Mount for semiconductor devices using conformable conductive layers, and method
A mount for semiconductor laser devices comprises thermally conductive anode and cathode blocks on either side of a semiconductor laser device such as a laser diode. Interposed between at least the anode block and the anode of the semiconductor laser device is a sheet of conformable electrically conductive material with high thermal conductivity such as pyrolytic highly-oriented graphite. In some embodiments, a second sheet of such electrically and thermally conductive conformable material is interposed between the cathode of the semiconductor laser device and the cathode block. The semiconductor laser device can be either a single laser diode or a diode bar having a plurality of emitters. A thermally conductive, but electrically insulating, spacer of essentially the same thickness as the laser diode or bar surrounds the diode or bar to prevent mechanical damage while still permitting the conformable material to be maintained in a compressed state and directing current through the laser device.
1. A method for removing heat from a semiconductor diode laser device comprising
positioning a diode laser device having an anode and a cathode between an electrically and thermally conductive anode block and an electrically and thermally conductive cathode block such that the diode laser device is electrically energized when a voltage is applied across the anode block and the cathode block,
interposing at least a first sheet of pyrolytic highly-oriented graphite between at least a portion of space between the anode block and the cathode block not occupied by the laser diode device,
electrically isolating the anode block from the cathode block except where the laser device contacts each block, and
compressing the first sheet so that it is maintained compressed about thirty-five percent.