurality of thinner PCBs stacked on top of each other with an intermediate metal interconnect material selectively positioned between adjacent PCBs. The metal interconnect material is selectively positioned on surface contact points of correspondingly aligned plated through holes on the adjacent printed circuit boards. The stacked printed circuit boards and intermediate metal interconnect material are laminated, thereby sintering the metal interconnect material and the surface contact points of the plated through holes to form electrical interconnects between plated through holes on adjacent printed circuit boards. The metal interconnect material is preferably the same as the plating material used to plate the through holes, such as copper.
1. A printed circuit board comprising;
a. a plurality of printed circuit boards, wherein each printed circuit board comprises one or more layers of non-conducting substrate and conducting material, further wherein each printed circuit board further comprises one or more plated through holes, each plated through hole having a surface contact point on either end; and
b. a metal interconnect material,
wherein the plurality of printed circuit boards are stacked on top of each other such that corresponding plated through holes on each printed circuit board are properly aligned, further wherein the metal interconnect material is positioned between the surface contact points of plated through holes on adjacently stacked printed circuit boards, wherein the plurality of circuit boards are laminated together thereby sintering the metal interconnect material and the surface contact points of the plated through holes.
2. The printed circuit board of claim 1 wherein a given printed circuit board of the plurality of circuit boards has multiple layers, and the multiple layers are laminated together.
3. The printed circuit board of claim 1 wherein the metal interconnect material is a same material as a plating material of the plated through holes.
4. The printed circuit board of claim 3 wherein the metal interconnect material is copper and the plated through holes are plated with copper.
5. The printed circuit board of claim 4 wherein the metal interconnect material is made of copper nano-particles.
6. The printed circuit board of claim 4 wherein the metal interconnect material is made of copper nano-particle ink.
7. The printed circuit board of claim 1 wherein the non-conducting substrate comprises a prepreg material.
8. A printed circuit board comprising;
a. a plurality of printed circuit boards, wherein each printed circuit board comprises one or more layers of non-conducting substrate and conducting material, further wherein each printed circuit board further comprises one or more plated through holes, each plated through hole having a surface contact point on either end;
b. one or more interposers, wherein each interposer comprises one or more interposer plated through holes, each interposer plated through hole having a surface contact point on either end; and
b. a metal interconnect material,
wherein the plurality of printed circuit boards and the one or more interposers are alternatively stacked on top of each other such that corresponding plated through holes on each printed circuit board and interposer plated through holes on each adjacently stacked interposer are properly aligned, further wherein the metal interconnect material is positioned between the surface contact points of plated through holes and the surface contact points on interposer plated through holes on each adjacently stacked printed circuit board and interposer, wherein the plurality of circuit boards and the one or more interposers are laminated together thereby sintering the metal interconnect material, the surface contact points of the plated through holes and the surface contact points of the interposer plated through holes.
9. The printed circuit board of claim 8 wherein a given printed circuit board of the plurality of circuit boards has multiple layers, and the multiple layers are laminated together.
10. The printed circuit board of claim 8 wherein the metal interconnect material is a same material as a plating material of the plated through holes and a plating material of the interposer plated through holes.
11. The printed circuit board of claim 10 wherein the metal interconnect material is copper, the plated through holes are plated with copper and the interposer plated through holes are plated with copper.
12. The printed circuit board of claim 11 wherein the metal interconnect material is made of copper nano-particles.
13. The printed circuit board of claim 11 wherein the metal interconnect material is made of copper nano-particle ink.
14. The printed circuit board of claim 8 wherein the non-conducting substrate comprises a prepreg material.
15. The printed circuit board of claim 8 wherein each interposer comprises a non-conducting substrate.
16. A method of fabricating a printed circuit board, the method comprising:
a. fabricating a plurality of printed circuit boards, wherein each printed circuit board comprises one or more layers of non-conducting substrate and conducting material, further wherein each printed circuit board further comprises one or more plated through holes, each plated through hole having a surface contact point on either end;
b. stacking the plurality of printed circuit boards on top of each other with an intermediate metal interconnect material applied between adjacently stacked printed circuit boards, wherein the plurality of printed circuit boards are stacked such that corresponding plated through holes on each printed circuit board are properly aligned, further wherein the metal interconnect material is positioned between the surface contact points of plated through holes on adjacently stacked printed circuit boards; and
c. laminating the plurality of circuit boards and the one or more interposers together thereby sintering the metal interconnect material and the surface contact points of the plated through holes.
17. The printed circuit board of claim 16 wherein a given printed circuit board of the plurality of circuit boards has multiple layers, and the multiple layers are laminated together.
18. The method of claim 16 wherein the metal interconnect material is a same material as a plating material of the plated through holes.
19. The method of claim 18 wherein the metal interconnect material is copper and the plated through holes are plated with copper.
20. The method of claim 19 wherein the metal interconnect material is made of copper nano-particles.
21. The method of claim 19 wherein the metal interconnect material is made of copper nano-particle ink.
22. The method of claim 16 wherein the non-conducting substrate comprises a prepreg material.
23. A method of fabricating a printed circuit board, the method comprising:
a. fabricating a plurality of printed circuit boards, wherein each printed circuit board comprises one or more layers of non-conducting substrate and conducting material, further wherein each printed circuit board further comprises one or more plated through holes, each plated through hole having a surface contact point on either end;
b. fabricating one or more interposers, wherein each interposer comprises one or more interposer plated through holes, each interposer plated through hole having a surface contact point on either end;
b. alternatively stacking the plurality of printed circuit boards and the one or more interposers on top of each other such that corresponding plated through holes on each printed circuit board and interposer plated through holes on each adjacently stacked interposer are properly aligned, wherein the metal interconnect material is positioned between the surface contact points of plated through holes and the surface contact points on interposer plated through holes on each adjacently stacked printed circuit board and interpose; and
c. laminating the plurality of circuit boards together thereby sintering the metal interconnect material, the surface contact points of the plated through holes and the surface contact points of the interposer plated through holes.
24. The printed circuit board of claim 23 wherein a given printed circuit board of the plurality of circuit boards has multiple layers, and the multiple layers are laminated together.
25. The method of claim 23 wherein the metal interconnect material is a same material as a plating material of the plated through holes.
26. The method of claim 25 wherein the metal interconnect material is copper and the plated through holes are plated with copper.
27. The method of claim 26 wherein the metal interconnect material is made of copper nano-particles.
28. The method of claim 26 wherein the metal interconnect material is made of copper nano-particle ink.
29. The method of claim 23 wherein the non-conducting substrate comprises a prepreg material.
30. The method of claim 23 wherein each interposer comprises a non-conducting substrate.