Silicon-on-insulator substrate and method of manufacturing thereof

1. A method of manufacturing a silicon-on-insulator (SOI) substrate, comprising:

forming a thinning stop layer within a first semiconductor substrate distanced from a first surface of the first semiconductor substrate;

forming an island-shaped insulating layer on a first region of the first surface of the first semiconductor substrate;

forming a silicon epitaxial layer on the first surface of the first semiconductor substrate so as to cover the island-shaped insulating layer and a second region of the first surface of the first semiconductor substrate, wherein the silicon epitaxial layer has a uniform thickness over the first surface of the first semiconductor substrate;

forming a trench by selectively etching the first region of the silicon epitaxial layer so as to expose a portion of the island-shaped insulating layer;

forming a first insulating adhesive layer on the second region of the silicon epitaxial layer and the island-shaped insulating layer,

wherein the first semiconductor substrate has a first thickness of the first surface in the first region that is determined by a distance between the thinning stop layer and the island-shaped insulating layer, and

wherein the first semiconductor substrate has a second thickness of the first surface in the second region that is determined by a sum of the first thickness and the uniform thickness of the silicon epitaxial layer; and

thinning the first semiconductor substrate from a second surface of the first semiconductor substrate, wherein the second surface is on an opposing side of the first surface of the first semiconductor substrate; and wherein the thinning of the first semiconductor substrate includes a coarse grinding process to remove a part of the first semiconductor substrate before reaching the thinning stop layer and a fine grinding process to remove the thinning stop layer.

2. The method of claim 1 , wherein forming the island-shaped insulating layer further comprises:

forming an oxide layer on the first surface of the first semiconductor substrate;

forming a first hard mask layer on the first oxide layer;

etching the oxide layer using the first hard mask layer as an etch mask, so as to remove portions of the oxide layer lying outside the first region; and

removing the first hard mask layer.

3. The method of claim 1 , wherein forming the trench further comprises: optically aligning the first semiconductor substrate, and etching the silicon epitaxial layer using a laser.

4. The method of claim 1 , wherein forming the trench further comprises:

forming a second hard mask layer on a surface of the silicon epitaxial layer;

forming an opening in the second hard mask layer in the first region by removing a portion of the second hard mask layer disposed above the island-shaped insulating layer;

etching the silicon epitaxial layer using the second hard mask layer as an etch mask, so as to form the trench in the silicon epitaxial layer in the first region; and

removing the second hard mask layer.

5. The method of claim 1 , further comprising:

bonding the first semiconductor substrate and a second semiconductor substrate using the first insulating adhesive layer and a second insulating adhesive layer disposed on the second semiconductor substrate, so as to form the SOI substrate.

6. The method of claim 1 , further comprising:

planarizing the first insulating adhesive layer after forming the first insulating adhesive layer.

7. The method of claim 5 , wherein the island-shaped insulating layer, the first insulating adhesive layer, and the second insulating adhesive layer are formed of a same material.

8. The method of claim 1 , wherein forming the thinning stop layer further comprises:

forming a first sacrificial layer on the first surface of the first semiconductor substrate; and

performing ion implantation on the first surface of the first semiconductor substrate, so as to form the thinning stop layer in the first semiconductor substrate.

9. The method of claim 8 , further comprising:

annealing the first semiconductor substrate after performing the ion implantation.

10. The method of claim 1 , wherein at least one corner or edge of the first semiconductor substrate is chamfered.