ELECTRIC MULTILAYER PRINTED CIRCUIT BOARD
The invention relates to an electric multilayer printed circuit board which satisfies the PICMG specification EXP.O, comprising a first signal layer and a second signal layer. The first signal layer comprises at least one first conductive path ( 33 ) and a first shielding region. The second signal layer comprises at least one second conductive path ( 43 ) and a second shielding region. The at least one first conductive path ( 33 ) and the at least one second conductive path ( 34 ) can be arranged such that the paths cross in at least one crossing point K. The first conductive path ( 33 ) is arranged adjacently to the second shielding region at each point where the first conductive path does not cross a second conductive path ( 43 ), and each second conductive path ( 43 ) is arranged adjacently to the first shielding region at each point where the second conductive path does not cross a conductive path ( 33 ).
1 . An electric multilayer printed circuit board, comprising a first signal layer ( 3 ) and a second signal layer ( 4 ), wherein
the first signal layer ( 3 ) comprises at least one first conductive path ( 33 ) and one first shielding region ( 32 ), and
the second signal layer ( 4 ) comprises at least one second conductive path ( 43 ) and one second shielding region ( 42 ), wherein the at least one first conductive path ( 33 ) and the at least one second conductive path ( 43 ) can be arranged in such a way that they cross each other in at least one crossing point (K), and wherein each first conductive path ( 33 ) is arranged adjacent to the second shielding region ( 42 ) in each point where it does not cross with a second conductive path ( 43 ), and each second conductive path ( 43 ) is arranged adjacent to the first shielding region 43 ) in each point where it does not cross with a first conductive path ( 33 ).
2 . An electric multilayer printed circuit board according to claim 1 , wherein each first conductive path ( 33 ) is arranged above the second shielding region ( 42 ) in each point where it does not cross with a second conductive path ( 43 ), and each second conductive path ( 43 ) is arranged above the first shielding region ( 32 ) in each point where it does not cross with a first conductive path ( 33 ).
3 . An electric multilayer printed circuit board according to claim 1 , wherein the first signal layer ( 3 ) and the second signal layer ( 4 ) are arranged between a first shielding layer ( 2 ) and a second shielding layer ( 5 ).
4 . An electric multilayer printed circuit board according to claim 3 , wherein the distance between the first signal layer and the second signal layer is greater than the distance between the first signal layer and the first shielding layer, and the distance between the first signal layer and the second signal layer is greater than the distance between the second signal layer and the second shielding layer.
5 . An electric multilayer printed circuit board according to claim 3 , wherein it comprises a third signal layer ( 6 ) which is arranged between the second shielding layer ( 5 ) and a third shielding layer ( 7 ), and comprises at least one third conductive path ( 63 a, 63 b ).
6 . An electric multilayer printed circuit board according to claim 5 , wherein it comprises several third conductive paths ( 63 a, 63 b ) and the third conductive paths ( 63 a, 63 b ) do not cross each other.
7 . An electric multilayer printed circuit board according to claim 1 , wherein two respective conductive paths of a pair of conductive paths ( 33 , 43 , 63 a, 63 b ) are arranged in each signal layer ( 3 , 4 , 6 ) at a distance of a maximum of 300 μm.
8 . An electric multilayer printed circuit board according to claim 1 , wherein the conductive paths ( 33 , 43 , 63 a, 63 b ) have a structural width of a maximum of 250 μm.
9 . An electric multilayer printed circuit board according to claim 1 , wherein the thickness of the signal layers ( 3 , 4 , 6 ) and the shielding layers ( 2 , 5 , 7 ) respectively lie in the range of 5 μm to 70 μm.
10 . An electric multilayer printed circuit board according to claim 1 , wherein all conductive paths which are situated in a common pair of conductive paths ( 33 , 43 , 63 a , 63 b ) have the same length.
11 . An electric multilayer printed circuit board according to claim 10 , wherein all conductive paths ( 33 , 43 , 63 a, 63 b ) which are situated in the same signal layer ( 3 , 6 ) have the same length.
12 . An electric multilayer printed circuit board according to claim 11 , wherein all conductive paths ( 33 , 43 , 63 a, 63 b ) of the electric multilayer printed circuit board have the same length.