Device and method for cooling a unit
View Patent ↗The present invention relates to a method and a device ( 1 ) for cooling an arrangement ( 2 ) using a cold head ( 3 ), with a thermal cooling of the unit ( 2 ) to be cooled by means of the thermosiphon principle. At the same time, heat is conducted via a mechanical heat bridge ( 5 ), which provides a direct thermal connection from the cold head ( 3 ) to the unit ( 2 ) to be cooled.
1. A method, comprising:
cooling a unit via a cold head of a refrigeration machine thermally connected to the unit via a thermosiphon;
conducting heat at a same time via a mechanical heat bridge which provides a direct thermal connection from the cold head to the unit, with the unit to be cooled directly connected to one side of the mechanical heat bridge and the cold head directly connected to the opposite side of the mechanical heat bridge such that the mechanical heat bridge is not directly in contact with the thermosiphon, wherein the mechanical heat bridge has a configuration which is rail-shaped, band-shaped, or a combination thereof and is rigidly connected to the unit, and
using metal for the entire mechanical heat bridge.
2. The method of claim 1 , further comprising thermally contacting a condenser with the cold head, condensing gaseous fluid at the condenser, transporting the fluid in liquid form to the unit, and passing the fluid into a gaseous state by absorbing a quantity of heat on or adjacent to the unit.
3. The method of claim 2 , wherein the fluid is neon, helium or nitrogen.
4. The method of claim 2 , further comprising keeping the cold head at a temperature which is greater than a boiling temperature of the fluid when the unit is cooled down by way of the heat bridge, wherein cooling of the unit takes place essentially by the thermosiphon when the boiling temperature of the fluid is reached.
5. The method of claim 1 , wherein the metal is copper.
6. A device for cooling a unit, comprising:
a cold head of a refrigeration machine;
a thermosiphon configured for thermally connecting the cold head to the unit; and
a mechanical heat bridge configured to directly thermally connect the cold head to the unit, with the unit to be cooled directly connected to one side of the mechanical heat bridge and the cold head directly connected to the opposite side of the mechanical heat bridge such that the mechanical heat bridge is not directly in contact with the thermosiphon, wherein the mechanical heat bridge is rail-shaped or band-shaped or both and is rigidly connected to the unit,
wherein the mechanical heat bridge is entirely made of metal.
7. The device of claim 6 , further comprising a condenser in thermal contact with the cold head for condensing gaseous fluid on the condenser, said condenser including the thermosiphon for transporting liquid fluid to the unit and transporting the gaseous fluid from the unit to the condenser.
8. The device of claim 6 , wherein the fluid is neon, helium or nitrogen.
9. The device of claim 7 , wherein the cold head is kept at a temperature which is greater than a boiling temperature of the fluid when the unit is cooled down by the heat bridge, said cold head being essentially at a same temperature as the unit via the thermosiphon when the unit has a temperature which equates to the boiling temperature of the fluid.
10. The device of claim 6 , wherein the metal is copper.
11. The device of claim 6 , wherein the unit includes a superconductor.
12. The device of claim 11 , wherein the superconductor is configured in the form of at least one superconducting coil.