Apparatus and Methods of forming Molded Parts
An apparatus including a first molded part including a plurality of protrusions; and a second molded part, molded at least to the plurality of protrusions of the first molded part, the second molded part including an antenna configured to resonate at radio frequencies.
1 . An apparatus comprising:
a first molded part including a plurality of protrusions; and
a second molded part, molded at least to the plurality of protrusions of the first molded part, the second molded part including an antenna configured to resonate at radio frequencies.
2 . An apparatus as claimed in claim 1 , wherein the first molded part defines a cavity and the plurality of protrusions are positioned within the cavity, the second molded part at least partially occupies the cavity.
3 . An apparatus as claimed in claim 1 , wherein the plurality of protrusions comprise ribs extending along a longitudinal axis of the first molded part.
4 . An apparatus as claimed in claim 3 , wherein the cavity defines an upper surface and a lower surface, and a first subset of the plurality of protrusions extend perpendicularly from the upper surface and a second subset of the plurality of protrusions extend from the lower surface.
5 . An apparatus as claimed in claim 1 , wherein the antenna includes a feed point configured to couple to radio frequency circuitry.
6 . An apparatus as claimed in claim 1 , wherein the antenna includes a ground point configured to couple to a ground member.
7 . An apparatus as claimed in claim 1 , wherein the antenna is defined on one or more surfaces of the second molded part.
8 . An apparatus as claimed in claim 7 , wherein the antenna is formed by laser direct structuring.
9 . An apparatus as claimed in claim 1 , wherein the second molded part comprises a plateable plastic and the antenna is plated on the plateable plastic.
10 . An apparatus as claimed in claim 1 , wherein the first molded part includes one or more sink marks, and the second molded part at least partially occupies the one or more sink marks, the second molded part having substantially no sink marks.
11 . An electronic device comprising an apparatus as claimed in claim 1 .
12 . A method comprising:
molding a first molded part including a plurality of protrusions; and
molding a second molded part at least to the plurality of protrusions of the first molded part, the second molded part including an antenna configured to resonate at radio frequencies.
13 . A method as claimed in claim 12 , wherein the first molded part defines a cavity and the plurality of protrusions are positioned within the cavity, the second molded part at least partially occupies the cavity.
14 . A method as claimed in claim 12 , wherein the plurality of protrusions comprise ribs extending along a longitudinal axis of the first molded part.
15 . A method as claimed in claim 14 , wherein the cavity defines an upper surface and a lower surface, and a first subset of the plurality of protrusions extend from the upper surface and a second subset of the plurality of protrusions extend from the lower surface.
16 . A method as claimed in claim 12 , wherein the antenna includes a feed point configured to couple to radio frequency circuitry.
17 . (canceled)
18 . A method as claimed in claim 12 , wherein the antenna is defined on one or more surfaces of the second molded part.
19 . A method as claimed in claim 18 , wherein the antenna is formed by laser direct structuring.
20 . A method as claimed in claim 12 , wherein the second molded part comprises a plateable plastic and the antenna is plated on the plateable plastic.
21 . A method as claimed in claim 12 , wherein the first molded part includes one or more sink marks, and the second molded part at least partially occupies the one or more sink marks, the second molded part having substantially no sink marks.