Composition for forming electronic paper without particle freezing, and adhesive film prepared thereby
Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a material comprising a UV curable polymer resin composition or a UV transmitting polymer resin composition; and (b) a tack-free adhesive layer formed with a material comprising a UV curable polymer resin. The sealing film has excellent sealing properties and is tack-free at room temperature, and thus it is possible to minimize freezing of electrostatic particles inside a microcup sticking to the surface of a sealing material during manipulation thereof.
1. A composition for forming an adhesive film for microcup type electronic paper comprising:
(a) a thiol compound-containing free radical polymerizable composition and
(b) a cation-initiated polymerizable composition comprising
an epoxy compound having a softening point of less than 90° C. and
wherein the (a) thiol compound-containing free radical polymerizable composition and the (b) cation-initiated polymerizable composition are present in a weight ratio ranging from 1:0.1 to 1:9.0, respectively.
2. The composition according to claim 1 , wherein, in the (a) thiol compound-containing free radical polymerizable composition, the polyene compound has at least two carbon-carbon double bonds.
3. The composition according to claim 1 , wherein the thiol compound is a polythiol compound having at least two —SH functional groups.
4. The composition according to claim 1 , wherein the thiol compound comprises at least one selected from among bis(mercaptomethyl)-1,4-dithiane, bis(mercaptoethyl)sulfide, bis(mercaptoethyl)disulfide, 1,2-bis(mercaptoethyl)thio-3-mercaptopropane, pentaerythritol tetrakismercaptoacetate, pentaerythritol tetrakis(3-mercaptopropionate), trimethylolpropane trismercaptoacetate, trimethylolpropane trismercaptopropionate and trimercaptopropane, and tris[(3-mercaptopropionyloxy)-ethyl]isocyanurate.
5. The composition according to claim 2 , wherein the polyene compound comprises at least one selected from among triallyl isocyanurate, diallyl adipate, diallyl phthalate, glycerin diallyl ether, trimethylolpropane diallyl ether, pentaerythritol, and diallyl ether, which are allyl alcohol derivatives.
6. The composition according to claim 2 , wherein the thermal initiator comprises at least one selected from among azo, peroxide, persulfate, and oxidation-reduction compounds.
7. The composition according to claim 2 , wherein the (a) thiol compound-containing free radical polymerizable composition comprises 10 parts by weight to 90 parts by weight of the thiol compound and 90 parts by weight to 10 parts by weight of the polyene compound based on 100 parts by weight of the (a) thiol compound-containing free radical polymerizable composition, and 0.1 parts by weight to 10 parts by weight of the thermal initiator based on 100 parts by weight of a mixture of the thiol and polyene compounds.
8. The composition according to claim 1 , wherein the cationic polymerization initiator is an aromatic iodonium or sulfonium salt containing a metal halide anion.
9. The composition according to claim 8 , wherein the metal halide anion comprises at least one selected from among BF 4 − , PF 6 − , AsF 6 − , and SbF 6 − .
10. The composition according to claim 1 , wherein the (b) cation-initiated polymerizable composition comprises 0.1 parts by weight to 10 parts by weight of the cationic polymerization initiator based on 100 parts by weight of the epoxy compound.
11. An adhesive film for electronic paper comprising an adhesive layer formed thereon, the adhesive layer comprising the composition according to claim 1 .